公开(公告)号：US20040196613A1

公开(公告)日：2004-10-07

申请号：US10406889

申请日：2003-04-03

Applicant: Applied Materials, Inc.

Inventor： Hui Zheng ,  Kenneth Tsai ,  Hong Wang ,  Yongxiang He ,  Jesus G. Garcia III ,  Daniel M. Deyo

IPC: H02H001/00

CPC classification number: H01L21/68735 ,  H01L21/6831

Abstract: A guard for an electrostatic chuck includes a ceramic annulus that has an inner surface shaped to fit around a circumference of the electrostatic chuck, and an outer surface having (i) a top portion with a recessed trench and (ii) a side portion. A metal coating is provided on the top portion of the outer surface.

Abstract translation: 静电卡盘的防护件包括陶瓷环，其具有成形为围绕静电卡盘的圆周配合的内表面，以及外表面，其具有（i）具有凹槽的顶部和（ii）侧部。 金属涂层设置在外表面的顶部。

公开(公告)号：US20030118731A1

公开(公告)日：2003-06-26

申请号：US10032387

申请日：2001-12-21

Applicant: Applied Materials, Inc.

Inventor： Yongxiang He ,  Hong Wang ,  Clifford Stow

IPC: B05D001/18 ,  B05D001/08 ,  B05D001/36

CPC classification number: C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C23C4/02 ,  C23C4/131 ,  C23C14/564 ,  C04B41/4527 ,  C04B41/5016 ,  C04B41/53 ,  C04B41/46 ,  C04B41/5072 ,  C04B35/10 ,  C04B35/14 ,  C04B35/565 ,  C04B35/581

Abstract: A method of fabricating a process chamber component that has a ceramic form with grains and grain boundary regions. In the method, the component is bead blasted to provide a surface having a relatively low roughness average of less than about 150 microinches. The component is dipped into a solution having a concentration that is sufficiently low to reduce etching of grain boundary regions of the ceramic form. A metal coating is formed over at least a portion of the ceramic form. The component fabricated by this method can tolerate thicker deposits of sputtered material in a sputtering process without the sputtered deposit accumulates causing spalling of the coating of the component.

Abstract translation: 一种制造具有晶粒和晶界区域的陶瓷形式的处理室部件的方法。 在该方法中，将组分进行喷砂处理以提供具有小于约150微英寸的较低粗糙度平均值的表面。 将该组分浸入浓度足够低的溶液中以减少陶瓷形式的晶界区域的蚀刻。 在陶瓷形式的至少一部分上形成金属涂层。 通过该方法制造的部件可以在溅射过程中容忍较厚的溅射材料沉积物，而不会使溅射沉积物堆积，导致部件涂层剥落。

公开(公告)号：US20040163669A1

公开(公告)日：2004-08-26

申请号：US10742604

申请日：2003-12-19

Applicant: Applied Materials, Inc.

Inventor： Karl Brueckner ,  Hong Wang

IPC: B08B003/04

CPC classification number: C23G1/125 ,  B24C1/06 ,  C22B7/007 ,  C23C14/564 ,  C23F1/36 ,  Y02P10/234 ,  Y10S134/902

Abstract: In a method of cleaning metal-containing deposits such as tantalum from a surface of a process chamber component, such as a metal surface, the surface is immersed in a cleaning solution. In one version, the cleaning solution is a solution having HF and HNO3 in a ratio that removes deposits from the surface substantially without eroding the surface. In another version, the cleaning solution is a solution having KOH and H2O2. The solution can be treated after cleaning the surface to recover tantalum-containing materials and one or more of the cleaning solutions.

Abstract translation: 在诸如金属表面的处理室部件的表面上清洗含金属沉积物如钽的方法中，将表面浸入清洁溶液中。 在一个版本中，清洁溶液是具有HF和HNO 3的溶液，其比例从基本上不侵蚀表面去除表面的沉积物。 在另一个版本中，清洁溶液是具有KOH和H 2 O 2的溶液。 在清洁表面后可以处理溶液以回收含钽材料和一种或多种清洁溶液。

公开(公告)号：US20040099285A1

公开(公告)日：2004-05-27

申请号：US10304535

申请日：2002-11-25

Applicant: Applied Materials, Inc.

Inventor： Hong Wang ,  Yongxiang He ,  Clifford C. Stow

IPC: B08B009/04

CPC classification number: C23G1/125 ,  B24C1/06 ,  C22B7/007 ,  C23C14/564 ,  C23F1/36 ,  Y02P10/234 ,  Y10S134/902

Abstract: In a method of cleaning and refurbishing a process chamber component having a metal coating having a surface thereon, the surface of the metal coating is immersed in an acidic solution to remove at least a portion of the process deposits from the surface. Thereafter, the surface of the metal coating is immersed in a basic solution to remove substantially all the metal coating. The component may optionally be bead blasting to roughen a surface of the component, and the metal coating may be reformed.

Abstract translation: 在清洁和翻新具有其上具有表面的金属涂层的处理室部件的方法中，将金属涂层的表面浸入酸性溶液中以从表面除去至少一部分工艺沉积物。 此后，将金属涂层的表面浸入碱性溶液中以除去基本上所有的金属涂层。 组分可以任选地是珠粒喷涂以使组分的表面粗糙化，并且金属涂层可以被重整。

公开(公告)号：US20030188685A1

公开(公告)日：2003-10-09

申请号：US10119382

申请日：2002-04-08

Applicant: Applied Materials, Inc.

Inventor： Hong Wang ,  Yongxiang He ,  Yixing Lin ,  Edwin C. Weldon ,  Clifford Stow

IPC: C23C014/00 ,  C23C016/00 ,  H01L021/306 ,  B23K026/38

CPC classification number: H01J37/32458 ,  B23K26/384 ,  B23K26/389 ,  B23K2103/05 ,  B23K2103/10 ,  B23K2103/14 ,  C23C16/4404 ,  H01J2237/0206

Abstract: A substrate processing chamber has a component having a surface that is exposed inside the chamber. The exposed surface can have a pattern of recesses that are spaced apart from one another, each recess having an opening, sidewalls, and a bottom wall. The recesses are formed by directing a pulsed laser beam onto a position on a surface of the structure for a time sufficiently long to vaporize a portion of the structure at that position. The component can also be a gas distributor having an enclosure with plurality of laser drilled gas outlets having first and second openings with different diameters to reduce an ingress of a plasma into the enclosure. The laser drilled gas outlets can also have rounded edges.

Abstract translation: 衬底处理室具有暴露在腔室内的表面的部件。 暴露的表面可以具有彼此间隔开的凹部的图案，每个凹部具有开口，侧壁和底壁。 通过将脉冲激光束引导到结构表面上的时间足够长以在该位置上蒸发结构的一部分来形成凹陷。 该部件还可以是具有多个具有不同直径的第一和第二开口的具有多个激光钻孔气体出口的外壳的气体分配器，以减少等离子体进入外壳的入口。 激光钻孔气体出口也可以具有圆形边缘。

公开(公告)号：US20030150530A1

公开(公告)日：2003-08-14

申请号：US10071869

申请日：2002-02-08

Applicant: Applied Materials, Inc.

Inventor： Yixing Lin ,  Brian T. West ,  Hong Wang ,  Shun Jackson Wu ,  Jennifer Y. Sun ,  Clifford C. Stow ,  Senh Thach

IPC: C25D003/44

CPC classification number: C25D11/16 ,  C25D11/04 ,  C25D11/045

Abstract: We have discovered that the formation of particulate inclusions at the surface of an aluminum alloy article, which inclusions interfere with a smooth transition from the alloy surface to an overlying aluminum oxide protective film can be controlled by maintaining the content of mobile impurities within a specific range and controlling the particulate size and distribution of the mobile impurities and compounds thereof; by heat-treating the aluminum alloy at a temperature less than about 330null C.; and by creating the aluminum oxide protective film by employing a particular electrolytic process. When these factors are taken into consideration, an improved aluminum oxide protective film is obtained.

Abstract translation: 我们已经发现，通过将移动杂质的含量保持在特定范围内，可以控制在铝合金制品表面形成的夹杂物，其夹杂物干扰从合金表面到上覆的氧化铝保护膜的平滑过渡 并控制可移动杂质及其化合物的颗粒尺寸和分布; 通过在低于约330℃的温度下对铝合金进行热处理; 并通过使用特定的电解工艺制备氧化铝保护膜。 当考虑这些因素时，获得改进的氧化铝保护膜。