公开(公告)号：JPH08175566A

公开(公告)日：1996-07-09

申请号：JP21060295

申请日：1995-08-18

Applicant: BASF MAGNETICS GMBH

Inventor： KURAUSU SHIETORE ,  HAINRITSUHI BUORENZATSUKU ,  GERARUTOOBUORUFUGANGU BORUKU ,  HANSU DEIITAA EERUHARUTO

IPC: B65D71/02 ,  B65D71/00 ,  C09J7/02

Abstract: PROBLEM TO BE SOLVED: To provide a strip piece capable of easily releasing bundling to separate individual objects without providing the perforation breaking line provided to a conventional bundling strip piece heretofore and having a mark capable of identifying respective objects and bundled matter and the bundled matter bundled by the strip piece. SOLUTION: Bundled matter is formed by bonding at least one bonding and bundling strip piece 5a not having a weakened cutting line like a perforation line to stacked objects K1-K3 over the joints of them and the individual mark of at least one of the stacked objects K1-K3 is at least partially concealed.