公开(公告)号：EP1715732A3

公开(公告)日：2007-11-21

申请号：EP06008023.1

申请日：2006-04-18

Applicant: ASUSTeK Computer Inc.

Inventor： Chen, Yueh-Chih ,  Chang, Kai-Shun

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0209 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/429 ,  H05K2201/0715 ,  H05K2201/09327

Abstract: A printed circuit board structure includes a signal reference layer (340) exposed at the surface of the printed circuit board (300). Through the large-area copper material of the signal reference layer (340) having a good heat conduction properties, the heat generated by thermal devices (360) located on the opposite surface of the printed circuit board (300), can be dissipated by convection in the environment surrounding the printed circuit board (300) to achieve a good heat dissipation effect.

公开(公告)号：EP1715732A2

公开(公告)日：2006-10-25

申请号：EP06008023.1

申请日：2006-04-18

Applicant: ASUSTeK Computer Inc.

Inventor： Chen, Yueh-Chih ,  Chang, Kai-Shun

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0209 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/429 ,  H05K2201/0715 ,  H05K2201/09327

Abstract: A printed circuit board structure includes a signal reference layer (340) exposed at the surface of the printed circuit board (300). Through the large-area copper material of the signal reference layer (340) having a good heat conduction properties, the heat generated by thermal devices (360) located on the opposite surface of the printed circuit board (300), can be dissipated by convection in the environment surrounding the printed circuit board (300) to achieve a good heat dissipation effect.

Abstract translation: 的印刷电路板结构包括在所述印刷电路板（300）的表面露出的信号参考层（340）。 通过具有良好导热特性的信号的参考层（340）的大面积的铜材料，通过位于印刷电路板（300）的相对的表面上的热装置（360）产生的热量可以通过对流消散 在环境周围的印刷电路板（300），以达到良好的散热效果。