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公开(公告)号：US10925164B2
公开(公告)日：2021-02-16
申请号：US15702046
申请日：2017-09-12
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Curtis C. Mead , Scott D. Morrison , Giancarlo F. De La Cruz , Lin Chen , Albert Wang , Brad W. Simeral
IPC: H05K1/18 , H03H1/00 , H03H7/01 , H03H7/38 , H05K3/34 , H01G4/30 , H01G2/06 , H01G4/40 , H01G4/228 , H01G4/12 , H01F27/29
Abstract: Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.
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公开(公告)号：US10510492B2
公开(公告)日：2019-12-17
申请号：US15600329
申请日：2017-05-19
Applicant: Apple Inc.
Inventor： Ming Y. Tsai , Albert Wang , Curtis C. Mead , Tyler S. Bushnell , Paul A. Martinez
Abstract: Monolithic capacitor structures having a main capacitor and a vise capacitor are discussed. The vise capacitor provides to the monolithic capacitor structure reduced vibrations and/or acoustic noise due to piezoelectric effects. To that end, vise capacitor may cause piezoelectric deformations that compensate the deformations that are caused by the electrical signals in the main capacitor. Embodiments of these capacitor structures may have the main capacitor and the vise capacitor sharing portions of a rigid dielectric. Electrical circuitry that employs the vise capacitor to reduce noise and/or vibration in the monolithic capacitor structures is also described. Methods for fabrication of these capacitors are discussed as well.
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公开(公告)号：US20180092212A1
公开(公告)日：2018-03-29
申请号：US15702046
申请日：2017-09-12
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Curtis C. Mead , Scott D. Morrison , Giancarlo F. De La Cruz , Lin Chen , Albert Wang , Brad W. Simeral
CPC classification number: H05K1/181 , H01F27/29 , H01G2/06 , H01G4/12 , H01G4/228 , H01G4/30 , H01G4/40 , H03H1/00 , H03H7/0115 , H03H7/38 , H03H2001/0085 , H05K3/3436 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10515 , H05K2201/10636 , Y02P70/611 , Y02P70/613
Abstract: Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.
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公开(公告)号：US20170064811A1
公开(公告)日：2017-03-02
申请号：US14841387
申请日：2015-08-31
Applicant: Apple Inc.
Inventor： Gemin Li , Paul Martinez , Benjamin A. Bard , Connor R. Duke , Zhong-Qing Gong , Kevin R. Richardson , Curtis C. Mead , Kieran Poulain , Sung Woo Yoo , Nelson J. Kottke
CPC classification number: H01G4/30 , H01G2/06 , H01G4/224 , H05K1/141 , H05K1/181 , H05K3/284 , H05K2201/049 , H05K2201/10015 , H05K2201/2045 , H05K2203/1316 , H05K2203/1322
Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.
Abstract translation: 公开了一种印刷电路板（PCB）组件，其具有安装在PCB上的几个电子部件和覆盖电子部件的阻尼层。 PCB组件的实施例包括将阻尼层限制在PCB上的包覆模制层。 PCB组件的实施例包括在电子部件的电容器和PCB之间的插入器。 还描述和要求保护其他实施例。
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公开(公告)号：US20170025210A1
公开(公告)日：2017-01-26
申请号：US15284179
申请日：2016-10-03
Applicant: Apple Inc.
Inventor： Michael Eng , Kieran Poulain , Curtis C. Mead , Connor R. Duke
CPC classification number: H01F7/0252 , H01F7/20 , H05B33/0842 , H05B37/0227 , H05K1/189 , H05K5/0017 , H05K2201/10106
Abstract: An electronic device may has e a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.
Abstract translation: 电子设备可以具有产生静磁场的诸如磁体的磁场源。 柔性印刷电路可以具有围绕中心部分的柔性尾部。 中心部分可能与磁体重叠。 电气部件可以安装到中心部分。 为了防止由于在柔性印刷电路中的信号线中流动的信号和静态磁场引起的磁场之间的相互作用而引起的不期望的振动和噪声，信号线可以被垂直堆叠或者可以沿着不与第 磁铁。 尾部可以用作服务回路，其允许用于装置的壳体的一部分和安装到与壳体中的窗口对准的中心部分的电气部件被拆卸用于维修。
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Patent Agency Ranking
公开(公告)号：US10431382B2
公开(公告)日：2019-10-01
申请号：US14841387
申请日：2015-08-31
Applicant: Apple Inc.
Inventor： Gemin Li , Paul Martinez , Benjamin A. Bard , Connor R. Duke , Zhong-Qing Gong , Kevin R. Richardson , Curtis C. Mead , Kieran Poulain , Sung Woo Yoo , Nelson J. Kottke
Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.
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公开(公告)号：US10424438B2
公开(公告)日：2019-09-24
申请号：US15275369
申请日：2016-09-24
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Curtis C. Mead , Scott D. Morrison , Giancarlo F. De La Cruz , Lin Chen , Albert Wang , Brad W Simeral , Vu Vo , Wyeman Chen
Abstract: Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.
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公开(公告)号：US20170207024A1
公开(公告)日：2017-07-20
申请号：US15409217
申请日：2017-01-18
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Gang Ning , Curtis C. Mead , Ming Y. Tsai , Albert Wang
CPC classification number: H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/35 , H01G4/40
Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting low equivalent series resistance (ESR) is illustrated. The capacitors may present electrodes that are coupled to metallic terminations at the bottom and/or at the side of the capacitor. The position of the electrode coupling may lead to smaller current paths in the MLCC electrode, which may decrease line inductances. Methods and systems for fabrication of the capacitors described are also discussed.
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公开(公告)号：US20160064130A1
公开(公告)日：2016-03-03
申请号：US14831109
申请日：2015-08-20
Applicant: Apple Inc.
Inventor： Michael Eng , Kieran Poulain , Curtis C. Mead , Connor R. Duke
CPC classification number: H01F7/0252 , H01F7/20 , H05B33/0842 , H05B37/0227 , H05K1/189 , H05K5/0017 , H05K2201/10106
Abstract: An electronic device may have a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.
Abstract translation: 电子设备可以具有产生静态磁场的诸如磁体的磁场源。 柔性印刷电路可以具有围绕中心部分的柔性尾部。 中心部分可能与磁体重叠。 电气部件可以安装到中心部分。 为了防止由于在柔性印刷电路中的信号线中流动的信号和静态磁场引起的磁场之间的相互作用而引起的不期望的振动和噪声，信号线可以被垂直堆叠或者可以沿着不与重叠的弯曲路径 磁铁。 尾部可以用作服务回路，其允许用于装置的壳体的一部分和安装到与壳体中的窗口对准的中心部分的电气部件被拆卸用于维修。
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公开(公告)号：US10811192B2
公开(公告)日：2020-10-20
申请号：US16146042
申请日：2018-09-28
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Won Seop Choi , Gang Ning , Chirag V. Shah , Martin Schauer , Curtis C. Mead , Ming Yuan Tsai , Albert Wang
Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.
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