Abstract:
PROBLEM TO BE SOLVED: To provide a device manufacturing method, a lithography device, and a device manufactured by the method. SOLUTION: The device manufacturing method is disclosed wherein a substrate W is provided, a projection beam of radiation PB is provided using an illumination system IL, a patterning means MA is used to impart the projection beam PB with a pattern in its cross section, the patterned beam of radiation PB is projected subsequently to a number of outer target portions CO of the substrate W before the patterned beam is projected to inner target portion CI of the substrate W, wherein each subsequent outer target portion COi+1 is spaced-apart from the outer target portion COi preceding that subsequent outer target portion COi+1. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To obtain a chuck from which a substrate can be removed easily immediately after the potential difference between electrodes is removed and, in addition, which can prevent undesirable changes of position caused by thermal changes due to its low coefficient of thermal expansion. SOLUTION: The chuck is constituted to include at least a first dielectric element 11 having a specific resistance of 10 16 Ωcm and a coefficient of thermal expansion of -6 K -1 . COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method of effectively compensating for a positional shift including a tilt between a substrate and a supporting structure and a vertical displacement when moving the substrate in a lithographic projection apparatus using the supporting structure. SOLUTION: By providing compliant parts (14, 26) in the supporting structure for holding and moving a substrate (W), for example, a supporting frame (18) of a robot arm (10) adaptable to the tilt and/or the vertical displacement. Clamps (20, 22, 24) that the supporting frame (18) comprises may be a Johnson-Raybeck effect type clamp that requires a stringent positional precision, and the cleaning of the inside of the projection apparatus is carried out by using only one substrate. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method capable of effectively compensating an inclination between a substrate and a support structure or a misregistration including a displacement in the vertical direction when the substrate is moved by the support structure in a lithographic projection apparatus. SOLUTION: By providing a support structure for holding and moving a substrate (W), for example, flexible sections (14, 26) in a support frame (18) of a robot arm (10), it can be adapted to the tilt and/or a displacement in the vertical direction. Clamps (20, 22, 24) provided on the support frame (18) may be a Johnson-Raybeck effect type clamp, which requires the severe position accuracy, and can perform a cleaning treatment in a projection apparatus by only one substrate. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a device manufacturing method, a lithographic apparatus, and a device manufactured by it. SOLUTION: The device manufacturing method includes the steps of supplying a substrate W, supplying a projection radiation beam PB by using an illumination system IL, using a patterning means MA so as to furnish a pattern to a cross-section of the projection beam PB, sequentially projecting the patterned radiation beam PB to some external target parts CO of the substrate W, prior to projecting the beam on an internal target part CI of the substrate W, and separating each of the continuous external target parts CO i+1 , by spaces from external target parts CO i that precede the continuous external parts CO i+1 . COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation:要解决的问题:提供一种器件制造方法,光刻设备及其制造的器件。 解决方案:器件制造方法包括以下步骤:使用图案形成装置MA提供衬底W,通过使用照明系统IL提供投影辐射束PB,以便向突起的横截面提供图案 在将光束投射到基板W的内部目标部分CI之前,将图案化的辐射束PB顺序地投影到基板W的一些外部目标部分CO,并且分离连续的外部目标部分CO i + 1 SB>,在外连续的外部部分CO i + 1之前的外部目标部分CO i SB>之间。 版权所有(C)2005,JPO&NCIPI
Abstract:
A lithographic apparatus is disclosed. The lithographic apparatus includes an illumination system for providing a beam of radiation on a flat article to be placed in a beam path of the beam of radiation, and an article handler for handling the article during placement or removal of the article. The article handler includes an electrode and a dielectric layer in order to form an electrostatic clamp for electrostatically clamping the article.
Abstract:
A method for joining at least two members of a lithographic apparatus is disclosed. The method includes providing a first member (1), providing a second member (2), direct-bonding the first member and the second member to form a direct-bond, and anodically bonding the first member and the second member. At least one of the members includes ultra low expansion glass and/or ultra low expansion glass ceramics.
Abstract:
A device manufacturing method, wherein a substrate (W) is provided, wherein a projection beam of radiation (PB) is provided using an illumination system (IL), wherein patterning means (MA) are used to impart the projection beam (PB) with a pattern in its cross-section, wherein the patterned beam of radiation (PB) is projected subsequently onto a number outer target portions (CO) of the substrate (W) before the patterned beam is projected onto inner target portions (CI) of the substrate (W), wherein each subsequent outer target portion (CO i+1 ) is spaced-apart from the outer target portion (COi) preceding that subsequent outer target portion (CO i+1 ).
Abstract:
A device manufacturing method, wherein a substrate (W) is provided, wherein a projection beam of radiation (PB) is provided using an illumination system (IL), wherein patterning means (MA) are used to impart the projection beam (PB) with a pattern in its cross-section, wherein the patterned beam of radiation (PB) is projected subsequently onto a number outer target portions (CO) of the substrate (W) before the patterned beam is projected onto inner target portions (CI) of the substrate (W), wherein each subsequent outer target portion (CO i+1 ) is spaced-apart from the outer target portion (COi) preceding that subsequent outer target portion (CO i+1 ).