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公开(公告)号：US20140349030A1
公开(公告)日：2014-11-27
申请号：US14285322
申请日：2014-05-22
Applicant: SHENZHEN BYD AUTO R&D COMPANY LIMITED , BYD COMPANY LIMITED
Inventor： Qing GONG , Wei ZHOU , Weifeng MIAO
CPC classification number: C23C18/1608 , B29C37/0025 , B29C2035/0838 , B29C2035/0872 , B29C2035/0877 , C01G19/006 , C01G19/02 , C01G30/002 , C01G31/00 , C01G39/00 , C01P2002/50 , C01P2002/52 , C01P2004/61 , C01P2004/62 , C01P2004/64 , C08K3/22 , C08K2003/2231 , C08K2003/2255 , C09D11/03 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/285 , C23C18/38 , H05K1/0373 , H05K3/107 , H05K3/185 , H05K2201/0215 , H05K2201/0218 , H05K2201/0236 , H05K2203/107
Abstract: A method for selective metallization of a surface of a polymer article is provided. The polymer article contains a base polymer and at least one metal compound dispersed in the base polymer. The method includes gasifying at least a part of a surface of the polymer article by irradiating the surface with an energy source, and forming at least one metal layer on the surface of the polymer article by chemical plating. The metal compound contains a tin oxide doped with at least one doping element selected from a group including: V, Sb, In, and Mo.
Abstract translation: 提供了一种用于聚合物制品的表面的选择性金属化的方法。 聚合物制品包含基础聚合物和分散在基础聚合物中的至少一种金属化合物。 该方法包括通过用能量源照射表面来气化聚合物制品的表面的至少一部分，并通过化学镀在聚合物制品的表面上形成至少一个金属层。 所述金属化合物含有掺杂有至少一种掺杂元素的氧化锡，所述掺杂元素选自：V，Sb，In和Mo。
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2.发明申请METHOD FOR INTEGRALLY MOLDING METAL AND RESIN AND METAL-RESIN COMPOSITE STRUCTURE OBTAINABLE BY THE SAME 有权金属和树脂和金属 - 树脂复合结构的整体成型方法公开(公告)号：US20140363660A1
公开(公告)日：2014-12-11
申请号：US14466853
申请日：2014-08-22
Applicant: BYD COMPANY LIMITED , SHENZHEN BYD AUTO R&D COMPANY LIMITED
Inventor： Qing GONG , Xiong ZHANG , Yihu ZHANG , Wei ZHOU
CPC classification number: B29C45/14795 , B29C45/14311 , B29C45/14778 , B29C2045/14803 , B29C2045/14868 , B29K2071/12 , B29K2105/0067 , B29K2105/0088 , B29K2705/02 , B29K2715/003 , B29K2995/0097 , B29L2009/003 , B32B15/08 , B32B27/28 , B32B27/32 , B32B27/34 , B32B2270/00 , C25D11/08 , C25D11/16 , C25D11/18 , C25D11/24 , C25D11/246 , Y10T428/24997
Abstract: A method for integrally molding a metal and a resin and a metal-resin composite structure obtainable by the same are provided. The method comprises forming a nanopore in a surface of a metal sheet; melting a thermoplastic resin on the surface of the metal sheet formed with the nanopore; and injection molding the thermoplastic resin onto the surface of the metal sheet. The thermoplastic resin is a mixture of a main resin and a polyolefin resin, the main resin is a mixture of polyphenylene oxide and a polyamide, and the polyolefin resin has a melting point of about 65° C. to about 105° C.
Abstract translation: 提供了一种金属和树脂的一体成型方法以及由其获得的金属 - 树脂复合结构体。 该方法包括在金属片的表面形成纳米孔; 在由纳米孔形成的金属片的表面上熔化热塑性树脂; 并将热塑性树脂注射到金属板的表面上。 热塑性树脂是主要树脂和聚烯烃树脂的混合物，主要树脂是聚苯醚和聚酰胺的混合物，聚烯烃树脂的熔点为约65℃至约105℃。
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3.发明申请METHOD FOR INTEGRALLY MOLDING METAL AND RESIN AND METAL-RESIN COMPOSITE STRUCTURE OBTAINABLE BY THE SAME 有权金属和树脂和金属 - 树脂复合结构的整体成型方法公开(公告)号：US20140363631A1
公开(公告)日：2014-12-11
申请号：US14466363
申请日：2014-08-22
Applicant: BYD COMPANY LIMITED , SHENZHEN BYD AUTO R&D COMPANY LIMITED
Inventor： Qing GONG , Xiong ZHANG , Yihu ZHANG , Wei ZHOU
CPC classification number: B29C45/14795 , B29C45/14311 , B29C45/14778 , B29C2045/14803 , B29C2045/14868 , B29K2069/00 , B29K2105/0005 , B29K2105/0088 , B29K2705/02 , B29K2715/003 , B29K2995/0097 , B29L2009/003 , B32B15/08 , B32B27/32 , B32B27/365 , B32B2270/00 , B32B2311/24 , B32B2311/30 , B32B2369/00 , B32B2509/00 , B32B2605/08 , C25D11/08 , C25D11/16 , C25D11/24 , C25D11/30 , C25D11/34 , Y10T428/24545 , Y10T428/31507
Abstract: A method for integrally molding a metal and a resin and a metal-resin composite structure obtainable by the same are provided. The method comprises forming a nanopore in a surface of a metal sheet; melting a thermoplastic resin on the surface of the metal sheet formed with the nanopore; and injection molding the thermoplastic resin onto the surface of the metal sheet. The thermoplastic resin includes a mixture of a main resin and a polyolefin resin, the main resin is a polycarbonate, and the polyolefin resin has a melting point of about 65° C. to about 105° C.
Abstract translation: 提供了一种金属和树脂的一体成型方法以及由其获得的金属 - 树脂复合结构体。 该方法包括在金属片的表面形成纳米孔; 在由纳米孔形成的金属片的表面上熔化热塑性树脂; 并将热塑性树脂注射到金属板的表面上。 热塑性树脂包括主要树脂和聚烯烃树脂的混合物，主要树脂是聚碳酸酯，聚烯烃树脂的熔点约为65℃至约105℃。
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公开(公告)号：US20140363657A1
公开(公告)日：2014-12-11
申请号：US14466920
申请日：2014-08-22
Applicant: SHENZHEN BYD AUTO R&D COMPANY LIMITED , BYD COMPANY LIMITED
Inventor： Qing GONG , Xiong ZHANG , Yihu ZHANG , Wei ZHOU
CPC classification number: B32B5/18 , B29C45/14311 , B29C45/14778 , B29C45/14811 , B29C2045/14803 , B32B9/005 , B32B15/04 , B32B15/085 , B32B27/286 , B32B27/32 , B32B2250/03 , B32B2270/00 , Y10T428/249956
Abstract: A metal-resin composite and method for producing the same are provided. The method comprises: A) forming nanopores in at least a part of a surface of a metal sheet; and B) injection molding a thermoplastic resin directly on the surface of the metal sheet. The thermoplastic resin includes a main resin and a polyolefin resin. The main resin includes a mixture of polyphenylene ether and polyphenylene sulfide. And the polyolefin resin has a melting point of about 65° C. to about 105° C.
Abstract translation: 提供了一种金属树脂复合材料及其制造方法。 该方法包括：A）在金属片的表面的至少一部分中形成纳米孔; 和B）直接在金属板的表面上注塑成型热塑性树脂。 热塑性树脂包括主树脂和聚烯烃树脂。 主要树脂包括聚苯醚和聚苯硫醚的混合物。 聚烯烃树脂的熔点为约65℃至约105℃
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5.发明申请METAL COMPOUND, METHOD FOR PREPARING THE SAME, SELECTIVE METALLIZATION OF SURFACE OF SUBSTRATE WITH THE METAL COMPOUND 审中-公开金属化合物，其制备方法，基材表面与金属化合物的选择性金属化公开(公告)号：US20140290530A1
公开(公告)日：2014-10-02
申请号：US14242763
申请日：2014-04-01
Applicant: BYD COMPANY LIMITED , SHENZHEN BYD AUTO R&D COMPANY LIMITED
Inventor： Qing GONG , Wei ZHOU , Bifeng MAO , Weifeng MIAO
CPC classification number: C09D11/322 , B01J23/002 , B01J23/825 , B01J23/868 , B01J23/8874 , B01J23/8878 , B01J31/06 , B01J35/023 , B01J37/0036 , B01J37/04 , B01J37/08 , B01J37/349 , B01J2523/00 , C01G15/006 , C01G37/006 , C01G39/006 , C01G49/009 , C01P2004/61 , C01P2004/62 , C01P2006/60 , C01P2006/80 , C09D11/10 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/1651 , C23C18/1653 , C23C18/1879 , C23C18/204 , C23C18/206 , H05K3/182 , H05K3/185 , H05K2201/0236 , H05K2201/09118 , H05K2203/0709 , H05K2203/107 , H05K2203/1131 , H05K2203/125 , B01J2523/17 , B01J2523/31 , B01J2523/67 , B01J2523/32 , B01J2523/842 , B01J2523/33 , B01J2523/68
Abstract: The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0
Abstract translation: 本发明提供金属化合物。 金属化合物由式（I）表示：Cu2AaB2-αO4-＆bgr; （一世）。 A包含选自周期表的组6和8中的至少一种元素。 B包含选自周期表第13组中的至少一个元素，0 <α<2，0 <＆bgr <1.5。 还提供了含有金属化合物的聚合物制品和聚合物制品的制备方法以及聚合物制品的表面的选择性金属化。 此外，本公开提供了使用该油墨组合物的油墨组合物和用于绝缘基材的表面的选择性金属化。
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Patent Agency Ranking
6.发明公开公开(公告)号：US20240123554A1
公开(公告)日：2024-04-18
申请号：US18398030
申请日：2023-12-27
Applicant: BYD COMPANY LIMITED
Inventor： Wei ZHOU , Yiming ZHU , Qiang XU , Wenyan ZHAO , Xiayang LI
CPC classification number: B23K35/025 , B22F1/09 , B22F1/103 , B23K1/008 , B23K35/3006 , B23K2103/18
Abstract: Disclosed are an active metal brazing paste composition, a brazing paste and a method for brazing ceramics and metals. The composition includes a binder and metal powder. The metal powder includes active metal brazing powder and brazing-aid metal powder. The brazing-aid metal powder contains copper powder and/or copper-silver alloy powder. The active metal brazing powder is alloy powder containing copper, silver, and an active metal. With the total weight of the metal powder as a reference, the content of the active metal is 1.5 wt % or more, the content of silver is 40 wt % to 90 wt %, and the content of oxygen is 0.5 wt % or less.
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公开(公告)号：US20200224030A1
公开(公告)日：2020-07-16
申请号：US16608649
申请日：2018-03-28
Applicant: BYD COMPANY LIMITED
Inventor： Qing GONG , Wei ZHOU , Xiong ZHANG , Yue YU , Renlan SHI
Abstract: The present invention discloses a low-dielectric resin composition, a low-dielectric resin/metal composite material and a preparation method thereof, and an electronic device. The resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a base resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliary. The base resin is selected from the PBT resin and/or the PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz. With the same base resin component, the dielectric constant and dielectric loss of the low-dielectric resin material prepared with the low-dielectric resin composition are significantly reduced, which is advantageous for satisfying the requirements of use of plastics for antenna channels in metal shell of an electronic device, so as to improve the ability of the electronic device having antennas to receive and transmit signals.
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8.发明申请DOPED TIN OXIDE AND METHOD FOR SELECTIVE METALLIZATION OF INSULATING SUBSTRATE 有权绝缘氧化锡和绝缘基材的选择性金属化方法公开(公告)号：US20160068964A1
公开(公告)日：2016-03-10
申请号：US14943861
申请日：2015-11-17
Applicant: BYD COMPANY LIMITED
Inventor： Qing GONG , Wei ZHOU , Weifeng MIAO
CPC classification number: C23C18/1608 , B29C37/0025 , B29C2035/0838 , B29C2035/0872 , B29C2035/0877 , C01G19/006 , C01G19/02 , C01G30/002 , C01G31/00 , C01G39/00 , C01P2002/50 , C01P2002/52 , C01P2004/61 , C01P2004/62 , C01P2004/64 , C08K3/22 , C08K2003/2231 , C08K2003/2255 , C09D11/03 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/285 , C23C18/38 , H05K1/0373 , H05K3/107 , H05K3/185 , H05K2201/0215 , H05K2201/0218 , H05K2201/0236 , H05K2203/107
Abstract: Embodiments of the present disclosure are directed to a doped tin oxide. The doped tin oxide includes a tin oxide and at least one oxide of a doping element. The doping element includes at least one of vanadium and molybdenum. The doped tin oxide includes an amount of the tin oxide ranging from 90 mol % to 99 mol %, and an amount of the at least one oxide ranging from 1 mol % to 10 mol %.
Abstract translation: 本公开的实施方案涉及掺杂的氧化锡。 掺杂的氧化锡包括氧化锡和掺杂元素的至少一种氧化物。 掺杂元素包括钒和钼中的至少一种。 掺杂的氧化锡包括氧化锡的量为90mol％至99mol％，并且至少一种氧化物的量为1mol％至10mol％。
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9.发明申请公开(公告)号：US20190322809A1
公开(公告)日：2019-10-24
申请号：US16475028
申请日：2017-12-08
Applicant: BYD COMPANY LIMITED
Inventor： Shouping BAI , Wei ZHOU , Xiaokang DAI , Zhenwei LI , Tingting HU
Abstract: The present disclosure relates to the field of silica gel, and discloses a liquid optical silica gel composition, optical silica gel, a double-glazed photovoltaic assembly and a fabrication method of the optical silica gel. The present disclosure discloses a liquid optical silica gel composition. The composition contains vinyl silicone oil, hydrogen-containing silicone oil, hydrogen-containing MQ silicone resin, a catalyst, an inhibitor and a tackifier. The weight ratio between the vinyl silicone oil, the hydrogen-containing silicone oil, the hydrogen-containing MQ silicone resin and the tackifier is 1:(0.001-0.1):(0.0001-0.08):(0.001-0.05). The hydrogen-containing silicone oil contains first hydrogen-containing silicone oil and second hydrogen-containing silicone oil. The first hydrogen-containing silicone oil has a hydrogen content of 0.1 to 1 percent by weight. The second hydrogen-containing silicone oil has a hydrogen content of 0.01 to 0.1 percent by weight. The hydrogen-containing MQ silicone resin has a hydrogen content less than 1 percent by weight.
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公开(公告)号：US20240011678A1
公开(公告)日：2024-01-11
申请号：US18002235
申请日：2021-06-07
Applicant: BYD COMPANY LIMITED
Inventor： Yonghui LI , Junqiao LI , Wei ZHOU
Abstract: A semiconductor refrigeration chip and a method for manufacturing same are provided. The method includes: providing a semiconductor refrigeration assembly, where the semiconductor refrigeration assembly includes a first insulating and heat-conducting layer and a second insulating and heat-conducting layer provided opposite to each other and a semiconductor layer arranged between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer, a side of the semiconductor refrigeration assembly provided with the first insulating and heat-conducting layer is a cold end, and a side of the semiconductor refrigeration assembly provided with the second insulating and heat-conducting layer is a hot end; and forming a packaging structure, and causing the packaging structure to cover a side wall of the semiconductor refrigeration assembly and define a first groove with the first insulating and heat-conducting layer, to obtain the semiconductor refrigeration chip.
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