公开(公告)号：AU2003274407A1

公开(公告)日：2004-05-13

申请号：AU2003274407

申请日：2003-10-22

Applicant: AXCELIS TECH INC

Inventor： KELLERMAN PETER L ,  RYAN KEVIN T ,  MITCHELL ROBERT J

IPC: H01L21/00

Abstract: An apparatus for processing a semiconductor wafer. The apparatus according to the present invention comprises a wafer port flange including an electrostatic chuck and a top plate including a lip. The electrostatic chuck defines a circumferential gas distribution groove and a gas gap positioned between a backside of a semiconductor wafer and the electrostatic chuck. The lip is positioned to shield an outside band of the wafer. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR §1.72(b).

公开(公告)号：WO2004038766A3

公开(公告)日：2004-07-22

申请号：PCT/IB0304652

申请日：2003-10-22

Applicant: AXCELIS TECH INC

Inventor： KELLERMAN PETER L ,  RYAN KEVIN T ,  MITCHELL ROBERT J

IPC: H01L21/00

CPC classification number: H01L21/67109

Abstract: An apparatus for processing a semiconductor wafer. The apparatus according to the present invention comprises a wafer port flange including an electrostatic chuck and a top plate including a lip. The electrostatic chuck defines a circumferential gas distribution groove and a gas gap positioned between a backside of a semiconductor wafer and the electrostatic chuck. The lip is positioned to shield an outside band of the wafer. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract translation: 一种用于处理半导体晶片的设备。 根据本发明的设备包括包括静电卡盘的晶片端口法兰和包括唇缘的顶板。 静电卡盘限定周向气体分布凹槽和位于半导体晶片的背侧和静电卡盘之间的气隙。 唇部被定位以屏蔽晶片的外部带。 要强调的是，提供这个摘要是为了遵守需要摘要的规则，这将允许搜索者或其他读者快速确定技术公开的主题。 提交时的理解是，它不会被用来解释或限制权利要求的范围或含义。