公开(公告)号：US20250069857A1

公开(公告)日：2025-02-27

申请号：US18946807

申请日：2024-11-13

Applicant: Applied Materials, Inc.

Inventor： Amir H. Tavakoli ,  Tony S. Kaushal ,  Peter Reimer ,  David Jorgensen

IPC: H01J37/32 ,  C04B35/10 ,  C04B35/12 ,  C04B35/14 ,  C04B35/622 ,  C23C16/40 ,  C23C16/455 ,  H01L21/67

Abstract: Exemplary methods of coating a metal-containing component are described. The methods are developed to increase corrosion resistance and improve coating adhesion to a metal substrate. The methods include forming a bonding layer on a metal substrate, where the bonding layer includes an oxide of a metal in the metal substrate. The coating methods further include depositing a stress buffer layer on the bonding layer, where the stress buffer layer is characterized by a stress buffer layer coefficient of thermal expansion (CTE) that is less than a metal substrate CTE and a bonding layer CTE. The coating methods also include depositing an environmental barrier layer on the stress buffer layer, where a ratio of the metal substrate CTE to an environmental barrier layer CTE is greater than or about 20:1, and where the environmental barrier layer includes silicon oxide. The metal-containing components may be used in fabrication equipment for electronic devices.

公开(公告)号：US12191120B2

公开(公告)日：2025-01-07

申请号：US17691384

申请日：2022-03-10

Applicant: Applied Materials, Inc.

Inventor： Amir H. Tavakoli ,  Tony S. Kaushal ,  Peter Reimer ,  David Jorgensen

IPC: H01J37/00 ,  C04B35/10 ,  C04B35/12 ,  C04B35/14 ,  C04B35/622 ,  C23C16/40 ,  C23C16/455 ,  H01J37/32 ,  H01L21/67

Abstract: Exemplary methods of coating a metal-containing component are described. The methods are developed to increase corrosion resistance and improve coating adhesion to a metal substrate. The methods include forming a bonding layer on a metal substrate, where the bonding layer includes an oxide of a metal in the metal substrate. The coating methods further include depositing a stress buffer layer on the bonding layer, where the stress buffer layer is characterized by a stress buffer layer coefficient of thermal expansion (CTE) that is less than a metal substrate CTE and a bonding layer CTE. The coating methods also include depositing an environmental barrier layer on the stress buffer layer, where a ratio of the metal substrate CTE to an environmental barrier layer CTE is greater than or about 20:1, and where the environmental barrier layer includes silicon oxide. The metal-containing components may be used in fabrication equipment for electronic devices.

公开(公告)号：US20240240304A1

公开(公告)日：2024-07-18

申请号：US18537234

申请日：2023-12-12

Applicant: Applied Materials, Inc.

Inventor： David Jorgensen ,  David Soltz

IPC: C23C14/08 ,  C23C14/06 ,  C23C14/54

CPC classification number: C23C14/083 ,  C23C14/0694 ,  C23C14/548

Abstract: Described herein is a chamber component including a metal oxy-fluoride coating including YF3, ZrF4 or combination thereof and a metal oxide consisting of Y2O3 and ZrO2. The metal oxy-fluoride coating includes 5 mol % to 90 mol % of YF3 or ZrF4 and 10 mol % to 95 mol % of the metal oxide. The metal oxy-fluoride coating is amorphous and has:





35
-
50
⁢


at
.

%

⁢

of
⁢


yttrium
⁢




(
Y
)


;







0.3
-
10
⁢


at
.

%

⁢

of
⁢


zirconium
⁢




(
Zr
)


;







5
-
57
⁢


at
.

%

⁢

of
⁢


oxygen
⁢




(
O
)


;
and






3
-
65
⁢


at
.

%

⁢

of
⁢



fluorine
⁢




(
F
)

.

公开(公告)号：US20230290615A1

公开(公告)日：2023-09-14

申请号：US17691384

申请日：2022-03-10

Applicant: Applied Materials, Inc.

Inventor： Amir H. Tavakoli ,  Tony S. Kaushal ,  Peter Reimer ,  David Jorgensen

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/40 ,  C04B35/622 ,  C04B35/12 ,  C04B35/10 ,  C04B35/14

CPC classification number: H01J37/32495 ,  C23C16/45525 ,  C23C16/403 ,  C23C16/402 ,  C23C16/405 ,  C04B35/62222 ,  C04B35/12 ,  C04B35/10 ,  C04B35/14 ,  H01L21/67069

Abstract: Exemplary methods of coating a metal-containing component are described. The methods are developed to increase corrosion resistance and improve coating adhesion to a metal substrate. The methods include forming a bonding layer on a metal substrate, where the bonding layer includes an oxide of a metal in the metal substrate. The coating methods further include depositing a stress buffer layer on the bonding layer, where the stress buffer layer is characterized by a stress buffer layer coefficient of thermal expansion (CTE) that is less than a metal substrate CTE and a bonding layer CTE. The coating methods also include depositing an environmental barrier layer on the stress buffer layer, where a ratio of the metal substrate CTE to an environmental barrier layer CTE is greater than or about 20:1, and where the environmental barrier layer includes silicon oxide. The metal-containing components may be used in fabrication equipment for electronic devices.