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    MICRO-ALLOYING TO MITIGATE THE SLIGHT DISCOLORATION RESULTING FROM ENTRAINED METAL IN ANODIZED ALUMINUM SURFACE FINISHES
    2.
    发明申请
    MICRO-ALLOYING TO MITIGATE THE SLIGHT DISCOLORATION RESULTING FROM ENTRAINED METAL IN ANODIZED ALUMINUM SURFACE FINISHES 审中-公开
    微合金减少沉积在金属铝表面处理中的金属沉淀物的轻度分解

    公开(公告)号：WO2017052735A1

    公开(公告)日：2017-03-30

    申请号：PCT/US2016/043256

    申请日：2016-07-21

    Applicant: APPLE INC.

    Inventor： CURRAN, James A. ,  COUNTS, William A. ,  MISRA, Abhijeet

    IPC: C25D11/06 ,  C25D9/06 ,  A45C11/00 ,  H04M1/02

    CPC classification number: C22C1/06 ,  C22C21/10 ,  C25D11/06 ,  C25D11/14 ,  C25D11/16 ,  C25D11/243

    Abstract: Micro additions of certain elements such as zirconium or titanium are added to high strength aluminum alloys to counter discoloring effects of other micro-alloying elements when the high strength alloys are anodized. The other micro-alloying elements are added to increase the adhesion of an anodic film to the aluminum alloy substrate. However, these micro-alloying elements can also cause slight discoloration, such as a yellowing, of the anodic film. Such micro-alloying elements that can cause discoloration can include copper, manganese, iron and silver. The micro additions of additional elements, such as one or more of zirconium, tantalum, molybdenum, hafnium, tungsten, vanadium, niobium and tantalum, can dilute the discoloration of the micro-alloying elements. The resulting anodic films are substantially colorless.

    Abstract translation: 当将高强度合金阳极氧化时，将诸如锆或钛的某些元素的微量添加物添加到高强度铝合金中以抵抗其它微合金元素的变色效应。 添加其他微合金元素以增加阳极膜与铝合金基底的粘合性。 然而，这些微合金元素也可能引起阳极膜的轻微变色，例如变黄。 这种可能引起变色的微合金元素可以包括铜，锰，铁和银。 附加元素例如锆，钽，钼，铪，钨，钒，铌和钽中的一种或多种的微添加可以稀释微合金元素的变色。 得到的阳极膜基本上是无色的。

    RADIO-FREQUENCY TRANSPARENT WINDOW
    3.
    发明申请
    RADIO-FREQUENCY TRANSPARENT WINDOW 审中-公开
    无线电频率透明窗口

    公开(公告)号：WO2014197328A1

    公开(公告)日：2014-12-11

    申请号：PCT/US2014/040327

    申请日：2014-05-30

    Applicant: APPLE INC.

    Inventor： MISRA, Abhijeet ,  TRYON, Brian S. ,  KUEHMANN, Charles J. ,  LYNCH, Stephen B. ,  WRIGHT, James A.

    IPC: H01Q1/42 ,  H01Q1/24

    CPC classification number: H01Q1/42 ,  H01Q1/243 ,  H01Q1/44

    Abstract: A patch for a device in an electronic housing including an aluminum layer having a threshold thickness, a non-conductive layer on a first side of the aluminum layer, and a radio-frequency (RF) transparent layer on a second side of the aluminum layer is provided. A method for manufacturing an antenna window including a patch as above is also provided, the method including determining a thickness of the aluminum layer adjacent to an anodized aluminum layer. A method for manufacturing an antenna window including coating an aluminum layer having a threshold thickness on a radio-frequency (RF) transparent layer to form an RF transparent laminate is also provided. A method for manufacturing an antenna window including removing a thickness of aluminum is also provided. A method for manufacturing an antenna window including disposing a mask on an aluminum substrate and anodizing the aluminum substrate to a selected thickness is also provided.

    Abstract translation: 一种用于电子外壳中的装置的贴片，包括具有阈值厚度的铝层，在铝层的第一侧上的非导电层和在铝层的第二侧上的射频（RF）透明层 被提供。 还提供了一种用于制造包括如上所述的贴片的天线窗的方法，所述方法包括确定与阳极化铝层相邻的铝层的厚度。 还提供一种用于制造天线窗的方法，包括在射频（RF）透明层上涂覆具有阈值厚度的铝层以形成RF透明层压板。 还提供了一种用于制造包括去除铝厚度的天线窗的方法。 还提供了一种制造天线窗的方法，包括在铝基板上设置掩模并将铝基板阳极氧化至所选择的厚度。

    BONDING POLYMER MATERIAL TO ANODIZED METAL USING CAVITIES
    4.
    发明公开
    BONDING POLYMER MATERIAL TO ANODIZED METAL USING CAVITIES 审中-公开

    公开(公告)号：EP3453510A1

    公开(公告)日：2019-03-13

    申请号：EP18191706.3

    申请日：2018-08-30

    Applicant: Apple Inc.

    Inventor： CURRAN, James A. ,  MINTZ, Todd S. ,  YANG, Isabel ,  ZHANG, Shi Hua ,  MISRA, Abhijeet ,  HAMANN, Eric W.

    IPC: B29C45/14 ,  H04M1/02 ,  B29K705/00

    Abstract: This application relates to a multi-piece enclosure for a portable electronic device (102, 104, 106). The enclosure includes a metal part (240) including a metal substrate (204) and a metal oxide layer (206) overlaying the metal substrate (204), the metal oxide layer (206) having an external surface (202) that includes openings that lead into undercut regions (WU). The openings are characterized as having a first width, and the undercut regions (WU) are characterized as having a second width that is greater than the first width. The enclosure further includes a non-metallic bulk layer (252) including protruding portions that extend into the undercut regions (WU) such that the non-metallic bulk layer (252) is interlocked with the metal part (240).

    CLADDED METAL STRUCTURES FOR DISSIPATION OF HEAT IN A PORTABLE ELECTRONIC DEVICE
    7.
    发明公开
    CLADDED METAL STRUCTURES FOR DISSIPATION OF HEAT IN A PORTABLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3579674A3

    公开(公告)日：2020-03-04

    申请号：EP19176560.1

    申请日：2019-05-24

    Applicant: Apple Inc.

    Inventor： COUNTS, William A. ,  MISRA, Abhijeet ,  KALYANASUNDARAM, Nagarajan ,  YURKO, James A.

    IPC: H05K7/20 ,  G06F1/20 ,  H04M1/02

    Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

    CLADDED METAL STRUCTURES FOR DISSIPATION OF HEAT IN A PORTABLE ELECTRONIC DEVICE
    8.
    发明公开
    CLADDED METAL STRUCTURES FOR DISSIPATION OF HEAT IN A PORTABLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3579674A2

    公开(公告)日：2019-12-11

    申请号：EP19176560.1

    申请日：2019-05-24

    Applicant: Apple Inc.

    Inventor： COUNTS, William A. ,  MISRA, Abhijeet ,  KALYANASUNDARAM, Nagarajan ,  YURKO, James A.

    IPC: H05K7/20 ,  G06F1/20 ,  H04M1/02

    Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

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