公开(公告)号：DE4232998A1

公开(公告)日：1994-04-07

申请号：DE4232998

申请日：1992-10-01

Applicant: BASF AG

Inventor： HARTH KLAUS DR ,  HIBST HARTMUT DR ,  BROSIUS SIBYLLE DR ,  HINTZE-BRUENING HORST DR ,  HOLST ANDREAS DR ,  OSLOWSKI HANS-JOSEF DR

IPC: B05D3/14 ,  B29C59/14 ,  H01J37/32 ,  B05D3/00 ,  B05D3/12

Abstract: Method for treating the surface of plastic parts (T) by low-pressure plasma processing, wherein an electrically conductive device with apertures is placed between the plastic part (T) and the plasma zone (A).

公开(公告)号：DE4233000A1

公开(公告)日：1994-04-07

申请号：DE4233000

申请日：1992-10-01

Applicant: BASF AG

Inventor： HARTH KLAUS DR ,  HIBST HARTMUT DR ,  BROSIUS SIBYLLE DR ,  HINTZE-BRUENING HORST DR ,  HOLST ANDREAS DR ,  DUSCHEK WOLFGANG DR ,  OSLOWSKI HANS-JOSEF DR

IPC: B05D1/04 ,  C09D5/46 ,  C23C14/08 ,  C23C14/20 ,  C23C16/06 ,  C23C16/40 ,  B05D3/00 ,  B05D1/02 ,  B05D7/02 ,  C08J7/06 ,  C09D5/24

Abstract: The invention pertains to a method of pretreating plastic components for electrostatic enamelling by applying a thin film of an electrically conductive material in a plasma atmosphere.