公开(公告)号：US20100297781A1

公开(公告)日：2010-11-25

申请号：US12308530

申请日：2007-05-23

Applicant: Andreas Scheurle

Inventor： Andreas Scheurle

IPC: H01L21/20 ,  H01L21/66

CPC classification number: B81C1/00714 ,  B81C2201/0109 ,  B81C2201/0177

Abstract: A method for manufacturing MEMS structures having at least one functional layer of silicon that contains structures that are exposed by removing a sacrificial layer, at least one sacrificial layer and at least one functional layer being deposited such that they grow in a monocrystalline manner, and the sacrificial layer is made up of a silicon-germanium mixed layer.

Abstract translation: 一种用于制造具有至少一个硅功能层的MEMS结构的方法，其包含通过去除牺牲层而暴露的结构，至少一个牺牲层和至少一个功能层被沉积成使得它们以单晶方式生长， 牺牲层由硅 - 锗混合层组成。

公开(公告)号：US09309107B2

公开(公告)日：2016-04-12

申请号：US13434486

申请日：2012-03-29

Applicant: Jochen Reinmuth ,  Andreas Scheurle ,  Christian Bierhoff

Inventor： Jochen Reinmuth ,  Andreas Scheurle ,  Christian Bierhoff

IPC: B32B7/14 ,  B81C1/00 ,  G01P15/08

CPC classification number: B81C1/00039 ,  B81B2207/07 ,  G01P15/0802 ,  Y10T428/24851

Abstract: A micromechanical system is described having a substrate; a first micromechanical functional area, which is situated above the substrate; a second micromechanical functional area, which is situated above the first micromechanical functional area and is connected via a first weblike anchoring structure to the first micromechanical functional area; a third micromechanical functional area, which is situated above the second micromechanical functional area, and which has a first subarea and a second subarea; the first subarea being connected via a second weblike anchoring structure to the second micromechanical functional area; and the second subarea being mounted floating over the substrate by the first subarea. The invention also provides a method for manufacturing such a micromechanical system.

Abstract translation: 具有基板的微机械系统被描述; 位于基板上方的第一微机械功能区域; 第二微机械功能区域，其位于第一微机械功能区域上方，并且经由第一网状锚定结构连接到第一微机械功能区域; 第三微机械功能区域，其位于第二微机械功能区域上方，并且具有第一子区域和第二子区域; 所述第一子区域经由第二网状锚定结构连接到所述第二微机械功能区域; 并且第二子区域通过第一子区域浮动在衬底上。 本发明还提供了一种用于制造这种微机械系统的方法。

公开(公告)号：US20080093690A1

公开(公告)日：2008-04-24

申请号：US11974011

申请日：2007-10-10

Applicant: Frank Reichenbach ,  Franz Laermer ,  Kersten Kehr ,  Axel Franke ,  Andreas Scheurle

Inventor： Frank Reichenbach ,  Franz Laermer ,  Kersten Kehr ,  Axel Franke ,  Andreas Scheurle

IPC: H01L29/84 ,  H01L21/302

CPC classification number: B81C1/00246 ,  B81B2201/0235 ,  B81C2203/0778

Abstract: A micromechanical component and a method for manufacturing such a component, the component having a micromechanical structure and an integrated circuit, the micromechanical structure being monolithically integrated into the circuit, the circuit being provided in a circuit area of the substrate, and the micromechanical structure being provided in a sensor area of the substrate, the material of the substrate being provided in the area of a sacrificial layer as well as in the area of a function layer without a transition.

Abstract translation: 一种微机械部件和制造这种部件的方法，所述部件具有微机械结构和集成电路，所述微机械结构单片集成到所述电路中，所述电路设置在所述基板的电路区域中，所述微机械结构为 设置在衬底的传感器区域中，衬底的材料设置在牺牲层的区域中以及在没有转变的功能层的区域中。

公开(公告)号：US08928099B2

公开(公告)日：2015-01-06

申请号：US13757261

申请日：2013-02-01

Applicant: Johannes Classen ,  Jochen Reinmuth ,  Andreas Scheurle

Inventor： Johannes Classen ,  Jochen Reinmuth ,  Andreas Scheurle

IPC: H01L29/84 ,  G01P15/08 ,  B81B3/00 ,  B81C1/00 ,  G01P15/125

CPC classification number: B81B3/0018 ,  B81B2201/025 ,  B81C1/00015 ,  B81C1/0015 ,  G01P15/0802 ,  G01P15/125

Abstract: A method for manufacturing a micromechanical component is described in which a trench etching process and a sacrificial layer etching process are carried out to form a mass situated movably on a substrate. The movable mass has electrically isolated and mechanically coupled subsections of a functional layer. A micromechanical component having a mass situated movably on a substrate is also described.

Abstract translation: 描述了一种制造微机械部件的方法，其中进行沟槽蚀刻工艺和牺牲层蚀刻工艺以形成可移动地位于衬底上的质量。 可移动物体具有功能层的电隔离和机械耦合子部分。 还描述了具有可移动地位于基底上的质量的微机械部件。

公开(公告)号：US20130200473A1

公开(公告)日：2013-08-08

申请号：US13757261

申请日：2013-02-01

Applicant: Johannes CLASSEN ,  Jochen Reinmuth ,  Andreas Scheurle

Inventor： Johannes CLASSEN ,  Jochen Reinmuth ,  Andreas Scheurle

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0018 ,  B81B2201/025 ,  B81C1/00015 ,  B81C1/0015 ,  G01P15/0802 ,  G01P15/125

Abstract: A method for manufacturing a micromechanical component is described in which a trench etching process and a sacrificial layer etching process are carried out to form a mass situated movably on a substrate. The movable mass has electrically isolated and mechanically coupled subsections of a functional layer. A micromechanical component having a mass situated movably on a substrate is also described.

Abstract translation: 描述了一种制造微机械部件的方法，其中进行沟槽蚀刻工艺和牺牲层蚀刻工艺以形成可移动地位于衬底上的质量。 可移动物体具有功能层的电隔离和机械耦合子部分。 还描述了具有可移动地位于基底上的质量的微机械部件。

公开(公告)号：US08329555B2

公开(公告)日：2012-12-11

申请号：US12734994

申请日：2008-10-20

Applicant: Frank Reichenbach ,  Franz Laermer ,  Silvia Kronmueller ,  Andreas Scheurle

Inventor： Frank Reichenbach ,  Franz Laermer ,  Silvia Kronmueller ,  Andreas Scheurle

IPC: H01L21/30 ,  H01L21/46

CPC classification number: B81C1/00301 ,  B81B2207/095 ,  H01L21/76879 ,  H01L21/76898 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13025 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.

Abstract translation: 一种用于制造具有至少一个盖的传感器的封盖晶片的方法包括：产生通过晶片延伸的接触通孔，并且在其后随后通过导电材料填充接触通孔。

公开(公告)号：US20110012248A1

公开(公告)日：2011-01-20

申请号：US12734994

申请日：2008-10-20

Applicant: Frank Reichenbach ,  Franz Laermer ,  Silvia Kronmueller ,  Andreas Scheurle

Inventor： Frank Reichenbach ,  Franz Laermer ,  Silvia Kronmueller ,  Andreas Scheurle

IPC: H01L23/15 ,  H01L21/60 ,  H01R9/00 ,  B05D5/12 ,  C25D5/02

CPC classification number: B81C1/00301 ,  B81B2207/095 ,  H01L21/76879 ,  H01L21/76898 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13025 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.

Abstract translation: 一种用于制造具有至少一个盖的传感器的封盖晶片的方法包括：产生通过晶片延伸的接触通孔，并且在其后随后通过导电材料填充接触通孔。