公开(公告)号：EP1592289B1

公开(公告)日：2008-06-11

申请号：EP05009384.8

申请日：2005-04-28

Applicant: Brain Power Co.

Inventor： Su, Sung-Ling ,  Xu, Zhiqiang

IPC: H05K1/16 ,  H05K3/18

CPC classification number: H05K1/167 ,  H05K3/061 ,  H05K3/181 ,  H05K3/184 ,  H05K2201/0391 ,  H05K2203/0361 ,  H05K2203/1453

公开(公告)号：EP1592289A1

公开(公告)日：2005-11-02

申请号：EP05009384.8

申请日：2005-04-28

Applicant: Brain Power Co.

Inventor： Su, Sung-Ling ,  Xu, Zhiqiang

IPC: H05K1/16 ,  H05K3/18

CPC classification number: H05K1/167 ,  H05K3/061 ,  H05K3/181 ,  H05K3/184 ,  H05K2201/0391 ,  H05K2203/0361 ,  H05K2203/1453

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.