-
1.发明公开FABRICATION OF HIGH DENSITY MULTILAYER INTERCONNECT PRINTED CIRCUIT BOARDS 失效多层电路板与之间的高密度CONNECTIONS生产
公开(公告)号：EP0976308A1
公开(公告)日：2000-02-02
申请号：EP98914672.5
申请日：1998-04-13
Applicant: AlliedSignal Inc.
Inventor： XU, Chengzeng , YARDLEY, James, T. , HAAS, David , VALLANCE, Michael , GOTRO, Jeffrey, Thomas , PETTI, Michael, A.
IPC: H05K3/46
CPC classification number: H05K3/0023 , H05K3/381 , H05K3/4644 , H05K3/4652 , H05K2201/0355 , H05K2201/0969 , H05K2203/1152 , Y10T428/23986
Abstract: High density built-up multilayer printed circuit boards are produced by constructing microvias with photoimageable dielectric materials. A photosensitive dielectric composition (4) on a conductive foil (2) is laminated to conductive lines (6) on a core (8). After imaging the foil (2), and imaging and curing the photosensitive dielectric composition (4), vias (14) are formed to the conductive lines (6). Thereafter the conductive lines (6) are connected (16) through the vias (14) to the conductive foil (2), and then the conductive foil (2) is patterned.
-
2.发明公开POSITIVE WORKING PHOTODEFINABLE RESIN COATED METAL FOR MASS PRODUCTION OF MICROVIAS IN MULTILAYER PRINTED WIRING BOARDS 失效进行正工作PHOTOSTRUKTURIER Barem涂树脂FORMIKROKONTAKLÖCHERN作者多层电路板等大批量生产金属
公开(公告)号：EP0976307A1
公开(公告)日：2000-02-02
申请号：EP98914668.3
申请日：1998-04-13
Applicant: AlliedSignal Inc.
Inventor： XU, Chengzeng , YARDLEY, James, T. , HAAS, David , VALLANCE, Michael , GOTRO, Jeffrey, Thomas , PETTI, Michael, A.
IPC: H05K3/46
CPC classification number: H05K3/4652 , H05K3/0023 , H05K3/381 , H05K3/4644 , H05K2201/0355 , H05K2203/0551 , H05K2203/1152
Abstract: High density built-up multilayer printed circuit boards are produced by constructing microvias with positive working photoimageable dielectric materials. A positive working photosensitive dielectric composition (4) on a conductive foil (2) is laminated to conductive lines (6) on a substrate (8). After imaging the foil (2), and imaging and curing the photosensitive dielectric composition (4), vias (14) are formed to the conductive lines (6). Thereafter the conductive lines (6) are connected (16) through the vias (14) to the conductive foil (2), and then the conductive foil (2) is patterned.
-
Search Results
2
records
(took 0.019 seconds)
