POLYHEDRAL OLIGOMERIC STANNASILSESQUIOXANES AS CATALYST FOR POLYURETHANE CURING
    2.
    发明申请
    POLYHEDRAL OLIGOMERIC STANNASILSESQUIOXANES AS CATALYST FOR POLYURETHANE CURING 审中-公开
    作为聚氨酯固化催化剂的聚氧乙烯低聚硅烷基聚氧乙烯

    公开(公告)号:WO2009065873A2

    公开(公告)日:2009-05-28

    申请号:PCT/EP2008065869

    申请日:2008-11-19

    Abstract: The invention relates to a curable composition comprising the following components: (A) at least one isocyanate, (B) at least one binder, and (C) at least one polyhedral oligomeric silsesquioxane, with the number of cages z per molecule being 2 or 3 and the number of tin atoms per molecule being at least one. Furthermore, the invention refers to a kit of parts comprising as components A), B), and C); to the use of the polyhedral oligomeric silsesquioxanes in coatings, lacquers, paintings, films and polymer compositions; to coatings obtainable by curing of these compositions; and to the use of polyhedral oligomeric silsesquioxanes containing at least one metal atom, in particular polyhedral oligomeric stannasilsesquioxane to increase the scratch resistance of coatings.

    Abstract translation: 本发明涉及包含以下组分的可固化组合物:(A)至少一种异氰酸酯,(B)至少一种粘合剂和(C)至少一种多面体低聚倍半硅氧烷,每个分子的笼数z为2或 3,每个分子的锡原子数至少为1。 此外,本发明涉及包含作为组分A),B)和C)的试剂盒。 涉及在涂料,油漆,油漆,膜和聚合物组合物中使用多面体低聚倍半硅氧烷; 通过这些组合物的固化可获得的涂层; 以及使用含有至少一个金属原子的多面体低聚倍半硅氧烷,特别是多面体低聚倍半硅氧烷,以增加涂层的耐刮擦性。

    METHOD OF MAKING POROUS MATERIALS AND POROUS MATERIALS PREPARED THEREOF

    公开(公告)号:MY177445A

    公开(公告)日:2020-09-15

    申请号:MYPI2010005095

    申请日:2009-05-20

    Applicant: BASF SE

    Abstract: The present invention concerns a method of making a porous material comprising the following steps in the order a-b-c-d: (a) reacting at least one organosilane (A} with water in the presence of a solvent (C) to form a polymeric material, (b) subjecting said polymeric material to a first heat treatment, (c) bringing said polymeric material into contact with at least one dehydroxylation (d) agent (D), (e) subjecting said polymeric material to electromagnetic radiation and/or to a further heat treatment. The present invention furthermore concerns the porous material obtainable by the inventive method, semiconductor devices and electronic components comprising said porous material, and the use of said material for electrical insulation and in microelectronic devices, membranes. displays and sensors.

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