Abstract:
PROBLEM TO BE SOLVED: To provide systems and methods for performing model-based tuning and performance optimization of multiple lithography systems.SOLUTION: A model of a target scanner is maintained defining sensitivity of the target scanner with reference to a set of tunable parameters. A differential model represents deviations of the target scanner from the reference. The target scanner may be tuned based on the settings of the reference scanner and the differential model. Performance of a family of related scanners may be characterized relatively to the performance of the reference scanner. The differential model may include information such as parametric offsets and other differences that may be used to simulate the difference in imaging behavior.
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatuses and processes, and more particularly to multiple patterning lithography for printing target patterns beyond the limits of resolution of the lithographic apparatus, in which a method of splitting a pattern to be imaged onto a substrate via a lithographic process into a plurality of sub-patterns is disclosed.SOLUTION: The method comprises a splitting step which is configured to be aware of requirements of a co-optimization between at least one of the sub-patterns and an optical setting of the lithography apparatus used for the lithographic process. Device characteristic optimization techniques, including intelligent pattern selection based on diffraction signature analysis, may be integrated into the multiple patterning process flow.
Abstract:
PROBLEM TO BE SOLVED: To optimize a lithographic apparatus and an illumination light source for process, and a projection optical system.SOLUTION: In a method of verifying the characteristics of a lithography projection apparatus for a reference lithography projection apparatus, optimization of the characteristics of a projection optical system is included in the verification. In order to shape the wave front of the lithography projection apparatus, projection optical components may be used. The method can be accelerated by using a linear fit algorithm, or the Taylor series expansion using partial derivative of a transmission cross coefficient (TCC).
Abstract:
PROBLEM TO BE SOLVED: To provide a method of simulating imaging performance of a lithographic process utilized to image a target design having a plurality of features.SOLUTION: The method includes the steps of: determining a function for generating a simulated image, where the function accounts for process variations associated with the lithographic process; and generating the simulated image utilizing the function, where the simulated image represents an imaging result of the target design for the lithographic process. In one given embodiment, the function for simulating spatial images with focus and dose (exposure) variations is defined as the following equation, where Irepresents image intensity at nominal focus and exposure, frepresents nominal focus, f and ε represent actual focus-exposure levels at which the simulated image is calculated, and parameters "a" and "b" represent first order and second order derivative images with respect to focus change.
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a system for designing gage patterns having extremely high sensitivity to variations of parameters and having robustness to random and repetitive measurement errors in calibration of a lithography process imaging target designs having a plurality of features.SOLUTION: The method is capable of including distinguishing combinations of line width/pitch with the highest sensitivity and the optimal assist feature arrangement, which may result in changes of high CD with the highest sensitivity to variations of lithography process parameters such as variations of wave front aberration parameters (or other lithography response parameters). The method is also capable of including designing a gage having a plurality of test patterns for adjusting combination response of the gage for producing a specific response to parameters of wave front related or other lithography process parameters. The sensitivity to variations of parameters may result in robust performance to random measurement errors and/or any other measurement errors.
Abstract:
PROBLEM TO BE SOLVED: To improve/optimize projection optics in a lithographic projection apparatus.SOLUTION: Methods for matching the characteristics of a lithographic projection apparatus to a reference lithographic projection apparatus are described, where the matching comprises a step of optimizing illumination source and projection optics characteristics. The projection optics can be used to shape a wavefront in the lithographic projection apparatus. According to embodiments, the methods can be accelerated by using a linear fitting algorithm or using a Taylor series expansion using partial derivatives of transmission cross coefficients (TCCs).
Abstract:
PROBLEM TO BE SOLVED: To provide a method for simultaneously or alternatively optimizing lithographic apparatuses and illumination light sources, masks/design layouts and projection optical systems.SOLUTION: This method includes a step 302 of defining a multi-variable cost function of a plurality of design variables. The design variables may be associated with a characteristic step 300B of the projection optical system and an illumination light source (step 300A), and a design layout (step 300C). In a step 304, the various design variables are simultaneously adjusted so that the cost function is moved in a converging direction. In a step 306, it is determined whether a prescribed termination condition is satisfied. The prescribed termination condition may include various possibilities, i.e. the cost function may be minimized or maximized, as required by a numerical technique used. If one of the conditions in the step 306 is satisfied, the method ends. If none of the conditions in the step 306 is satisfied, the steps 304 and 306 are iteratively repeated until a desired result is obtained.
Abstract:
PROBLEM TO BE SOLVED: To provide a system and a method for creating a focus-exposure model of a lithography process.SOLUTION: The system and the method utilize calibration data along multiple dimensions of parameter variations, in particular within an exposure-defocus process window space. The system and the method provide a unified set of model parameter values that result in better accuracy and robustness of simulations at nominal process conditions, as well as the ability to predict lithographic performance at any point continuously throughout a complete process window area without a need for recalibration at different settings. With a smaller number of measurements required than the prior-art multiple-model calibration, the focus-exposure model provides more predictive and more robust model parameter values that can be used at any location in the process window.
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a system for optimizing the common process window of device design and an exposure tool by combining with a mask error model. SOLUTION: A mask is manufactured in accordance with a post-OPC mask layout (process 210). The mask is inspected to create and analyze mask inspection data and to determine systematic mask error parameters (process 212). An individual mask error model is created for the inspected mask (process 214). A lithographic process is simulated by using the individual mask error model to generate a simulate pattern (process 216). The simulate pattern is compared with a pre-OPC design layout obtained in a process 218 (process 220) to determine whether the manufactured mask demonstrates the desired patterning performance (process 222). When the mask is determined to be capable of demonstrating the desired performance, the method advances to a process 228. When not, the method continues advances to a process 224, where the mask is evaluated to determine whether it is repairable or reworkable. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide tools for optimizing illumination sources and masks for use in lithographic apparatuses and processes.SOLUTION: The present invention significantly speeds up the convergence of the optimization by allowing direct computation of the gradient of a cost function. According to other aspects, the present invention allows simultaneous optimization of both the source and the mask, thereby significantly speeding up the overall convergence. According to further aspects, the present invention allows free-form optimization, without the constraints required by conventional optimization techniques.