公开(公告)号：DE885452T1

公开(公告)日：1999-07-22

申请号：DE97916717

申请日：1997-03-05

Applicant: CANDESCENT TECH CORP

Inventor： SPINDT CHRISTOPHER ,  CHAKAROVA GABRIELA ,  NIKOLOVA MARIA ,  SEARSON PETER ,  HAVEN DUANE ,  KNALL NILS ,  MACAULAY JOHN ,  BARTON ROGER

IPC: B81C1/00 ,  C25F3/14 ,  H01J9/02

Abstract: An electrochemical technique is employed for removing certain material from a partially finished structure without significantly chemically attacking certain other material of the same chemical type as the removed material. The partially finished structure contains a first electrically non-insulating layer (52C) consisting at least partially of first material, typically excess emitter material that accumulates during the deposition of the emitter material to form electron-emissive elements (52A) in an electron emitter, that overlies an electrically insulating layer (44). An electrically non-insulating member, such as an electron-emissive element, consisting at least partially of the first material is situated at least partly in an opening (50) extending through the insulating layer. With the partially finished structure so arranged, at least part of the first material of the first non-insulating layer is electrochemically removed such that the non-insulating member is exposed without significantly attacking the first material of the non-insulating member.

公开(公告)号：DE946960T1

公开(公告)日：2000-08-17

申请号：DE97952426

申请日：1997-12-22

Applicant: CANDESCENT TECH CORP

Inventor： SLUSARCZUK MARKO ,  HAVEN DUANE ,  CURTIN CHRISTOPHER ,  FAHLEN THEODORE

IPC: G02F1/13 ,  G02F1/1333 ,  G09F9/00 ,  H01J5/03 ,  H01J9/24 ,  H01J17/16 ,  H01J29/86 ,  H01J29/87 ,  H01J29/94 ,  H01J31/12 ,  H01J9/26 ,  H01J9/385 ,  H01J9/39

Abstract: A flat-panel device is fabricated by a process in which a pair of plate structures (40 and 42) are sealed along their interior surfaces (40A and 42B) to opposite edges (44A and 44B) of an outer wall (44) to form a compartment. Subsequently, exterior support structure (64) is attached to the exterior surface of one of the plate structures (40) to significantly increase resistance of the compartment to bending. Exterior support structure (66) is normally likewise attached to the exterior surface of the other plate structure (42) after the sealing operation. The compartment is then typically pumped down to a high vacuum through a suitable pump-out port (46) and closed. By providing the exterior support structure at such a relatively late stage in the fabrication process, the need for using spacers to support the device against external forces is eliminated or substantially reduced while simultaneously avoiding severe fabrication difficulties that arise in attaching the exterior support structure before the sealing operation.