公开(公告)号：US09416298B2

公开(公告)日：2016-08-16

申请号：US14402975

申请日：2013-05-21

Applicant: BASF SE

Inventor： Yuzhuo Li ,  Bastian Marten Noller ,  Christophe Gillot ,  Diana Franz

IPC: C09G1/02 ,  H01L21/304 ,  H01L21/302 ,  H01L21/321 ,  H01L21/461 ,  H01L21/306 ,  H01L21/02

CPC classification number: C09G1/02 ,  B81C2201/0121 ,  B81C2201/0123 ,  B81C2201/0126 ,  H01L21/02024 ,  H01L21/302 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/3212 ,  H01L21/461

Abstract: A process for the manufacture of semiconductor devices comprising the chemical-mechanical polishing of a substrate or layer containing at least one III-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one amphiphilic non-ionic surfactant having (b1) at least one hydrophobic group; and (b2) at least one hydrophilic group selected from the group consisting of polyoxyalkylene groups comprising (b22) oxyalkylene monomer units other than oxyethylene monomer units; and (M) an aqueous medium.

Abstract translation: 一种用于制造半导体器件的方法，包括在化学机械抛光组合物（Q1）的存在下对包含至少一种III-V材料的基底或层进行化学机械抛光，所述化学机械抛光组合物包含（A）无机颗粒，有机颗粒， 或其混合物或复合物，（B）至少一种具有（b1）至少一个疏水基团的两亲性非离子表面活性剂; 和（b2）至少一种选自包含（b22）氧化烯单体单元以外的氧化烯单体单元的聚氧化烯基的亲水基团; 和（M）水性介质。

公开(公告)号：US20150175845A1

公开(公告)日：2015-06-25

申请号：US14402975

申请日：2013-05-21

Applicant: BASF SE

Inventor： Yuzhuo Li ,  Bastian Marten Noller ,  Christophe Gillot ,  Diana Franz

IPC: C09G1/02 ,  H01L21/306

CPC classification number: C09G1/02 ,  B81C2201/0121 ,  B81C2201/0123 ,  B81C2201/0126 ,  H01L21/02024 ,  H01L21/302 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/3212 ,  H01L21/461

Abstract: A process for the manufacture of semiconductor devices comprising the chemical-mechanical polishing of a substrate or layer containing at least one III-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one amphiphilic non-ionic surfactant having (b1) at least one hydrophobic group; and (b2) at least one hydrophilic group selected from the group consisting of polyoxyalkylene groups comprising (b22) oxyalkylene monomer units other than oxyethylene monomer units; and (M) an aqueous medium.

Abstract translation: 一种用于制造半导体器件的方法，包括在化学机械抛光组合物（Q1）的存在下对包含至少一种III-V材料的基底或层进行化学机械抛光，所述化学机械抛光组合物包含（A）无机颗粒，有机颗粒， 或其混合物或复合物，（B）至少一种具有（b1）至少一个疏水基团的两亲性非离子表面活性剂; 和（b2）至少一种选自包含（b22）氧化烯单体单元以外的氧化烯单体单元的聚氧化烯基的亲水基团; 和（M）水性介质。

公开(公告)号：US10219515B2

公开(公告)日：2019-03-05

申请号：US15524759

申请日：2015-11-03

Applicant: BASF SE

Inventor： Joanna Mecfel-Marczewski ,  Matthias Krejca ,  Diana Franz ,  Matthias Bratz ,  Rainer Berghaus ,  Diana Westfalia Moran Puente ,  Sophie Putzien

IPC: A01N47/06 ,  A01N37/50 ,  A01N57/20 ,  A01N25/02 ,  C07D325/00

Abstract: The present invention relates to a method for preparing a tank mix, which comprises the step of contacting a pesticide formulation, water, and a tank mix adjuvant which comprises a carbonate of the formula (I); to a pesticide formulation comprising the tank mix adjuvant; to a method of controlling phytopathogenic fungi and/or undesired vegetation and/or undesired insect or mite attack and/or for regulating the growth of plants, wherein the tank mix or the pesticide formulation is allowed to act on the respective pests, their environment or the plants to be protected from the respective pest, on the soil and/or on undesired plants and/or the crop plants and/or their environment; and to a use of the tank mix adjuvant for increasing the efficacyl of a pesticide.

公开(公告)号：US20150099361A1

公开(公告)日：2015-04-09

申请号：US14394870

申请日：2013-04-29

Applicant: BASF SE

Inventor： Diana Franz ,  Bastian Marten Noller

IPC: C09G1/02 ,  H01L21/306

CPC classification number: C09G1/02 ,  C09K3/1463 ,  H01L21/02024 ,  H01L21/30625

Abstract: A process for the manufacture of semiconductor devices is provided. The process comprises the chemical-mechanical polishing of a substrate or layer containing at least one III-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a polymer comprising at least one N-heterocycle, and (M) an aqueous medium and whereas Q1 has a pH of from 1.5 to 4.5.

Abstract translation: 提供了一种制造半导体器件的方法。 该方法包括在包含（A）无机颗粒，有机颗粒或其混合物或复合物的化学机械抛光组合物（Q1）的存在下对包含至少一种III-V材料的基材或层进行化学机械抛光 ，（B）包含至少一个N-杂环的聚合物和（M）水性介质，而Q1的pH为1.5-4.5。