公开(公告)号：MY166785A

公开(公告)日：2018-07-23

申请号：MYPI2014001795

申请日：2011-12-21

Applicant: BASF SE

Inventor： RAMAN VIJAY IMMANUEL ,  LI YUZHUO ,  SCHADE CHRISTIAN ,  VENKATARAMAN SHYAM SUNDAR ,  YU-SHEN EASON SU ,  USMAN IBRAHIM SHEIK ANSAR

IPC: H01L21/302 ,  C09G1/00 ,  C09G1/02 ,  C09G1/04 ,  C09K3/14 ,  C09K13/00 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/461

Abstract: A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (-P(=O)(OR1)(OR2) ) or phosphoric acid (-P(=O)(OH)2) moiety or their deprotonated forms as pendant groups, wherein R1 is alkyl, aryl, alkyl aryl, or aryl alkyl, R2 is h, alkyl, aryl, alkyl aryl, or aryl alkyl, and (C) an aqueous medium. (no suitable figure)