公开(公告)号：WO03036679A2

公开(公告)日：2003-05-01

申请号：PCT/US0234382

申请日：2002-10-25

Applicant: AXCELIS TECH INC

Inventor： WEED ALAN ,  FISH ROGER

IPC: H01J37/20 ,  H01J37/317 ,  H01L21/00 ,  H01L21/265

CPC classification number: H01L21/67109 ,  H01J37/3171 ,  H01J2237/2001 ,  H01J2237/20207 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention provides a wafer pad assembly for use in an ion implanter for mounting and cooling a wafer. The wafer pad assembly comprises a wafer support pad having an upper surface for mounting the wafer and a lower surface. The lower surface of the wafer support pad is connected to a coolant passage having an inlet section and an outlet section arranged in an opposed configuration, wherein said inlet section is counterbalanced by said outlet section. The lower surface is connected to a frame having an outer curved surface in mating engagement with a complementatry shaped bearing surface of a housing wherein said wafer can be tilited or rotated about an axis.

Abstract translation: 本发明提供了一种用于离子注入机的晶片焊盘组件，用于安装和冷却晶片。 晶片垫组件包括具有用于安装晶片的上表面和下表面的晶片支撑垫。 晶片支撑垫的下表面连接到具有以相对构造布置的入口部分和出口部分的冷却剂通道，其中所述入口部分由所述出口部分平衡。 下表面连接到具有与壳体的互补形状支承表面配合接合的外弯曲表面的框架，其中所述晶片可以围绕轴线倾斜或旋转。