公开(公告)号：US20210324155A1

公开(公告)日：2021-10-21

申请号：US16854712

申请日：2020-04-21

Applicant: Wei-Lin TSENG ,  Amazing Cool Technology Corp

Inventor： Wei-Lin TSENG ,  Yang-Ming SHIH ,  Chia-Lang CHAN ,  Chia-Ming HSU

IPC: C08J5/18 ,  C08J5/12 ,  C08K3/04 ,  C08K9/08 ,  C08L77/00 ,  C08L101/00

Abstract: A method for manufacturing a graphene plastic film includes the steps of providing plastic particles and graphene powder, mixing the plastic particles with the graphene powder in a weight ratio not greater than 2% to form a mixed material, heating the mixed material to form a melted material (100), pressing the melted material (100) to form a graphene plastic sheet (210), and radially stretching a periphery of the graphene plastic sheet (210) to expand and thin the graphene plastic sheet (210) to form a graphene plastic film (220). By adding graphene to the mixed material, physical properties of the graphene plastic film (220) can be enhanced. In comparison with the current technology, it is easier to be manufactured and wider to be applied.

公开(公告)号：US20220139621A1

公开(公告)日：2022-05-05

申请号：US17084426

申请日：2020-10-29

Applicant: Wei-Lin TSENG ,  Amazing Cool Technology Corp

Inventor： Wei-Lin TSENG ,  Yang-Ming SHIH ,  Hung-Yun HSU

IPC: H01G4/12 ,  H01G4/30 ,  H01G4/008

Abstract: The invention provides a manufacturing method for a multi-layer ceramic capacitor. the method includes: providing a plastic film; coating a layer of ceramic slurry on a side of the plastic film; coating a layer of copper paste on the layer of ceramic slurry to form a raw material, wherein the copper paste includes a copper powder and a graphene powder; and sintering the raw material at a temperature equal to or higher than 800° C. to sinter the layer of ceramic slurry into a ceramic dielectric layer and the copper paste into a copper electrode layer. The copper atoms are restricted by the graphene so that the copper atoms are confined in layer arrangement to improve flatness of copper atoms in the copper electrode layer.

公开(公告)号：US20200340764A1

公开(公告)日：2020-10-29

申请号：US16536289

申请日：2019-08-08

Applicant: Amazing Cool Technology Corp

Inventor： Wei-Lin TSENG ,  Yang-Ming SHIH ,  Hung-Yun HSU ,  Chi-Hang HUNG

IPC: F28F3/12

Abstract: A molding method is provided. The method includes steps of: providing a mold having a male mold forming a column and a female mold forming a cavity; multiple ribs extending along a longitudinal direction of the column are formed on the column; inserting the male mold into the female mold to close the mold to make the column inserted in and separated from an inner surface of the cavity; filling a molten plastic material mixed with metal particles into the cavity so as to make the material fill a space between the column and the cavity; forming a molded heat transfer component covering the column by the solidified plastic material; taking out the molded heat transfer component with the column along the longitudinal direction of the column from the cavity; and separating the molded heat transfer component from the column along the longitudinal direction of the column.

公开(公告)号：US20180235074A1

公开(公告)日：2018-08-16

申请号：US15861676

申请日：2018-01-04

Applicant: Amazing Cool Technology Corp

Inventor： Yang-Ming SHIH ,  Hung-Yun Hsu

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K1/0209 ,  H05K2201/0257 ,  H05K2201/0323 ,  H05K2201/06 ,  H05K2201/09781

Abstract: A radiative cooling structure for a printed circuit includes a circuit board and a cooling structure. A printed circuit is disposed on the circuit board. The printed circuit includes a plurality of printed leads and a thermal conductive area. The printed leads are connected to the thermal conductive area. A cooling structure covers the thermal conductive area. The cooling structure covers the thermal conductive area, and the cooling structure incudes a thermal radiation layer. Heat generated by heat sources on the circuit board is transferred to the thermal conductive area via the printed circuit. The cooling structure radiates the heat into surrounding space by radiation.

公开(公告)号：US20210339429A1

公开(公告)日：2021-11-04

申请号：US16861481

申请日：2020-04-29

Applicant: Wei-Lin TSENG ,  Amazing Cool Technology Corp

Inventor： Wei-Lin TSENG ,  Yang-Ming SHIH ,  Chia-Lang CHAN ,  Chia-Ming HSU

IPC: B29B9/06

Abstract: A method of manufacturing graphene polyester chips including steps of: melt-mixing a polymer material and graphene powder having a mass fraction ≤2 wt %, and melt-mixing a tackifier with a mass fraction between 1 wt % and 3 wt %, a toughener with a mass fraction between 1 wt % and 3 wt %, and a dispersant with a mass fraction between 1 wt % and 4 wt % sequentially. Finally, a molten raw material is made into a plurality of graphene polyester chips each in form of short cylindrical particle. The present disclosure further includes a method of manufacturing graphene diaphragm.

公开(公告)号：US20180233427A1

公开(公告)日：2018-08-16

申请号：US15861678

申请日：2018-01-04

Applicant: Amazing Cool Technology Corp

Inventor： Yang-Ming SHIH ,  Hung-Yun HSU

IPC: H01L23/367 ,  H01L23/373 ,  F28F21/02 ,  F28F3/02

CPC classification number: F28F21/02 ,  F28D2021/0029 ,  F28F3/02 ,  H01L23/373 ,  H01L23/3735

Abstract: A graphite heat sink includes a graphite heat conductive plate and a heat radiation layer. One side of the graphite heat conductive plate is used for absorbing heat from the heat source. The other side of the graphite heat conductive plate is covered by the heat radiation layer. Heat from the heat source is absorbed into the graphite heat conductive plate and then rapidly radiated from the heat radiation layer to dissipate.

公开(公告)号：US20240203914A1

公开(公告)日：2024-06-20

申请号：US18592048

申请日：2024-02-29

Applicant: AMAZING COOL TECHNOLOGY CORP.

Inventor： Shiann-Tsong TSAI ,  Yang-Ming SHIH ,  Hung-Yun HSU

IPC: H01L23/00

CPC classification number: H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03826 ,  H01L2224/03831 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13147 ,  H01L2224/13611 ,  H01L2924/01006 ,  H01L2924/014

Abstract: A manufacturing method of a flip chip package structure is provided and has following steps: providing at least one silicon substrate having a connecting surface and at least one conductive base attached to the connecting surface; arranging a graphene copper layer covering the conductive base; laminating a photoresist layer on the connecting surface, etching the photoresist layer to form a cavity corresponding to the conductive base, and a portion of the graphene copper layer corresponding to the conductive base being exposed on a bottom of the cavity; electroplating a copper material on the graphene copper layer, and the copper material being accumulated in the cavity to form a copper pillar; removing the photoresist layer and the graphene copper layer covered by the photoresist layer.

公开(公告)号：US20230260936A1

公开(公告)日：2023-08-17

申请号：US17674312

申请日：2022-02-17

Applicant: AMAZING COOL TECHNOLOGY CORP.

Inventor： Shiann-Tsong TSAI ,  Yang-Ming SHIH ,  Hung-Yun HSU

IPC: H01L23/00

CPC classification number: H01L24/03 ,  H01L24/11 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/03826 ,  H01L2224/03831 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/11011 ,  H01L2224/05547 ,  H01L2224/05647 ,  H01L2224/13147 ,  H01L2224/13611 ,  H01L2924/014

Abstract: A manufacturing method of a flip chip package structure is provided and has following steps: providing at least one silicon substrate having a connecting surface and at least one conductive base attached to the connecting surface; arranging a graphene copper layer covering the conductive base; laminating a photoresist layer on the connecting surface, etching the photoresist layer to form a cavity corresponding to the conductive base, and a portion of the graphene copper layer corresponding to the conductive base being exposed on a bottom of the cavity; electroplating a copper material on the graphene copper layer, and the copper material being accumulated in the cavity to form a copper pillar; removing the photoresist layer and the graphene copper layer covered by the photoresist layer.

公开(公告)号：US20210299746A1

公开(公告)日：2021-09-30

申请号：US16832382

申请日：2020-03-27

Applicant: Amazing Cool Technology Corp

Inventor： Wei-Lin TSENG ,  Yang-Ming SHIH ,  Chi-Hang HUNG

IPC: B22F1/00 ,  B22F3/10

Abstract: A graphene modifying method of metal having following steps of providing metal powders, graphene powders and a binder, the metal powder has metal particles, and the graphene powder has graphene micro pieces, each graphene micro piece is formed by graphene molecules connected with each other, each graphene molecule is connected to a stearic acid functional group by a sp3 bond; mixing the metal powder, the graphene powder and the binder to generate heat by a friction, each sp3 bond connected with the stearic acid functional group is thereby heated and broken, each graphene molecule is connected with other graphene molecules via the broken sp3 bond, and the metal particles are thereby wrapped by the graphene molecules; and sintering the metal particles into a metal body to transform the graphene molecules into a three-dimensional mash embedded in the metal body.

公开(公告)号：US20200009653A1

公开(公告)日：2020-01-09

申请号：US16503576

申请日：2019-07-04

Applicant: Wei-Lin TSENG ,  Amazing Cool Technology Corp

Inventor： Wei-Lin TSENG ,  Yang-Ming SHIH ,  Tzu-Yao LIN

IPC: B22F3/10 ,  B22F3/11

Abstract: A manufacturing method of a graphene metal composite material includes the steps of providing metal powder including metal particles, graphene powder including graphene pieces and binder including wax material, wherein each graphene piece includes graphene molecules connected with each other and including six carbon atoms annually connected, and one of the carbon atom of each graphene molecule is bonded with a functional group by an SP3 bond; mixing the powders and the binder into a powder material, wherein the SP3 bond is heated and broken by friction, and the graphene molecules are connected with each other via the broken SP3 bond to wrap the respective metal particles; melting and molding the powder material to form a green part; removing the binder from the green part to form a brown part; and sintering the brown part to form a metal main part embedded a three-dimensional mash formed by the graphene molecules.