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公开(公告)号：CA2806936A1
公开(公告)日：2012-02-09
申请号：CA2806936
申请日：2011-08-02
Applicant: BASF SE
Inventor： SEELMANN-EGGEBERT HANS-PETER , SENF ANDREAS , ROESCH MARKUS , BENTELE JOACHIM , SCHMIDT KATI , STEFANOWSKI UDO
IPC: C10M107/30
Abstract: The invention relates to improved novel carrier fluids for abrasives, especially cutting fluids, for wafer production. The invention also relates to the use of said fluids and to a method for cutting wafers.
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公开(公告)号：ES2525017T3
公开(公告)日：2014-12-16
申请号：ES11738239
申请日：2011-08-02
Applicant: BASF SE
Inventor： SEELMANN-EGGEBERT HANS-PETER , SENF ANDREAS , ROESCH MARKUS , BENTELE JOACHIM , SCHMIDT KATI , STEFANOWSKI UDO
IPC: C10M107/30
Abstract: Uso de compuestos de fórmula I R1 [O (EO)x (AO)y H]z en la que significan R1 un resto alquilo z-valente con 1 a 20 átomos de C (EO) resto etilenoxilo (AO) resto alquilenoxilo con 3 a 10 átomos de C x un número de 3 a 12, en particular de 5 a 10 y un número de 0 a 10, en particular de 4 a 8 z un número de 1 a 6, en particular de 1 a 3 para la producción de líquidos portadores para abrasivos, en particular líquidos de corte, con absorción de agua reducida para el desprendimiento de material, en particular para el aserrado de obleas con una sierra de alambre, con un contenido de agua de menos del 1 % en peso.
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公开(公告)号：AU2011287623B2
公开(公告)日：2014-10-30
申请号：AU2011287623
申请日：2011-08-02
Applicant: BASF SE
Inventor： SEELMANN-EGGEBERT HANS-PETER , SENF ANDREAS , ROESCH MARKUS , BENTELE JOACHIM , SCHMIDT KATI , STEFANOWSKI UDO
IPC: C10M107/30
Abstract: The invention relates to improved novel carrier fluids for abrasives, especially cutting fluids, for wafer production. The invention also relates to the use of said fluids and to a method for cutting wafers.
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Patent Agency Ranking">
公开(公告)号：BR112013002486A2
公开(公告)日：2016-05-31
申请号：BR112013002486
申请日：2011-08-02
Applicant: BASF SE
Inventor： SENF ANDREAS , SEELMANN-EGGEBERT HANS-PETER , BENTELE JOACHIM , SCHMIDT KATI , ROESCH MARKUS , STEFANOWSKI UDO
IPC: C10M107/30
Abstract: uso de compostos, fluido de suporte, uso de um fluido de suporte, métodos para cortar pastilhas, e para polir materiais, pastilha, e, composto. a invenção refere-se a novos fluidos de suporte para abrasivos melhorados, especialmente, fluidos de corte, para a produção de pastilha. a invenção também refere-se ao uso de ditos fluiidos e a um método para cortar pastilhas.
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公开(公告)号：AU2011287623A1
公开(公告)日：2013-02-21
申请号：AU2011287623
申请日：2011-08-02
Applicant: BASF SE
Inventor： SEELMANN-EGGEBERT HANS-PETER , SENF ANDREAS , ROESCH MARKUS , BENTELE JOACHIM , SCHMIDT KATI , STEFANOWSKI UDO
IPC: C10M107/30
Abstract: The invention relates to improved novel carrier fluids for abrasives, especially cutting fluids, for wafer production. The invention also relates to the use of said fluids and to a method for cutting wafers.
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公开(公告)号：SG187691A1
公开(公告)日：2013-03-28
申请号：SG2013008172
申请日：2011-08-02
Applicant: BASF SE
Inventor： SEELMANN-EGGEBERT HANS-PETER , SENF ANDREAS , ROESCH MARKUS , BENTELE JOACHIM , SCHMIDT KATI , STEFANOWSKI UDO
Abstract: Carrier fluids for abrasivesAbstractThe invention relates to improved novel fluids for abrasives, in particular cutting fluids, for wafer production, the use thereof and a method of cutting wafers. No suitable figure
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公开(公告)号：PL2601280T3
公开(公告)日：2015-03-31
申请号：PL11738239
申请日：2011-08-02
Applicant: BASF SE
Inventor： SEELMANN-EGGEBERT HANS-PETER , SENF ANDREAS , ROESCH MARKUS , BENTELE JOACHIM , SCHMIDT KATI , STEFANOWSKI UDO
IPC: C10M107/30
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公开(公告)号：AU2011287623B9
公开(公告)日：2014-11-06
申请号：AU2011287623
申请日：2011-08-02
Applicant: BASF SE
Inventor： SEELMANN-EGGEBERT HANS-PETER , SENF ANDREAS , ROESCH MARKUS , BENTELE JOACHIM , SCHMIDT KATI , STEFANOWSKI UDO
Abstract: The invention relates to improved novel carrier fluids for abrasives, especially cutting fluids, for wafer production. The invention also relates to the use of said fluids and to a method for cutting wafers.
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