公开(公告)号：WO2004040369A2

公开(公告)日：2004-05-13

申请号：PCT/US2003/015164

申请日：2003-05-13

Applicant: BREWER SCIENCE, INC.

Inventor： XU, Gu ,  MEADOR, Jimmy, D. ,  BEHAVE, Mander, R. ,  DESHPANDE, Shreeram, V. ,  NOWAK, Kelly, A.

IPC: G03F

CPC classification number: H01L21/76808 ,  G02B1/111 ,  G03F7/091 ,  Y10S430/136 ,  Y10S430/151

Abstract: New anti-reflective or fill compositions having improved flow properties are provided. The compositions comprise a styrene-allyl alcohol polymer and preferably at least one other polymer (e.g., cellulosic polymers) in addition to the styrene-allyl alcohol polymer. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process. The inventive compositions can also be applied to substrates ( e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.

Abstract translation: 提供了具有改善的流动性能的新的抗反射或填充组合物。 组合物除了苯乙烯 - 烯丙醇聚合物之外还包含苯乙烯 - 烯丙醇聚合物，优选至少一种其它聚合物（例如，纤维素聚合物）。 本发明的组合物可用于在双镶嵌工艺中的后续蚀刻期间保护接触或通孔免于降解。 本发明的组合物还可以施加到基底（例如，硅晶片）以形成具有高蚀刻速率的抗反射涂层，其在随后的光致抗蚀剂曝光和显影期间最小化或防止反射。

公开(公告)号：WO2011022087A1

公开(公告)日：2011-02-24

申请号：PCT/US2010/027937

申请日：2010-03-19

Applicant: BREWER SCIENCE INC. ,  TANG, Tingji ,  XU, Gu ,  ZHONG, Xing-Fu ,  HONG, Wenbin ,  FLAIM, Tony, D. ,  YESS, Kimberly

Inventor： TANG, Tingji ,  XU, Gu ,  ZHONG, Xing-Fu ,  HONG, Wenbin ,  FLAIM, Tony, D. ,  YESS, Kimberly

IPC: H01L21/312

CPC classification number: B81C1/00801 ,  B81C2201/053 ,  C08G61/08 ,  C08G2261/3324 ,  C08G2261/418 ,  G03F7/033 ,  G03F7/094 ,  H01L21/0274 ,  H01L21/3081 ,  Y10T428/31645 ,  Y10T428/31667 ,  Y10T428/31692 ,  Y10T428/31855 ,  Y10T428/31909

Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

Abstract translation: 提供了在制造半导体和MEMS器件期间使用这些组合物作为保护层的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可以用于在酸蚀刻和其它加工和处理期间形成保护基材的层。 保护层可以是光敏的或非感光的，并且可以在保护层下面使用或不使用底漆层。 优选的底漆层在溶剂体系中包含碱性聚合物。

公开(公告)号：WO2022035734A1

公开(公告)日：2022-02-17

申请号：PCT/US2021/045164

申请日：2021-08-09

Applicant: BREWER SCIENCE, INC.

Inventor： ZHONG, Xing-Fu ,  HUANG, Runhui ,  XU, Gu ,  SIMMONS, Sean ,  SWEAT, Daniel ,  KOZA, Jakub

IPC: G03F7/11 ,  C08L79/08 ,  C08K5/13 ,  C08K5/053 ,  C08K5/49 ,  C08G73/10 ,  H01L21/033 ,  H01L21/02

Abstract: A high-temperature-stable spin-on-carbon ("SOC") material that fills topography features on a substrate while planarizing the surface in a one-step, thin layer coating process is provided. The material comprises low molecular weight polyimides or diimides that are pre-imidized in solution rather than on the wafer. The SOC layers can survive harsh CVD conditions and are also SCI resistant, especially on TiN and SiOx surfaces.

公开(公告)号：WO2020163765A1

公开(公告)日：2020-08-13

申请号：PCT/US2020/017300

申请日：2020-02-07

Applicant: BREWER SCIENCE, INC.

Inventor： FLAIM, Tony, D. ,  XU, Gu ,  SEE, Jennifer, S.

IPC: G03F7/027 ,  G03F7/20 ,  G03F7/00

Abstract: Methods of preparing poly(cyanocinnamate)s are provided, with those involving mild conditions and resulting in a soluble polymer that is stable at room temperature and can be coated onto microelectronic substrates. The polymer includes at least one bis(cyanoacetate) monomer and at least one aromatic dialdehyde monomer. The polymer exhibits good thermal and structural properties and high absorbance in the UV range.

公开(公告)号：EP1554322A2

公开(公告)日：2005-07-20

申请号：EP03809914.9

申请日：2003-05-13

Applicant: Brewer Science, Inc.

Inventor： XU, Gu ,  MEADOR, Jimmy, D. ,  BHAVE, Mander, R. ,  DESHPANDE, Shreeram, V. ,  NOWAK, Kelly, A.

IPC: C08F212/08 ,  C09D129/08 ,  C09D101/00

CPC classification number: H01L21/76808 ,  G02B1/111 ,  G03F7/091 ,  Y10S430/136 ,  Y10S430/151

Abstract: New anti-reflective or fill compositions having improved flow properties are provided. The compositions comprise a styrene-allyl alcohol polymer and preferably at least one other polymer (e.g., cellulosic polymers) in addition to the styrene-allyl alcohol polymer. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process. The inventive compositions can also be applied to substrates (e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.

公开(公告)号：WO2015105785A1

公开(公告)日：2015-07-16

申请号：PCT/US2015/010290

申请日：2015-01-06

Applicant: BREWER SCIENCE INC.

Inventor： BAI, Dongshun ,  XU, Gu ,  BLUMENSHINE, Debbie

IPC: H01L21/58

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200°C PECVD processing.

Abstract translation: 本发明广泛地涉及单独或一起使用的环烯烃聚合物粘合组合物和释放组合物，其能够在微电子学制造期间实现薄晶片处理，特别是在全晶片机械剥离过程中。 释放组合物包含由硅氧烷聚合物和共聚物在极性溶剂中共混制成的组合物，并且在室温下稳定长达一个月以上。 环状烯烃聚合物粘合组合物提供高热稳定性，可以结合到完全处理的载体晶片上，可以在高温热处理后机械或激光脱粘，并且易于用工业上可接受的溶剂除去。 根据本发明的晶片与其他商业粘合材料相比表现出较低的整体后研磨堆叠TTV，并且能够经受200℃的PECVD处理。

公开(公告)号：WO2013119976A1

公开(公告)日：2013-08-15

申请号：PCT/US2013/025378

申请日：2013-02-08

Applicant: BREWER SCIENCE INC.

Inventor： XU, Gu

IPC: H01L21/20 ,  H01L21/02

CPC classification number: B32B7/06 ,  B32B7/12 ,  B32B2255/26 ,  B32B2457/00 ,  C09J5/00 ,  C09J2203/326 ,  H05K1/18 ,  Y10T428/24174 ,  Y10T428/24612 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: This invention is related to compositions that prepare substrate surfaces to enable temporary wafer bonding during microelectronics manufacturing, especially using a zonal bonding process. This invention, which comprises compositions made from fluorinated silanes blended in a polar solvent, can be used to form surface coatings or treatments having a high contact angle with water (>85°). The resulting silane solutions are stable at room temperature for longer than one month.

Abstract translation: 本发明涉及制备衬底表面以在微电子制造期间实现临时晶片接合的组合物，特别是使用带状粘合工艺。 包含由在极性溶剂中共混的氟化硅烷制成的组合物的本发明可用于形成与水（> 85°）高接触角的表面涂层或处理。 得到的硅烷溶液在室温下稳定超过一个月。

公开(公告)号：WO2009035866A2

公开(公告)日：2009-03-19

申请号：PCT/US2008/074773

申请日：2008-08-29

Applicant: BREWER SCIENCE INC. ,  XU, Gu ,  YESS, Kimberly, A. ,  FLAIM, Tony, D.

Inventor： XU, Gu ,  YESS, Kimberly, A. ,  FLAIM, Tony, D.

IPC: C08L25/04

CPC classification number: H01L21/0271 ,  B81C1/00801 ,  C08L63/04 ,  C09D125/12 ,  Y10T428/31511 ,  Y10T428/31663 ,  C08L2666/14

Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.

Abstract translation: 提供了在制造半导体和MEMS器件期间用于湿蚀刻工艺的新的保护涂层。 这些层包括底漆层，第一保护层和任选的第二保护层。 底漆层优选在溶剂体系中包含有机硅烷化合物。 第一保护层包括由苯乙烯，丙烯腈和相容化合物如单体，低聚物和包含环氧基的聚合物制备的热塑性共聚物; 聚（苯乙烯 - 共 - 烯丙醇）; 及其混合物。 第二保护层包括高度卤化的聚合物，例如氯化聚合物，其在加热时可以或不会交联。

公开(公告)号：EP3092658A1

公开(公告)日：2016-11-16

申请号：EP15735186.7

申请日：2015-01-06

Applicant: Brewer Science, Inc.

Inventor： BAI, Dongshun ,  XU, Gu ,  BLUMENSHINE, Debbie

IPC: H01L21/58

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200°C PECVD processing.

Abstract translation: 本发明广泛地涉及单独或一起使用的环烯烃聚合物粘合组合物和释放组合物，其能够在微电子制造期间实现薄晶片处理，特别是在全晶片机械剥离过程中。 释放组合物包含由硅氧烷聚合物和共聚物在极性溶剂中共混制成的组合物，并且在室温下稳定长达一个月。 环烯烃聚合物粘合组合物提供高热稳定性，可以结合到完全处理的载体晶片上，可以在高温热处理后机械或激光脱粘，并且易于用工业上可接受的溶剂去除。 根据本发明的结合的晶片与其他商业粘合材料相比表现出较低的整体后研磨叠层TTV，并且能够经受200℃的PECVD处理。

公开(公告)号：EP2188335B1

公开(公告)日：2012-12-19

申请号：EP08798953.9

申请日：2008-08-29

Applicant: Brewer Science, Inc.

Inventor： XU, Gu ,  YESS, Kimberly, A. ,  FLAIM, Tony, D.

IPC: C09D125/12 ,  C09D163/04 ,  H01L21/027 ,  B81C1/00

CPC classification number: H01L21/0271 ,  B81C1/00801 ,  C08L63/04 ,  C09D125/12 ,  Y10T428/31511 ,  Y10T428/31663 ,  C08L2666/14