Abstract:
The present invention provides a method of treating silica wherein silica is reacted with a di- or tri-functional organosilane in an aqueous acid medium to provide a crude organosilane-capped silica product containing organosilicon impurities. The organosilicon impurities are extracted from the crude product with an organic liquid to provide a purified product consisting essentially of organosilane-capped silica. The purified product is dried to provide a dry organosilane-capped silica. The aqueous acid medium can include a displacing reagent which displaces at least one reactive functional group of the di- or tri-functional organosilane. The present invention further provides continuous methods of treating silica with di- and tri-functional organosilanes, wherein the organic liquid and/or the organosilicon impurities are recycled and reused.
Abstract:
PROBLEM TO BE SOLVED: To provide particulate compositions having improved heat conduction values. SOLUTION: An embodiment is a particulate composition which under a 103,421 Pa load, at 20°C, and at a pressure within the range of 133.322-13332.2 Pa, in Nitrogen, has: a packing density of less than or equal to 160 kg/cm 3 , and a thermal conductivity at 133.322-13332.2 Pa of less than or equal to 0.260lnP+453 milliWatt/meterK (mW/mxK) and a thermal conductivity at 1333.322-13332.2 Pa of less than or equal to (0.824lnP+0.47) mW/mxK. A preferred particulate composition is a gel composition. Also disclosed are insulating bodies comprising the particulate compositions. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
The present invention provides a method of treating silica wherein silica is reacted with a di- or tri-functional organosilane in an aqueous acid medium to provide a crude organosilane-capped silica product containing organosilicon impurities. The organosilicon impurities are extracted from the crude product with an organic liquid to provide a purified product consisting essentially of organosilane-capped silica. The purified product is dried to provide a dry organosilane-capped silica. The aqueous acid medium can include a displacing reagent which displaces at least one reactive functional group of the di- or tri-functional organosilane. The present invention further provides-continuous methods of treating silica with di- and tri-functional organosilanes, wherein the organic liquid and/or the organosilicon impurities are recycled and reused.
Abstract:
The present invention provides a method of treating silica wherein silica is reacted with a di- or tri-functional organosilane in an aqueous acid medium to provide a crude organosilane-capped silica product containing organosilicon impurities. The organosilicon impurities are extracted from the crude product with an organic liquid to provide a purified product consisting essentially of organosilane-capped silica. The purified product is dried to provide a dry organosilane-capped silica. The aqueous acid medium can include a displacing reagent which displaces at least one reactive functional group of the di- or tri-functional organosilane. The present invention further provides-continuous methods of treating silica with di- and tri-functional organosilanes, wherein the organic liquid and/or the organosilicon impurities are recycled and reused.
Abstract:
The present invention relates to particulate compositions having improved thermal conductivity values. An embodiment of the present invention is a particulate composition which under a 103421 Pa load, at 20 DEG C., and at a pressure (P) within the range of 133.322-13332.2 Pa, in Nitrogen, has: a packing density of less than or equal to 160 kg/m3, and a Thermal Conductivity (TC) at 133.322-1333.22 Pa of less than or equal to (0.260 lnP+4.53) milliWatt/meterK (mW/mxK) and a TC at 1333.22-13332.2 Pa of less than or equal to (0.824 lnP+0.47) mW/mxK. A preferred particulate composition is a gel composition. Also disclosed are insulation bodies comprising the particulate compositions.
Abstract:
The present invention relates to particulate compositions having improved thermal conductivity values. An embodiment of the present invention is a particulate composition which under a 103421 Pa load, at 20 DEG C., and at a pressure (P) within the range of 133.322-13332.2 Pa, in Nitrogen, has: a packing density of less than or equal to 160 kg/m3, and a Thermal Conductivity (TC) at 133.322-1333.22 Pa of less than or equal to (0.260 lnP+4.53) milliWatt/meterK (mW/mxK) and a TC at 1333.22-13332.2 Pa of less than or equal to (0.824 lnP+0.47) mW/mxK. A preferred particulate composition is a gel composition. Also disclosed are insulation bodies comprising the particulate compositions.