公开(公告)号：US20200255772A1

公开(公告)日：2020-08-13

申请号：US16756303

申请日：2018-10-29

Applicant: BASF SE

Inventor： Daniel LOEFFLER ,  Mei Chin SHEN ,  Sheng Hsuan WEI ,  Frank PIRRUNG ,  Lothar ENGELBRECHT ,  Yeni BURK ,  Andreas KLIPP ,  Marcel BRILL ,  Szilard CSIHONY

IPC: C11D3/37 ,  G03F7/40 ,  C11D7/50 ,  H01L21/02

Abstract: The invention relates to the use of a non-aqueous composition comprising an organic solvent and at least one particular siloxane-type additive for treating substrates comprising patterns having line-space dimensions of 50 nm or below and aspect ratios of 4 or more as well as a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm, aspect ratios of greater or equal 4, or a combination thereof, (2) contacting the substrate at least once with a non-aqueous composition, and (3) removing the non-aqueous composition from the contact with the substrate, wherein the non-aqueous composition comprising an organic solvent and at least one of such siloxane-type additives.