公开(公告)号：WO2009071982A2

公开(公告)日：2009-06-11

申请号：PCT/IB2008003343

申请日：2008-12-04

Applicant: ATI TECHNOLOGIES ULC ,  ATI INT SRL ,  MCLELLAN NEIL ,  LI YUE ,  TOPACIO RODEN ,  CHEUNG TERENCE

Inventor： MCLELLAN NEIL ,  LI YUE ,  TOPACIO RODEN ,  CHEUNG TERENCE

IPC: H01L23/485 ,  H01L21/60 ,  H01L23/525

CPC classification number: H01L24/13 ,  H01L21/563 ,  H01L23/50 ,  H01L23/525 ,  H01L23/5286 ,  H01L24/11 ,  H01L2224/10126 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1411 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00

Abstract: Various semiconductor chip conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a semiconductor chip. The conductor structure has a first site electrically connected to a first redistribution layer structure and a second site electrically connected to a second redistribution layer structure. A solder structure is formed on the conductor structure.

Abstract translation: 提供各种半导体芯片导体结构及其制造方法。 一方面，提供一种制造方法，其包括在半导体芯片上形成导体结构。 导体结构具有电连接到第一再分配层结构的第一部位和电连接到第二再分配层结构的第二部位。 在导体结构上形成焊料结构。

公开(公告)号：EP3213609A4

公开(公告)日：2018-07-04

申请号：EP15854911

申请日：2015-10-07

Applicant: ATI TECHNOLOGIES ULC

Inventor： TOPACIO RODEN ,  LEUNG ANDREW KW

IPC: H01L23/498 ,  H05K3/28 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42

CPC classification number: H01L23/49816 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a solder mask on a circuit board with a first opening that has a sidewall. A solder interconnect pad is formed in the first opening. The sidewall sets the lateral extent of the solder interconnect pad.

公开(公告)号：EP2545755A4

公开(公告)日：2013-12-25

申请号：EP11752774

申请日：2011-03-09

Applicant: ATI TECHNOLOGIES ULC

Inventor： TOPACIO RODEN

IPC: H05K3/36 ,  H05K3/10

CPC classification number: H05K3/3452 ,  H01L21/563 ,  H01L23/28 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13111 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81455 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01322 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H05K1/0271 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/2072 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2224/05552 ,  H01L2924/00

Abstract: Various circuit boards and methods of manufacturing using the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a solder mask to a side of a circuit board and forming at least one opening in the solder mask leading to the side. An underfill is placed on the solder mask so that a portion thereof projects into the at least one opening.

公开(公告)号：EP2471096A4

公开(公告)日：2015-04-29

申请号：EP10824354

申请日：2010-10-21

Applicant: ATI TECHNOLOGIES ULC

Inventor： TOPACIO RODEN ,  WONG GABRIEL

IPC: H01L23/485 ,  H01L21/60

CPC classification number: H01L23/49816 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L2224/0233 ,  H01L2224/02331 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05005 ,  H01L2224/05008 ,  H01L2224/05012 ,  H01L2224/05013 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05559 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05599 ,  H01L2224/06131 ,  H01L2224/1132 ,  H01L2224/13007 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2924/00 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012

Abstract: A routing layer for a semiconductor die is disclosed. The routing layer includes pads for attaching solder bumps; bond-pads bonded to bump-pads of a die having an integrated circuit, and traces interconnecting bond-pads to pads. The routing layer is formed on a layer of dielectric material. The routing layer includes conductive traces at least partially surrounding some pads so as to absorb stress from solder bumps attached to the pads. Parts of the traces that surround pads protect parts of the underlying dielectric material proximate the solder bumps, from the stress.

Abstract translation: 公开了一种用于半导体管芯的布线层。 布线层包括用于附接焊料凸块的焊盘; 键合焊盘结合到具有集成电路的管芯的凸点焊盘，以及将互连的接合焊盘迹迹到焊盘。 布线层形成在介电材料层上。 路由层包括至少部分地围绕一些焊盘的导电迹线，以便吸收附着在焊盘上的焊料凸块的应力。 围绕焊盘的迹线的一部分保护靠近焊料凸块的基底电介质材料的部分免受应力的影响。

公开(公告)号：EP2700091A4

公开(公告)日：2015-04-29

申请号：EP12773917

申请日：2012-04-23

Applicant: ATI TECHNOLOGIES ULC

Inventor： TOPACIO RODEN ,  WONG GABRIEL

IPC: H01L23/485 ,  H01L21/60

CPC classification number: H01L24/17 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/33 ,  H01L2224/0233 ,  H01L2224/02331 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05005 ,  H01L2224/05008 ,  H01L2224/05012 ,  H01L2224/05013 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05559 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/1132 ,  H01L2224/13007 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/01031

Abstract: A routing layer for a semiconductor die is disclosed. The routing layer includes traces interconnecting integrated circuit bond-pads to UBMs. The routing layer is formed on a layer of dielectric material. The routing layer includes conductive traces arranged underneath the UBMs as to absorb stress from solder bumps attached to the UMBs. Traces beneath the UBMs protect parts of the underlying dielectric material proximate the solder bumps, from the stress.

Abstract translation: 公开了一种用于半导体管芯的布线层。 路由层包括将集成电路焊盘与UBM相互连接的迹线。 布线层形成在介电材料层上。 布线层包括布置在UBM下方的导电迹线，以吸收附着在UMB上的焊料凸起的应力。 UBM下面的痕迹保护邻近焊料凸点的基底电介质材料的部分不受应力影响。

公开(公告)号：EP2460393A4

公开(公告)日：2015-03-04

申请号：EP10803777

申请日：2010-07-28

Applicant: ATI TECHNOLOGIES ULC

Inventor： LEUNG ANDREW ,  TOPACIO RODEN ,  MARTINEZ LIANE ,  LOW YIP SENG

IPC: H05K3/00 ,  H01L23/12 ,  H01L23/488 ,  H05K1/02 ,  H05K3/10

CPC classification number: H01L23/49822 ,  B32B37/02 ,  B32B2309/105 ,  B32B2310/0843 ,  B32B2457/00 ,  H01L21/4857 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09136 ,  Y10T29/49117 ,  Y10T156/10 ,  H01L2224/05599