公开(公告)号：WO2009150021A2

公开(公告)日：2009-12-17

申请号：PCT/EP2009056160

申请日：2009-05-20

Applicant: BASF SE ,  KLIPP ANDREAS ,  WAGNER NORBERT ,  ZAGAR CYRILL ,  FECHTENKOETTER ANDREAS ,  PENG CHIH-CHENG ,  SHIH CHIEN HSUEH STEVE ,  SUJANDI SUJANDI

Inventor： KLIPP ANDREAS ,  WAGNER NORBERT ,  ZAGAR CYRILL ,  FECHTENKOETTER ANDREAS ,  PENG CHIH-CHENG ,  SHIH CHIEN HSUEH STEVE ,  SUJANDI SUJANDI

IPC: C08G77/06 ,  C08J9/00 ,  C08J9/232

CPC classification number: C08G77/06 ,  B01D53/228 ,  B01D71/70 ,  C08J9/28 ,  C08J2383/04 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02343 ,  H01L21/02348 ,  H01L21/3121

Abstract: The present invention concerns a method of making a porous material comprising the following steps in the order a-b-c-d: (a) reacting at least one organosilane (A) with water in the presence of a solvent (C) to form a polymeric material, (b) subjecting said polymeric material to a first heat treatment, (c) bringing said polymeric material into contact with at least one dehydroxylation agent (D), (d) subjecting said polymeric material to electromagnetic radiation and/or to a further heat treatment. The present invention furthermore concerns the porous material obtainable by the inventive method, semiconductor devices and electronic components comprising said porous material, and the use of said material for electrical insulation and in microelectronic devices, membranes, displays and sensors.

Abstract translation: 本发明涉及制备多孔材料的方法，其顺序包括以下步骤：（a）在溶剂（C）存在下使至少一种有机硅烷（A）与水反应形成聚合物材料，（b ）使所述聚合材料经受第一热处理，（c）使所述聚合材料与至少一种脱羟基化剂（D）接触，（d）使所述聚合材料经受电磁辐射和/或进一步热处理。 本发明还涉及通过本发明方法可获得的多孔材料，包括所述多孔材料的半导体器件和电子部件以及所述用于电绝缘的材料以及在微电子器件，膜，显示器和传感器中的用途。

公开(公告)号：MY177445A

公开(公告)日：2020-09-15

申请号：MYPI2010005095

申请日：2009-05-20

Applicant: BASF SE

Inventor： WAGNER NORBERT ,  KLIPP ANDREAS ,  ZAGAR CYRILL ,  FECHTENKOTTER ANDREAS ,  PENG CHIH-CHENG ,  SHIH CHIEN HSUEH STEVE ,  SUJANDI SUJANDI

Abstract: The present invention concerns a method of making a porous material comprising the following steps in the order a-b-c-d: (a) reacting at least one organosilane (A} with water in the presence of a solvent (C) to form a polymeric material, (b) subjecting said polymeric material to a first heat treatment, (c) bringing said polymeric material into contact with at least one dehydroxylation (d) agent (D), (e) subjecting said polymeric material to electromagnetic radiation and/or to a further heat treatment. The present invention furthermore concerns the porous material obtainable by the inventive method, semiconductor devices and electronic components comprising said porous material, and the use of said material for electrical insulation and in microelectronic devices, membranes. displays and sensors.