POLYFUNCTIONAL ORGANOSILANE TREATMENT OF SILICA
    1.
    发明申请
    POLYFUNCTIONAL ORGANOSILANE TREATMENT OF SILICA 审中-公开
    二氧化硅的多功能有机物处理

    公开(公告)号:WO9936356A3

    公开(公告)日:1999-12-09

    申请号:PCT/US9900166

    申请日:1999-01-13

    Applicant: CABOT CORP

    Abstract: The present invention provides a method of treating silica wherein silica is reacted with a di- or tri-functional organosilane in an aqueous acid medium to provide a crude organosilane-capped silica product containing organosilicon impurities. The organosilicon impurities are extracted from the crude product with an organic liquid to provide a purified product consisting essentially of organosilane-capped silica. The purified product is dried to provide a dry organosilane-capped silica. The aqueous acid medium can include a displacing reagent which displaces at least one reactive functional group of the di- or tri-functional organosilane. The present invention further provides continuous methods of treating silica with di- and tri-functional organosilanes, wherein the organic liquid and/or the organosilicon impurities are recycled and reused.

    Abstract translation: 本发明提供了一种处理二氧化硅的方法,其中二氧化硅与含水酸性介质中的二官能或三官能有机硅烷反应,以提供含有有机硅杂质的粗有机硅烷封端二氧化硅产物。 用有机液体从粗产物中提取有机硅杂质,以提供基本上由有机硅烷封端的二氧化硅组成的纯化产物。 将纯化的产物干燥以提供干燥的有机硅烷封端二氧化硅。 含水酸性介质可以包括置换试剂,其置换二官能或三官能有机硅烷的至少一个反应性官能团。 本发明还提供了用二 - 和三官能有机硅烷处理二氧化硅的连续方法,其中有机液体和/或有机硅杂质被再循环和重复使用。

    Compositions and insulation bodies having low thermal conductivity
    2.
    发明专利
    Compositions and insulation bodies having low thermal conductivity 审中-公开
    具有低导热性的组合物和绝缘体

    公开(公告)号:JP2009058130A

    公开(公告)日:2009-03-19

    申请号:JP2008227589

    申请日:2008-09-04

    CPC classification number: B01J13/00

    Abstract: PROBLEM TO BE SOLVED: To provide particulate compositions having improved heat conduction values. SOLUTION: An embodiment is a particulate composition which under a 103,421 Pa load, at 20°C, and at a pressure within the range of 133.322-13332.2 Pa, in Nitrogen, has: a packing density of less than or equal to 160 kg/cm 3 , and a thermal conductivity at 133.322-13332.2 Pa of less than or equal to 0.260lnP+453 milliWatt/meterK (mW/mxK) and a thermal conductivity at 1333.322-13332.2 Pa of less than or equal to (0.824lnP+0.47) mW/mxK. A preferred particulate composition is a gel composition. Also disclosed are insulating bodies comprising the particulate compositions. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供具有改善的热传导值的颗粒组合物。 解决方案:一个实施方案是一种颗粒组合物,其在氮气中在103,421Pa负荷下,在20℃和133.322-13332.2Pa的压力范围内具有:小于或等于 160kg / cm 3 / SP>,133.322-13332.2Pa的热导率小于或等于0.260lnP + 453毫瓦/米K(mW / m×K),热导率为1333.322-13332.2Pa 小于或等于(0.824lnP + 0.47)mW / m×K。 优选的颗粒组合物是凝胶组合物。 还公开了包含颗粒组合物的绝缘体。 版权所有(C)2009,JPO&INPIT

    3.
    发明专利
    未知

    公开(公告)号:DE69902223T2

    公开(公告)日:2003-01-23

    申请号:DE69902223

    申请日:1999-01-13

    Applicant: CABOT CORP

    Abstract: The present invention provides a method of treating silica wherein silica is reacted with a di- or tri-functional organosilane in an aqueous acid medium to provide a crude organosilane-capped silica product containing organosilicon impurities. The organosilicon impurities are extracted from the crude product with an organic liquid to provide a purified product consisting essentially of organosilane-capped silica. The purified product is dried to provide a dry organosilane-capped silica. The aqueous acid medium can include a displacing reagent which displaces at least one reactive functional group of the di- or tri-functional organosilane. The present invention further provides-continuous methods of treating silica with di- and tri-functional organosilanes, wherein the organic liquid and/or the organosilicon impurities are recycled and reused.

    5.
    发明专利
    未知

    公开(公告)号:DE69902223D1

    公开(公告)日:2002-08-29

    申请号:DE69902223

    申请日:1999-01-13

    Applicant: CABOT CORP

    Abstract: The present invention provides a method of treating silica wherein silica is reacted with a di- or tri-functional organosilane in an aqueous acid medium to provide a crude organosilane-capped silica product containing organosilicon impurities. The organosilicon impurities are extracted from the crude product with an organic liquid to provide a purified product consisting essentially of organosilane-capped silica. The purified product is dried to provide a dry organosilane-capped silica. The aqueous acid medium can include a displacing reagent which displaces at least one reactive functional group of the di- or tri-functional organosilane. The present invention further provides-continuous methods of treating silica with di- and tri-functional organosilanes, wherein the organic liquid and/or the organosilicon impurities are recycled and reused.

    Compositions and insulation bodies having low thermal conductivity

    公开(公告)号:AU4421897A

    公开(公告)日:1998-04-17

    申请号:AU4421897

    申请日:1997-09-18

    Applicant: CABOT CORP

    Abstract: The present invention relates to particulate compositions having improved thermal conductivity values. An embodiment of the present invention is a particulate composition which under a 103421 Pa load, at 20 DEG C., and at a pressure (P) within the range of 133.322-13332.2 Pa, in Nitrogen, has: a packing density of less than or equal to 160 kg/m3, and a Thermal Conductivity (TC) at 133.322-1333.22 Pa of less than or equal to (0.260 lnP+4.53) milliWatt/meterK (mW/mxK) and a TC at 1333.22-13332.2 Pa of less than or equal to (0.824 lnP+0.47) mW/mxK. A preferred particulate composition is a gel composition. Also disclosed are insulation bodies comprising the particulate compositions.

    10.
    发明专利
    未知

    公开(公告)号:TR199901377T2

    公开(公告)日:1999-11-22

    申请号:TR9901377

    申请日:1997-09-18

    Applicant: CABOT CORP

    Abstract: The present invention relates to particulate compositions having improved thermal conductivity values. An embodiment of the present invention is a particulate composition which under a 103421 Pa load, at 20 DEG C., and at a pressure (P) within the range of 133.322-13332.2 Pa, in Nitrogen, has: a packing density of less than or equal to 160 kg/m3, and a Thermal Conductivity (TC) at 133.322-1333.22 Pa of less than or equal to (0.260 lnP+4.53) milliWatt/meterK (mW/mxK) and a TC at 1333.22-13332.2 Pa of less than or equal to (0.824 lnP+0.47) mW/mxK. A preferred particulate composition is a gel composition. Also disclosed are insulation bodies comprising the particulate compositions.

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