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公开(公告)号:DE59608701D1
公开(公告)日:2002-03-21
申请号:DE59608701
申请日:1996-11-22
Applicant: BASF AG
Abstract: Bis(dimenthylphosphino)methane (IA), (dimenthylphosphino)(diphenylphosphino)methane (IB) and (dimenthylphosphino)(di-tert.-butylphosphino)methane (IC) are claimed. Also claimed is a method of preparing methylene-bridged compounds of formula (R X)(R X)E CH2E )(XR ) (I) with di:organyl-phosphino, -arsino and/or -stibino groups.
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公开(公告)号:DE59800480D1
公开(公告)日:2001-04-05
申请号:DE59800480
申请日:1998-07-20
Applicant: BASF AG
Inventor: GOTTSCHALK DR , GRUTKE DR , PIPPER DR , WOLF DR , WEBER DR
Abstract: A moulding composition comprising: (a) 5-95 wt.% random copolyamide (I) of (a1) 95.1-99.9 wt.% component (IA) of equimolar amounts of linear aliphatic diamine(s) and linear aliphatic dicarboxylic acid(s) and (a2) 0.1-4.9 wt.% component (IB) of equimolar amounts of linear aliphatic diamine(s) and isophthalic acid; and (b) 5-95 wt.% other copolymer (II), selected from (b1) optionally modified polyarylene ether(s) (IIA), (b2) component (IIB) a mixture of 60-99 wt.% (co)polyolefin(s) (IIB.1) and 1-40 wt.% modified (co)polyolefin(s) (IIB.2) or (b3) a component (IIC) comprising 70-100 wt.% styrene-acrylonitrile (SAN), acrylonitrile-butadiene-styrene (ABS) and/or acrylonitrile-styrene-acrylic ester (ASA) polymer(s) (IIC.1) and 0-30 wt.% modified SAN, ABS or ASA polymer(s) (IIC.2). The composition may also contain: (c) 0-20 wt.% impact modifier(s), (d) 0-50 wt.% filler(s) and (e) 0-20 wt.% usual additives. Also claimed are: (i) a method of producing the composition; and (ii) mouldings, fibers, or films produced from the composition.
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