公开(公告)号：DK3430183T3

公开(公告)日：2022-03-07

申请号：DK17710321

申请日：2017-03-17

Applicant: BASF SE

Inventor： PENG XU YUAN ,  RINCON-OVALLES ROSALBA ADRIANA ,  VENKATARAMAN SHYAM SUNDAR ,  BAYER DOMNIK ,  HAAS ANDREAS

IPC: C25B1/04 ,  C25B11/093 ,  H01M4/88 ,  H01M4/90 ,  H01M4/92

公开(公告)号：CA3017676A1

公开(公告)日：2017-09-21

申请号：CA3017676

申请日：2017-03-17

Applicant: BASF SE

Inventor： PENG XU YUAN ,  RINCON-OVALLES ROSALBA ADRIANA ,  VENKATARAMAN SHYAM SUNDAR ,  BAYER DOMNIK ,  HAAS ANDREAS

IPC: C25B11/04 ,  C25B1/10 ,  H01M4/88 ,  H01M4/90 ,  H01M4/92 ,  H01M8/10

Abstract: The present invention relates to a metal-doped tin oxide which has a BET surface area of at least 30 m 2/g, and comprises at least one metal dopant which is Sb, Nb, Ta, Bi, W, or In, or any mixture thereof, wherein the metal dopant is present in an amount of from 2.5 at% to 25 at%, based on the total amount of tin and metal dopant atoms, and is in a mixed valence state containing atoms of oxidation state OS1and atoms of oxidation state OS2, whereint he oxidation state OS1 is>0 and the oxidation state OS2is >OS1 and the atomic ratio of the atoms of OS2 to the atoms of OS1 is from 1.5 to 12Ø

公开(公告)号：ES2908476T3

公开(公告)日：2022-04-29

申请号：ES17710321

申请日：2017-03-17

Applicant: BASF SE

Inventor： PENG XU YUAN ,  RINCON-OVALLES ROSALBA ADRIANA ,  VENKATARAMAN SHYAM SUNDAR ,  BAYER DOMNIK ,  HAAS ANDREAS

IPC: C25B1/04 ,  C25B11/093 ,  H01M4/88 ,  H01M4/90 ,  H01M4/92

Abstract: Un óxido de estaño dopado con metal que - tiene un área de superficie BET de al menos 30 m/g2, y - comprende un dopante metálico que es Sb, en el que el dopante metálico - está presente en una cantidad de entre 5,0 en % y 25 en %, basada en la cantidad total de átomos de estaño y de dopante metálico, y - se encuentra en un estado de valencia mixto que contiene átomos de Sb3+ y átomos de Sb5+, en el que la relación atómica entre Sb5+ y Sb3+, medida por espectroscopia de fotoelectrones de rayos X, es de 4,0 y 8,0.

公开(公告)号：MY171165A

公开(公告)日：2019-09-28

申请号：MYPI2014002274

申请日：2013-01-24

Applicant: BASF SE

Inventor： VENKATARAMAN SHYAM SUNDAR ,  LI YUZHUO ,  ZHONG MINGJIE

Abstract: A post chemical-mechanical-polishing (post-CMP) cleaning composition comprising: (A) at least one compound comprising at least one thiol (?SH), thioether (?SR1 )or thiocarbonyl (>C=S) group, wherein R1 is alkyl, aryl, alkylaryl or arylalkyl, (B) at least one sugar alcohol which contains at least three hydroxyl (?OH) groups and does not comprise any carboxylic acid (?COOH) or carboxylate (?COO -) groups, and (C)an aqueous medium. (No suitable figure)

公开(公告)号：MY166785A

公开(公告)日：2018-07-23

申请号：MYPI2014001795

申请日：2011-12-21

Applicant: BASF SE

Inventor： RAMAN VIJAY IMMANUEL ,  LI YUZHUO ,  SCHADE CHRISTIAN ,  VENKATARAMAN SHYAM SUNDAR ,  YU-SHEN EASON SU ,  USMAN IBRAHIM SHEIK ANSAR

IPC: H01L21/302 ,  C09G1/00 ,  C09G1/02 ,  C09G1/04 ,  C09K3/14 ,  C09K13/00 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/461

Abstract: A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (-P(=O)(OR1)(OR2) ) or phosphoric acid (-P(=O)(OH)2) moiety or their deprotonated forms as pendant groups, wherein R1 is alkyl, aryl, alkyl aryl, or aryl alkyl, R2 is h, alkyl, aryl, alkyl aryl, or aryl alkyl, and (C) an aqueous medium. (no suitable figure)

公开(公告)号：SG10201506169XA

公开(公告)日：2015-09-29

申请号：SG10201506169X

申请日：2011-09-06

Applicant: BASF SE

Inventor： LI YUZHUO ,  CHU JEA-JU ,  VENKATARAMAN SHYAM SUNDAR ,  USMAN IBRAHIM SHEIK ANSAR ,  PINDER HARVEY WAYNE

Abstract: An aqueous polishing composition having a pH of 3 to 11 and comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and of a pH of 3 to 9 as evidenced by the electrophoretic mobility; (B) anionic phosphate dispersing agents; and (C) a polyhydric alcohol component selected from the group consisting of (c1) water-soluble and water-dispersible, aliphatic and cycloaliphatic, monomeric, dimeric and oligomeric polyols having at least 4 hydroxy groups; (c2) a mixture consisting of (c21) water-soluble and water-dispersible, aliphatic and cycloaliphatic polyols having at least 2 hydroxy groups; and (c22) water-soluble or water-dispersible polymers selected from linear and branched alkylene oxide homopolymers and copolymers (c221); and linear and branched, aliphatic and cycloaliphatic poly(N-vinylamide) homopolymers and copolymers (c222); and (c3) mixtures of (c1) and (c2); and a process for polishing substrates for electrical, mechanical and optical devices.

公开(公告)号：MY170196A

公开(公告)日：2019-07-09

申请号：MYPI2013000777

申请日：2011-09-06

Applicant: BASF SE

Inventor： CHU JEA-JU ,  LI YUZHUO ,  VENKATARAMAN SHYAM SUNDAR ,  USMAN IBRAHIM SHEIK ANSAR ,  PINDER HARVEY WAYNE

Abstract: An aqueous polishing composition having a pH of 3 to 11 and comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium free from component (8) and of a pH of 3 to 9 as evidenced by the electrophoretic mobility; (B) anionic phosphate dispersing agents; and (C) a polyhydric alcohol component selected from the group consisting of (c1) water-soluble and water-dispersible, aliphatic and cycloaliphatic, monomeric, dimeric and oligomeric polyols having at least 4 hydroxy groups; (c2) a mixture consisting of (c21) water-soluble and water-dispersible, aliphatic and cycloaliphatic polyols having at least 2 hydroxy groups; and (c22) water-soluble or water-dispersible polymers selected from linear and branched alkylene oxide homopolymers and copolymers (c221); and linear and branched, aliphatic and cycloaliphatic poly (N-vinylamide) homopolymers and copolymers (c222); and (c3) mixtures of (c1) and (c2); and a process for polishing substrates for electrical, mechanical and optical devices.

公开(公告)号：MY165631A

公开(公告)日：2018-04-18

申请号：MYPI2013002054

申请日：2011-12-07

Applicant: BASF SE

Inventor： VENKATARAMAN SHYAM SUNDAR ,  KINGMA AREND JOUKE ,  NOLLER BASTIAN MARTEN ,  SU EASON YU-SHEN

IPC: C09K3/14 ,  B24B37/00 ,  C09G1/02 ,  H01L21/304 ,  H01L21/306

Abstract: THE PRESENT INVENTION IS DIRECTED TO A NOVEL AQUEOUS POLISHING COMPOSITION WHICH IS PARTICULARLY SUITABLE FOR POLISHING SEMICONDUCTOR SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS, OPTIONALLY CONTAINING SILICON NITRIDE FILMS. MOREOVER, THE PRESENT INVENTION IS DIRECTED TO A NOVEL PROCESS FOR POLISHING SUBSTRATES FOR MANUFACTURING ELECTRICAL, MECHANICAL AND OPTICAL DEVICES, THE SAID SUBSTRATE MATERIALS CONTAINING SILICON OXIDE AND POLYSILICON FILMS, OPTIONALLY CONTAINING SILICON NITRIDE FILMS.

公开(公告)号：MY164859A

公开(公告)日：2018-01-30

申请号：MYPI2013000780

申请日：2011-09-06

Applicant: BASF SE

Inventor： LI YUZHUO ,  CHU JEA-JU ,  VENKATARAMAN SHYAM SUNDAR ,  USMAN IBRAHIM SHEIK ANSAR ,  PINDER HARVEY WAYNE

IPC: C09G1/02 ,  C03C19/00 ,  C09K3/14 ,  G09G1/04 ,  G09G1/18 ,  H01L21/3105

Abstract: AN AQUEOUS POLISHING COMPOSITION COMPRISING (A) ABRASIVE PARTICLES WHICH ARE POSITIVELY CHARGED WHEN DISPERSED IN AN AQUEOUS MEDIUM HAVING A PH IN THE RANGE OF FROM 3 TO 9 AS EVIDENCED BY THE ELECTROPHORETIC MOBILITY; (B) WATER-SOLUBLE AND WATER-DISPERSIBLE HYDROXY GROUP CONTAINING COMPONENTS SELECTED FROM (B1) ALIPHATIC AND CYCLOALIPHATIC HYDROXYCARBOXYLIC ACIDS, WHEREIN THE MOLAR RATIO OF HYDROXY GROUPS TO CARBOXYLIC ACID GROUPS IS AT LEAST 1; (B2) ESTERS AND LACTONES OF THE HYDROXYCARBOXYLIC ACIDS (B1) HAVING AT LEAST ONE HYDROXY GROUP; AND (B3) MIXTURES THEREOF; AND (C) WATER-SOLUBLE AND WATER-DISPERSIBLE POLYMER COMPONENTS SELECTED FROM (C1) LINEAR AND BRANCHED ALKYLENE OXIDE POLYMERS; (C2) LINEAR AND BRANCHED, ALIPHATIC AND CYCLOALIPHATIC POLY(N-VINYLAMIDE) POLYMERS; AND (C3) CATIONIC POLYMERIC FLOCCULANTS HAVING A WEIGHT AVERAGE MOLECULAR WEIGHT OF LESS THAN 100,000 DALTON.; AND A PROCESS FOR POLISHING SUBSTRATE MATERIALS FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES.

公开(公告)号：SG10201506215WA

公开(公告)日：2015-09-29

申请号：SG10201506215W

申请日：2011-09-06

Applicant: BASF SE

Inventor： NOLLER BASTIAN ,  FRANZ DIANA ,  LI YUZHUO ,  USMAN IBRAHIM SHEIK ANSAR ,  PINDER HARVEY WAYNE ,  VENKATARAMAN SHYAM SUNDAR

Abstract: An aqueous polishing composition comprising (A) at least one water-soluble or water-dispersible compound selected from the group consisting of N-substituted diazenium dioxides and N'-hydroxy-diazenium oxide salts; and (B) at least one type of abrasive particles; the use of the compounds (A) for manufacturing electrical, mechanical and optical devices and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.