公开(公告)号：DE3118021A1

公开(公告)日：1982-11-25

申请号：DE3118021

申请日：1981-05-07

Applicant: BASF AG

Inventor： CLAD WERNER DIPL ING DR ,  MAYER JOHANN DIPL CHEM DR ,  KIPPENBERGER WUNIBALD

IPC: B27N1/00 ,  C08L97/02 ,  B29J5/00

Abstract: Low density chipboards are obtained by adding fine-particulate solid paraffin or wax with a melting point above 100 DEG C to the chip mixture to be pressed, cavities being produced by melting the wax after the boards are cured.

公开(公告)号：DE2336979A1

公开(公告)日：1975-02-06

申请号：DE2336979

申请日：1973-07-20

Applicant: BASF AG

Inventor： KIPPENBERGER WUNIBALD ,  FROEDE OTTO DIPL-HOLZW DR

IPC: B27N9/00 ,  C08L97/02 ,  B29J5/00

Abstract: Difficulty flammable wood prods. are made by treating a mixt. of wood chips and flame-retardant with a part of the binder, drying the composite, adding the rest of the binder and curing. As most flame-resisting additives are acidic in nature, storability. viscosity and/or concn. problems arising when the normal prodn. processes are followed are obviated by using the present sequence. The optimum degree of re-wetting of the dried chips prior to moulding can be effected. Conventional (aminoplast) binders may be used. These may contain 10-15 wt% of the flame-resisting additive (e.g. H3BO3, (NH4)3PO4, NH4BR, urea or melamine and, esp. mixts. thereof with, e.g. kaolin). Impregnation of the chips with the dil. resin compsn. is continued till the desired uptake of additive has been reached (e.g. 10%, based on dry chips wt.) after which the chips are dried to, e.g. 2-5% before addn., when reqd. of the remainder of the binder.

公开(公告)号：DE4308846A1

公开(公告)日：1994-09-22

申请号：DE4308846

申请日：1993-03-19

Applicant: BASF AG

Inventor： HERMELING DIETER DR ,  HANNEBAUM HEINZ ,  KIPPENBERGER WUNIBALD

IPC: C25B3/23 ,  C25B3/02 ,  C07C43/307

Abstract: Electrochemical preparation of terephthalaldehyde tetraalkyl acetals I in which R is C1-C6-alkyl, by the process of compounds (II) or their mixtures, which are formed, in addition to I and p-tolylaldehyde dialkyl acetal (III), during the electrochemical oxidation of p-xylene in the presence of a neutral supporting electrolyte or an acid in alkanolic solution, after I and, if required, part of the oxidation products II and III have largely been separated, being subjected to further electrochemical oxidation.