公开(公告)号：US20150070864A1

公开(公告)日：2015-03-12

申请号：US14020059

申请日：2013-09-06

Applicant: Apple Inc.

Inventor： Amanda R. Rainer ,  Connor R. Duke ,  James W. Bilanski ,  Jeffrey M. Thoma ,  Michael Eng ,  Mingzhe Li ,  Sung Woo Yoo ,  Miguel Alejandro Lara-Pena ,  Weng Choy Foo ,  Kieran Poulain

IPC: H01L23/29 ,  H01L25/065 ,  H05K1/03 ,  H01L21/56

CPC classification number: H05K1/0393 ,  H01L21/563 ,  H01L25/0655 ,  H01L2224/73204 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10015 ,  H05K2201/10977 ,  H05K2201/2045 ,  H05K2203/0126 ,  H05K2203/304

Abstract: An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.

Abstract translation: 电子设备可以设置有集成电路和电气部件，例如电焊接到印刷电路板的电容器。 诸如密封剂和底部填充材料的液体聚合物粘合剂可以沉积在印刷电路上。 诸如电容器的电气部件可以用密封剂涂覆。 底部填充物可以沉积在集成电路附近，使得底部填充物吸入集成电路和印刷电路板之间的间隙中。 密封剂可能比底部填充剂更粘稠，因此可以防止流动的底部填充物到达电气部件。 一些密封剂可以位于电气部件和印刷电路板之间。 密封剂可以被固化以形成覆盖电气部件的弹性材料，其有助于阻止振动。 弹性材料的硬度可能低于底部填充物。

公开(公告)号：US20240386817A1

公开(公告)日：2024-11-21

申请号：US18662921

申请日：2024-05-13

Applicant: Apple Inc.

Inventor： Jason C. Sauers ,  Amanda R. Rainer ,  Cheng Chen ,  Graham B. Myhre ,  Michael J. Rockwell ,  Fletcher R. Rothkopf ,  Marinus Meursing ,  Phil M. Hobson ,  Jan K. Quijalvo ,  Jia Tao ,  Ivan S. Maric ,  Jeremy C. Franklin ,  Wey-Jiun Lin ,  William A. Sorrentino, III ,  Jonathan Ive ,  Alan C. Dye ,  Stephen O. Lemay ,  Jeffrey M. Faulkner ,  Seung Wook Kim ,  Ray L. Chang

IPC: G09G3/00 ,  G06F1/16 ,  G06F3/01 ,  G06F3/02 ,  G06F3/0338 ,  G06F3/0362 ,  G06T19/00

Abstract: A head-mountable display device includes a housing defining a front opening and a rear opening, a display screen disposed in the front opening, a display assembly disposed in the rear opening, a first securement strap coupled to the housing, the first securement strap including a first electronic component, a second securement strap coupled to the housing, the second securement strap including a second electronic component, and a securement band extending between and coupled to the first securement strap and the second securement strap.

公开(公告)号：US20240388687A1

公开(公告)日：2024-11-21

申请号：US18662994

申请日：2024-05-13

Applicant: Apple Inc.

Inventor： Michael J. Rockwell ,  Geoffrey Stahl ,  Thibaut Weise ,  Peter Kaufmann ,  Branko Petljanski ,  Jason L. Slupeiks ,  Tom Sengelaub ,  Kathrin Berkner Cieslicki ,  Yanghai Tsin ,  Hesam Najafi ,  Arthur Y. Zhang ,  Amanda R. Rainer ,  Cheng Chen ,  Graham B. Myhre ,  Fletcher R. Rothkopf ,  Marinus Meursing ,  Phil M. Hobson ,  Jason C. Sauers ,  Jan K. Quijalvo ,  Jia Tao ,  Ivan S. Maric ,  Jeremy C. Franklin ,  Wey-Jiun Lin ,  William A. Sorrentino, III ,  Jonathan Ive ,  Alan C. Dye ,  Stephen O. Lemay ,  Seung Wook Kim ,  Ray L. Chang

IPC: H04N13/398 ,  G06F3/01 ,  G06F3/044 ,  H04N13/293 ,  H04N13/344 ,  H04N13/383

Abstract: A head-mountable display device includes a housing defining a front opening and a rear opening, a display screen disposed in the front opening, a display assembly disposed in the rear opening, a first securement strap coupled to the housing, the first securement strap including a first electronic component, a second securement strap coupled to the housing, the second securement strap including a second electronic component, and a securement band extending between and coupled to the first securement strap and the second securement strap.

公开(公告)号：US20240385442A1

公开(公告)日：2024-11-21

申请号：US18662781

申请日：2024-05-13

Applicant: Apple Inc.

Inventor： Jason C. Sauers ,  Amanda R. Rainer ,  Cheng Chen ,  Graham B. Myhre ,  Michael J. Rockwell ,  Fletcher R. Rothkopf ,  Marinus Meursing ,  Phil M. Hobson ,  Jan K. Quijalvo ,  Jia Tao ,  Ivan S. Maric ,  Jeremy C. Franklin ,  Wey-Jiun Lin ,  Trevor J. Ness ,  Ray L. Chang

IPC: G02B27/01 ,  G02B27/00

Abstract: A head-mountable display device includes a housing defining a front opening and a rear opening, a display screen disposed in the front opening, a display assembly disposed in the rear opening, a first securement strap coupled to the housing, the first securement strap including a first electronic component, a second securement strap coupled to the housing, the second securement strap including a second electronic component, and a securement band extending between and coupled to the first securement strap and the second securement strap.

公开(公告)号：US20180061578A1

公开(公告)日：2018-03-01

申请号：US15694726

申请日：2017-09-01

Applicant: Apple Inc.

Inventor： Gang Ning ,  Paul A. Martinez ,  Amanda R. Rainer ,  Won Seop Choi ,  Gemin Li ,  Zhong-Qing Gong ,  Shawn X. Arnold

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/232 ,  H01G4/12 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1209 ,  H01G4/232 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10015

Abstract: Passive component structures that may save space, are readily manufactured, and are easy to use. In one example, a passive component structure may include two capacitors, each formed as a group of plates separate and apart from the other. The two groups of plates may have a spacing layer between them.

公开(公告)号：US09596756B2

公开(公告)日：2017-03-14

申请号：US14020059

申请日：2013-09-06

Applicant: Apple Inc.

Inventor： Amanda R. Rainer ,  Connor R. Duke ,  James W. Bilanski ,  Jeffrey M. Thoma ,  Michael Eng ,  Mingzhe Li ,  Sung Woo Yoo ,  Miguel Alejandro Lara-Pena ,  Weng Choy Foo ,  Kieran Poulain

IPC: H05K1/03 ,  H01L21/56 ,  H05K3/28 ,  H01L25/065 ,  H05K1/18

CPC classification number: H05K1/0393 ,  H01L21/563 ,  H01L25/0655 ,  H01L2224/73204 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10015 ,  H05K2201/10977 ,  H05K2201/2045 ,  H05K2203/0126 ,  H05K2203/304

Abstract: An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.

Abstract translation: 电子设备可以设置有集成电路和电气部件，例如电焊接到印刷电路板的电容器。 诸如密封剂和底部填充材料的液体聚合物粘合剂可以沉积在印刷电路上。 诸如电容器的电气部件可以用密封剂涂覆。 底部填充物可以沉积在集成电路附近，使得底部填充物吸入集成电路和印刷电路板之间的间隙中。 密封剂可能比底部填充剂更粘稠，因此可以防止流动的底部填充物到达电气部件。 一些密封剂可以位于电气部件和印刷电路板之间。 密封剂可以被固化以形成覆盖电气部件的弹性材料，其有助于阻止振动。 弹性材料的硬度可能低于底部填充物。