公开(公告)号：SG11202107879PA

公开(公告)日：2021-08-30

申请号：SG11202107879P

申请日：2020-01-20

Applicant: BREWER SCIENCE INC

Inventor： PRENGER LUKE ,  SOUTHARD ARTHUR O ,  WU QI ,  LIU XIAO

IPC: C09J7/40 ,  B32B7/06 ,  C03C17/00 ,  C08G12/08 ,  C08J7/04 ,  C08L61/20

Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

公开(公告)号：SG11201900281XA

公开(公告)日：2019-02-27

申请号：SG11201900281X

申请日：2017-07-14

Applicant: BREWER SCIENCE INC

Inventor： MATOS-PEREZ CRISTINA R ,  FLAIM TONY D ,  SOUTHARD ARTHUR O ,  KIRCHNER LISA M ,  BLUMENSHINE DEBORAH

IPC: H01L21/324 ,  H01L21/02 ,  H01L21/768

Abstract: Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.