公开(公告)号：SG11201900281XA

公开(公告)日：2019-02-27

申请号：SG11201900281X

申请日：2017-07-14

Applicant: BREWER SCIENCE INC

Inventor： MATOS-PEREZ CRISTINA R ,  FLAIM TONY D ,  SOUTHARD ARTHUR O ,  KIRCHNER LISA M ,  BLUMENSHINE DEBORAH

IPC: H01L21/324 ,  H01L21/02 ,  H01L21/768

Abstract: Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.