Abstract:
A method and a system for enhanced lithographic patterning are provided to print a pattern having a feature interval less than a printable minimum interval within a hard mask by using a single exposure method. A patterned radiation beam is applied to a hard mask layer provided on a substrate. First parts of the hard mask layer are exposed by using a first dose of radiation necessary for enhancing etch characteristics of the first parts from the patterned radiation beam. Second parts different from the first parts of the hard mask layer are exposed by using a second dose of radiation necessary for enhancing etch characteristics of the second parts from the patterned radiation beam. An etch process for the hard mask layer is performed. The first parts and the second parts are removed. Parts of the hard mask layer except the first and second parts are not damaged.
Abstract:
PROBLEM TO BE SOLVED: To provide a plurality of features provided by a single exposing process and characterized by an about half interval to a hard mask using a single hard mask etching process and without a photoresist treatment for defining the hard mask. SOLUTION: This system and process is a double patterning system and process using a carbon-based hard mask. This double patterning system provides a means for forming a hard mask feature with a feature interval less than a minimum interval with which the hard mask can be printed according to a single exposure, by of a single hard mask etching process. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a product with an alignment mark that enables spatially varying reflective properties by using a pattern of fine lines for different polarization components for radiation of selectable orders of diffraction. SOLUTION: The position of a product is measured by using an alignment mark on the product. Radiation is transmitted toward the alignment mark and diffracted by a pattern in the alignment mark. Position information is determined from phase relations of the diffracted radiation. The alignment mark includes a set of mutually parallel conductor tracks from which the diffracted radiation is collected, and the pattern is determined by a pattern in which the pitch between successive tracks is varied as a function of position along the surface of the product. Thus, for example, the pattern includes alternating first and second areas having a first pitch value and a second pitch value respectively. Because the tracks in different parts of the pattern, such as the first and second areas, are parallel to each other, improved measurements are possible. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a marker structure on a substrate for optical alignment of the substrate including a plurality of first structural elements and a plurality of second structural elements. SOLUTION: For use, the marker structure enables optical alignment by providing at least one light beam directed on the marker structure, detecting light received from the marker structure via a sensor, and obtaining alignment information from the detected light, the alignment information including information relating a substrate position to the sensor. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a marker structure that allows correction of a phase depth in such a way that negative interference within a diffraction pattern is prevented, a lithographic projection device provided with such a marker structure for lithography, and a method of aligning a substrate using such a marker structure for lithography. SOLUTION: The marker structure is characterized in that: a first structural element has a first reflecting surface on a first level; a second structural element is substantially non-reflecting; a second reflecting surface is disposed on a second level lower than the first level, wherein a separation between the first and second reflecting surfaces determines a phase depth condition for the detected light; and recesses R1, R2, R3 are provided in the second reflecting surface; thereby modifying the phase depth condition. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an improved lithographic apparatus in which at least one of the disadvantages in the conventional techniques has been removed or alleviated. SOLUTION: A substrate stage of an immersion-type lithographic apparatus configured to project a patterned radiation beam from a patterning device onto a substrate is provided to hold the substrate and comprises at least one sensor for sensing the patterned radiation beam. The sensor includes, at least a partially transmissive layer having a front surface facing the incoming radiation beam and a back surface opposite to the front surface, and the back surface is provided with at least one sensor mark to be exposed to the radiation beam passing through the transmissive layer. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an arrangement of an alignment mark that has improved compatibility with extreme dipolar illumination settings and also with less extreme settings to be used in the other patterning step during lithography processing. SOLUTION: An alignment mark on a substrate includes a periodic arrangement of a plurality of first elements and a plurality of second elements. The elements are arranged in an alternating repetitive sequence in a first direction. An overall pitch of the periodic arrangement is equal to a sum of a width of the first element and a width of the second element in the first direction. Each first element has a first periodic sub-arrangement with a first sub-pitch and each second element has a second periodic sub-arrangement with second sub-pitch. An optical property of the first element for interaction with a beam of radiation having a wavelength λ is different from the optical property of the second element. The overall pitch is larger than the wavelength λ, and each of the first and the second sub-pitch is smaller than the wavelength. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a marker structure on a substrate for optical alignment of the substrate, wherein the marker structure comprises a plurality of first structural elements and a plurality of second structural elements. SOLUTION: In using the marker structure, the optical alignment is performed by; providing at least one light beam directed to the marker structure; detecting the light received from the marker structure by a sensor; and determining alignment information from the detected light, wherein the alignment information includes information relating a position of the substrate to the sensor. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
Marker structure on a substrate for optical alignment of said substrate, said marker structure comprising a plurality of first structural elements and a plurality of second structural elements, in use said marker structure allowing said optical alignment based upon providing at least one light beam directed on said marker structure, - detecting light received from said marker structure at a sensor, - determining alignment information from said detected light, said alignment information comprising information relating a position of said substrate to said sensor.