Abstract:
The present invention provides a spacer assembly (100) which is tailored to provide a secondary electron emission coefficient of approximately 1 for the spacer assembly (100) when the spacer assembly (100) is subjected to flat panel display operating voltages. The present invention further provides a spacer assembly (100) which accomplishes the above achievement and which does not degrade severely when subjected to electron bombardment. The present invention further provides a spacer assembly (100) which accomplishes both of the above-listed achievements and which does not significantly contribute to contamination of the vacuum environment of the flat panel display or be susceptible to contamination that may evolve within the tube. Specifically, in one embodiment, the present invention is comprised of a spacer structure (102) which has a specific secondary electron emission coefficient function associated therewith. The material comprising the spacer structure (102) is tailored to provide a secondary electron emission coefficient of approximately 1 for the spacer assembly (100) when the spacer assembly (100) is subjected to flat panel display operating voltages.
Abstract:
A light-emitting device is provided with getter material (58) that can readily be distributed in a relatively uniform manner across the device's active light-emitting portion. An electron-emitting device is similarly provided with getter material (112, 110/112, 128, 132, and 142) that can readily be distributed relatively uniformly across the active electron-emitting portion of the device. Techniques such as thermal spraying, angled physical deposition, and maskless electrophoretic/dielectrophoretic deposition can be utilized in depositing the getter material.
Abstract:
A light-emitting device is provided with getter material (58) that can readily be distributed in a relatively uniform manner across the device's active light-emitting portion. An electron-emitting device is similarly provided with getter material (112, 110/112, 128, 132, and 142) that can readily be distributed relatively uniformly across the active electron-emitting portion of the device. Techniques such as thermal spraying, angled physical deposition, and maskless electrophoretic/dielectrophoretic deposition can be utilized in depositing the getter material.
Abstract:
A flat panel display apparatus comprising: a faceplate, a backplate disposed opposing said faceplate, said faceplate and said backplate adapted to be connected in a sealed environment such that a low pressure region exists between said faceplate and said backplate; a spacer assembly (900) disposed within said sealed environment, said spacer assembly supporting said faceplate and said backplate against forces acting in a direction towards said sealed environment, said spacer assembly tailored to provide a secondary electron emission coefficient of approximately 1 for said spacer assembly when said spacer assembly is subjected to flat panel display operating voltages, said spacer assembly further including a spacer structure (902); and a coating material (904) applied to at least a portion of said spacer structure, wherein said coating material is comprised of a layered material that is oriented with its basal plane parallel to a face of said spacer structure (902).
Abstract:
A structure comprising: a plate (40); an electron emissive element (104) overlying the plate; a support region (102,108) overlying the plate; and a getter region (112) overlying at least part of the support region, a composite opening extending through the getter region and through the support region generally laterally where the electron-emissive element overlies the plate.
Abstract:
A light-emitting device is provided with getter material (58) that can readily be distributed in a relatively uniform manner across the device's active light-emitting portion. An electron-emitting device is similarly provided with getter material (112, 110/112, 128, 132, and 142) that can readily be distributed relatively uniformly across the active electron-emitting portion of the device. Techniques such as thermal spraying, angled physical deposition, and maskless electrophoretic/dielectrophoretic deposition can be utilized in depositing the getter material.