3.
    发明专利
    未知

    公开(公告)号:DE4229244A1

    公开(公告)日:1994-03-03

    申请号:DE4229244

    申请日:1992-09-02

    Applicant: BASF AG

    Abstract: The invention relates to a process for making microstructures having structure depths ranging from several mu m up into the mm region by imagewise irradiation of polymers with X-rays and removal of the imagewise irradiated regions of the polymers. Before the imagewise irradiation, the polymers, which have layer thicknesses ranging from several mu m up into the mm region are applied under pressure to an electrically conductive base and firmly anchored by melting in a frame and using a pressure ram. The process according to the invention is suitable, in particular, for making microstructures having structure depths of between 3 mu m and 2000 mu m and very fine lateral dimensions of less than 10 mu m.

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