Abstract:
A method and a system for enhancing lithographic alignment are provided to obtain an improved alignment system and an improved method of a lithography system. A substrate preparing process is performed to prepare a lower alignment mark structure for defining a lower trench region on a substrate(411). An applying process is performed to apply a hard mask coating having a top surface on the substrate. An exposing process is performed to expose parts of the hard mask coating to a dose of radiation in order to raise a top surface region of the hard mask coating located on the lower trench region in the lower alignment mark structure. As a result, the top surface region is higher than parts of the top surface adjacent to the top surface region of the hard mask coating. The hard mask coating is formed of amorphous carbon.
Abstract:
A method and a system for enhanced lithographic patterning are provided to print a pattern having a feature interval less than a printable minimum interval within a hard mask by using a single exposure method. A patterned radiation beam is applied to a hard mask layer provided on a substrate. First parts of the hard mask layer are exposed by using a first dose of radiation necessary for enhancing etch characteristics of the first parts from the patterned radiation beam. Second parts different from the first parts of the hard mask layer are exposed by using a second dose of radiation necessary for enhancing etch characteristics of the second parts from the patterned radiation beam. An etch process for the hard mask layer is performed. The first parts and the second parts are removed. Parts of the hard mask layer except the first and second parts are not damaged.
Abstract:
PROBLEM TO BE SOLVED: To provide a product with an alignment mark that enables spatially varying reflective properties by using a pattern of fine lines for different polarization components for radiation of selectable orders of diffraction. SOLUTION: The position of a product is measured by using an alignment mark on the product. Radiation is transmitted toward the alignment mark and diffracted by a pattern in the alignment mark. Position information is determined from phase relations of the diffracted radiation. The alignment mark includes a set of mutually parallel conductor tracks from which the diffracted radiation is collected, and the pattern is determined by a pattern in which the pitch between successive tracks is varied as a function of position along the surface of the product. Thus, for example, the pattern includes alternating first and second areas having a first pitch value and a second pitch value respectively. Because the tracks in different parts of the pattern, such as the first and second areas, are parallel to each other, improved measurements are possible. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a mark for positioning capable of reducing the space of a scribe lane and of utilizing the space of a substrate more efficiently. SOLUTION: The mark for positioning to be used for the substrate consists of the periodic 2-dimensional array of a structure. The spacing of the structure is smaller than an alignment beam, but is larger than an exposure beam. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a metrological method capable of measuring particularly CD and overlay among a number of parameters by using a sensor of a type normally used for position measurements in a lithographic apparatus itself.SOLUTION: A pattern includes first and second sub-patterns 312 and 316, mutually adjacently positioned on a substrate, and having a first and a second periodicity respectively. The pattern is observed and a combined signal is obtained, which contains a beat component having a third periodicity at a frequency lower than frequencies of the first and the second periodicity. A measured value of lithographic process performance is obtained by referring to a phase of the beat component. The measurement can be carried out by using an existing alignment sensor of a lithographic apparatus. Sensitivity and accuracy of the measurement can be adjusted by selection of the first and the second periodicity, and therefore the third periodicity.
Abstract:
PROBLEM TO BE SOLVED: To produce an alignment that has a good alignment capability.SOLUTION: A method of production of alignment marks uses a self-aligned double patterning process. An alignment mark pattern is provided with first and second sub-segmented elements. After selecting a dipolar illumination orientation, dipole-X is used to illuminate a pattern and to image first elements on a wafer, but not second elements. Alternatively, dipole-Y is used to illuminate the pattern and to image the second elements on the wafer, but not the first elements. In either case, self-aligned double patterning processing may then be performed to produce product-like alignment marks with high contrast and wafer quality (WQ). Subsequently the X and Y alignment marks thus produced are used for the step of alignment in a lithographic process.
Abstract:
PROBLEM TO BE SOLVED: To provide a firmer, simpler and cheaper method for deflecting a diffracted alignment beam. SOLUTION: An alignment tool illuminates an alignment mark P1 on a substrate W with an alignment beam, and measures a reflection spectrum. The reflection spectrum is compared with reference marks G91, G93, and G96 to determine presence or absence of a misalignment. A brazed sub-wavelength grating 10 is used to deflect sub-beams created by diffracting the alignment beam from the alignment mark P1 onto the reference marks G91, G93, and G96. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To form an alignment mark that can be used for determining multiple exposure alignment.SOLUTION: The alignment mark includes: a first alignment pattern 2 that is projected during a first exposure; a second alignment pattern 4 that is projected during a second exposure; a first sub-mark at least partially defined by a first alignment pattern; and a second sub-mark that is at least partially defined by a second alignment pattern. The relative position between an image line of the first alignment pattern of at least one of sub-marks 7, 8, and an image line of the second alignment pattern, shows the alignment between the first exposure and second exposure at a microlevel.
Abstract:
PROBLEM TO BE SOLVED: To provide a plurality of features provided by a single exposing process and characterized by an about half interval to a hard mask using a single hard mask etching process and without a photoresist treatment for defining the hard mask. SOLUTION: This system and process is a double patterning system and process using a carbon-based hard mask. This double patterning system provides a means for forming a hard mask feature with a feature interval less than a minimum interval with which the hard mask can be printed according to a single exposure, by of a single hard mask etching process. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To apply a two-dimensional photonic crystal to an alignment device. SOLUTION: An alignment mark for use on a substrate has a structure of a periodical two-dimensional array. An interval between lines of the array of the structure is smaller than the size of an alignment radiation beam, but larger than an exposure beam, and width of the lines is sinusoidally changed from one end to the other end of the array. COPYRIGHT: (C)2007,JPO&INPIT