公开(公告)号：DE602006011734D1

公开(公告)日：2010-03-04

申请号：DE602006011734

申请日：2006-05-22

Applicant: BASF SE

Inventor： TANABE JUNICHI ,  OKA HIDETAKA ,  YAMAMOTO HIROSHI

IPC: C09K11/06

公开(公告)号：DE60330802D1

公开(公告)日：2010-02-11

申请号：DE60330802

申请日：2003-11-19

Applicant: BASF SE

Inventor： OKA HIDETAKA ,  ADAM JEAN-MARIE

IPC: G03F7/027 ,  G03F7/038 ,  G03F7/105 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28

Abstract: The present invention relates to a photosensitive resin composition comprising a) as a component (A) a green colorant of the formula (I) in which the rings A, B, C and D are substituted by hydroxy or by moiety wherein R, is hydrogen or C1,-C4.-Alkyl, R2 is hydrogen or C1,-C4-Alkyl, n is 0, 1, 2 or 3 and the ring E is unsubstituted or substituted by C1,-C6alkyl, C1,-C6alkoxy, hydroxy, NHCOR3, NHSO2, R4 or SO2NHR5, wherein R3, is C1,-C4,-Alkyl or phenyl, R4, is C1,-C4-Alkyl or phenyl and R5 is C1,-C4-Alkyl or phenyl, b) as a component (B) an alkali soluble oligomer or polymer (reactive or unreactive), c) as a component (C) a polymerizable monomer, d) as a component (D) a photoinitiator, e) as a component (E) an epoxy compound, and also, if desired, f) as a component (F) further additives, used as solder resist, etching resist or plating resist in the manufacture of printed circuit boards.

公开(公告)号：AT455162T

公开(公告)日：2010-01-15

申请号：AT06777232

申请日：2006-05-22

Applicant: BASF SE

Inventor： TANABE JUNICHI ,  OKA HIDETAKA ,  YAMAMOTO HIROSHI

IPC: C09K11/06

公开(公告)号：AT453877T

公开(公告)日：2010-01-15

申请号：AT03796025

申请日：2003-11-19

Applicant: BASF SE

Inventor： OKA HIDETAKA ,  ADAM JEAN-MARIE

IPC: G03F7/027 ,  G03F7/038 ,  G03F7/105 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28

Abstract: The present invention relates to a photosensitive resin composition comprising a) as a component (A) a green colorant of the formula (I) in which the rings A, B, C and D are substituted by hydroxy or by moiety wherein R, is hydrogen or C1,-C4.-Alkyl, R2 is hydrogen or C1,-C4-Alkyl, n is 0, 1, 2 or 3 and the ring E is unsubstituted or substituted by C1,-C6alkyl, C1,-C6alkoxy, hydroxy, NHCOR3, NHSO2, R4 or SO2NHR5, wherein R3, is C1,-C4,-Alkyl or phenyl, R4, is C1,-C4-Alkyl or phenyl and R5 is C1,-C4-Alkyl or phenyl, b) as a component (B) an alkali soluble oligomer or polymer (reactive or unreactive), c) as a component (C) a polymerizable monomer, d) as a component (D) a photoinitiator, e) as a component (E) an epoxy compound, and also, if desired, f) as a component (F) further additives, used as solder resist, etching resist or plating resist in the manufacture of printed circuit boards.

公开(公告)号：DE60234095D1

公开(公告)日：2009-12-03

申请号：DE60234095

申请日：2002-06-04

Applicant: BASF SE

Inventor： KUNIMOTO KAZUHIKO ,  TANABE JUNICHI ,  KURA HISATOSHI ,  OKA HIDETAKA ,  OHWA MASAKI

IPC: C08F2/50 ,  G02B5/20 ,  C07C251/64 ,  C07C251/66 ,  C07C323/22 ,  C07C323/47 ,  C07D209/86 ,  C07D311/16 ,  C08F10/00 ,  G03F7/031 ,  H01L21/027

Abstract: Compounds of the formulae I, II and III wherein R 1 is for example hydrogen, C 3 -C 8 cycloalkyl, C 1 -C 12 alkyl, phenyl unsubstituted or substituted; R 2 and R 2 ' for example are hydrogen, C 1 -C 20 alkyl, C 3 -C 8 cycloalkyl or phenyl, unsubstituted or substituted, or are Ar 1 is for example phenyl, optionally substituted by e.g. Ar 2 is for example phenylene, optionally substituted e.g. by -(CO)R 7 , (D), (E) or (F); Ar 3 is for example phenyl; M 1 , M 2 and M 3 are, for example, C 1 -C 20 alkylene; M 4 is for example direct bond, -O-, -S-, -Y-(C 1 -C 10 alkylene)-Y'-, optionally substituted; Y and Y' are for example a direct bond or -O-; R 7 is for example hydrogen, C 1 -C 20 alkyl or phenyl, optionally substituted; R 8 , R 9 , R 8 ' and R 9 ' are for example hydrogen or C 1 -C 12 alkyl, exhibit an unexpectedly good performance in photopolymerization reactions.

公开(公告)号：ES2375471T3

公开(公告)日：2012-03-01

申请号：ES02758358

申请日：2002-07-18

Applicant: BASF SE

Inventor： KURA HISATOSHI ,  OKA HIDETAKA ,  OHWA MASAKI

IPC: G03F7/031 ,  C08F2/50 ,  G02B5/20 ,  G03F7/00 ,  G03F7/004 ,  H01L21/027 ,  H01L51/50 ,  H05B33/10

Abstract: Una composición fotosensible que comprende, (A) un oligómero o polímero que contiene al menos un grupo de ácido carboxílico en la molécula y tiene un peso molecular de 200000 o menos; (B) al menos un compuesto fotoiniciador de fórmula I R1 es alquiloC1-C12 lineal o ramificado; R2 es alquilo C1-C4 lineal o ramificado; R3 y R4 independientemente uno de otro son alquilo C1-C8 lineal o ramificado; y (C) un compuesto monomérico, oligomérico o polimérico que tiene al menos un doble enlace olefínico.

公开(公告)号：AT530951T

公开(公告)日：2011-11-15

申请号：AT02758358

申请日：2002-07-18

Applicant: BASF SE

Inventor： KURA HISATOSHI ,  OKA HIDETAKA ,  OHWA MASAKI

IPC: G03F7/031 ,  C08F2/50 ,  G02B5/20 ,  G03F7/00 ,  G03F7/004 ,  H01L21/027 ,  H01L51/50 ,  H05B33/10

Abstract: A photopolymerization process for producing pigmented and non-pigmented articles comprises irradiating with electromagnetic radiation in the range from 190 to 600 nm, or with electron beam or with X-rays a photosensitive composition which can be developed by alkali solution which composition comprises (A) a polymer containing at least one carboxylic acid group in the molecule and having a molecular weight of 200,000 or less, (B) selected alpha-aminoalkylphenone compounds as photoinitiators and (C) an ester of a polyol, wherein the polyol is partially or fully esterified with an ethylenically unsaturated carboxylic acid a monomeric, oligomeric or polymeric compound having at least one olefinic double bond.

公开(公告)号：AT446322T

公开(公告)日：2009-11-15

申请号：AT02778878

申请日：2002-06-04

Applicant: BASF SE

Inventor： KUNIMOTO KAZUHIKO ,  TANABE JUNICHI ,  KURA HISATOSHI ,  OKA HIDETAKA ,  OHWA MASAKI

IPC: C08F2/50 ,  G02B5/20 ,  C07C251/64 ,  C07C251/66 ,  C07C323/22 ,  C07C323/47 ,  C07D209/86 ,  C07D311/16 ,  C08F10/00 ,  G03F7/031 ,  H01L21/027

Abstract: Compounds of the formulae I, II and III wherein R 1 is for example hydrogen, C 3 -C 8 cycloalkyl, C 1 -C 12 alkyl, phenyl unsubstituted or substituted; R 2 and R 2 ' for example are hydrogen, C 1 -C 20 alkyl, C 3 -C 8 cycloalkyl or phenyl, unsubstituted or substituted, or are Ar 1 is for example phenyl, optionally substituted by e.g. Ar 2 is for example phenylene, optionally substituted e.g. by -(CO)R 7 , (D), (E) or (F); Ar 3 is for example phenyl; M 1 , M 2 and M 3 are, for example, C 1 -C 20 alkylene; M 4 is for example direct bond, -O-, -S-, -Y-(C 1 -C 10 alkylene)-Y'-, optionally substituted; Y and Y' are for example a direct bond or -O-; R 7 is for example hydrogen, C 1 -C 20 alkyl or phenyl, optionally substituted; R 8 , R 9 , R 8 ' and R 9 ' are for example hydrogen or C 1 -C 12 alkyl, exhibit an unexpectedly good performance in photopolymerization reactions.