Abstract:
A method and a system for enhancing lithographic alignment are provided to obtain an improved alignment system and an improved method of a lithography system. A substrate preparing process is performed to prepare a lower alignment mark structure for defining a lower trench region on a substrate(411). An applying process is performed to apply a hard mask coating having a top surface on the substrate. An exposing process is performed to expose parts of the hard mask coating to a dose of radiation in order to raise a top surface region of the hard mask coating located on the lower trench region in the lower alignment mark structure. As a result, the top surface region is higher than parts of the top surface adjacent to the top surface region of the hard mask coating. The hard mask coating is formed of amorphous carbon.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a marker structure including line elements and trench elements arranged in order repeatedly. SOLUTION: The method includes a step for filling the trench element with silicon dioxide and flattening the marker structure. A sacrifice oxide layer is caused to grow on the surface of a semiconductor, a first subset of line elements is exposed to ion injection beams including dopant seeds, the first subset it doped, and its etching rate is varied. The dopant seed is activated by annealing the substrate, the sacrifice oxide layer is removed by etching the substrate surface, the first subset is set to the height of a first level, and a topology is formed such that the first subset has the first level different from a second level of the marker structure surface part different from the first subset. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a marker structure including line elements and trench elements that are arranged sequentially and repeatedly. SOLUTION: The method includes a step of filling trench elements with a silicon dioxide to level the marker structure. A sacrificial oxide layer is grown on the surface of a semiconductor. A first subset of the line elements is exposed to an ion implantation beam including a dopant species to dope and change an etching rate of the first subset. The substrate is annealed to activate the dopant species, and the semiconductor surface is etched to remove the sacrificial oxide layer and to level the first subset to a first level and to create a topology such that the first subset has a first level differing from a second level of a suface portion of the marker structure different from the first subset. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for protecting and reproducing an alignment mark. SOLUTION: A part of a hard mask 414 located above a lower structure of an alignment mark 401 is selectively exposed with a predetermined exposure dose. The surface region 421 of hard mask coating on which this quantity of radiation has been irradiated rises above other regions on the surface of the hard mask. The elevated region 416 of the hard mask is formed in a corresponding location to the trench 406 of the lower layer alignment mark 401, and this elevated region 416 becomes a new alignment mark where the horizontal position of the lower layer alignment mark 401 is stored. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide the method of measuring information provided by a substrate. SOLUTION: This substrate comprises feature formed by lithography equipment. This method comprises the steps of projecting light beam on a marker arranged in upper part of and/or near the feature on the substrate, and detecting information provided by this marker using a sensor. Coating is arranged on the substrate. Therefore, when this coating is between the light beam and the feature, the light beam is protected from substantially becoming cause of reading incorrectly information provided by the marker by being reflected. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
A method for measuring information provided by a substrate (W) is disclosed. The substrate (W) includes a feature (300) that has been created by a lithographic apparatus. The method includes projecting a beam of light (100) onto a marker (200) disposed above and/or near the feature (300) on the substrate (W), and detecting information provided by the marker (200) with a sensor. A coating (330) is disposed on the substrate (W) so that the coating (330) lies between the beam of light (100) and the feature (300) to substantially prevent the beam of light (100) from being reflected by the feature (300) and causing an inaccurate readout of the information provided by the marker (200).