Abstract:
A polymer product with a metal layer coated on the surface thereof is provided. A method for selectively metallizing a surface of a polymer substrate is also provided. The polymer product includes a polymer substrate; and a metal layer formed on at least a part of a surface of the polymer substrate, and the surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide; and a doping element of the doped tin oxide comprises niobium, and the doped tin oxide has a coordinate L*value of about 70 to about 100, a coordinate a value of about -5 to about 5, and a coordinate b value of about -5 to about 5 in a CIELab color space.
Abstract:
The present disclosure provides a metal compound. The metal compound is represented by a formula(I): Cu 2 A α B 2-α O 4-β . A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group13 of the periodic table, 0
Abstract:
An application of a doped tin oxide, used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate is provided. A polymer composition including the doped tin oxide, a polymer molded body, an ink composition and a method for selectively metallizing a surface of an insulating substrate are also provided. The doped tin oxide has a light color, and does not interfere the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating; while using it as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with higher adhesive between the metal layer and the insulating substrate.
Abstract:
A metalized plastic article and a method for selectively metallizing a surface of a plastic substrate are provide. The metalized plastic article includes a plastic substrate and a metal plating layer formed on the surface of the plastic substrate. At least a surface layer of the plastic substrate covered by the metal plating layer is formed by a plastic composition. The plastic composition includes a base resin and a doped tin oxide. A doping element of the doped tin oxide is at least one selected from a group consisting of cerium, lanthanum, fluorine and tantalum. The metalized plastic article of the present disclosure has a good light absorption performance and a high chemical plating activity.
Abstract:
A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about −5 to about 5, and a coordinate b value of about −5 to about 5 in a CIELab color space.
Abstract:
The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0
Abstract:
Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.
Abstract:
The present disclosure provides a metal compound. The metal compound is represented by a formula(I): Cu 2 A α B 2-α O 4-β . A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group13 of the periodic table, 0