Liquid-phase growth method, liquid-phase growth apparatus, and solar cell
    3.
    发明公开
    Liquid-phase growth method, liquid-phase growth apparatus, and solar cell 审中-公开
    液相生长,对于液相生长装置,以及太阳能电池的方法

    公开(公告)号:EP1088913A8

    公开(公告)日:2001-06-06

    申请号:EP00308254

    申请日:2000-09-21

    Applicant: CANON KK

    Abstract: The present invention provides a method for producing a semiconductor substrate which comprises the steps of growing a first semiconductor layer on a substrate in liquid phase at a properly controlled temperature for eliminating defects and growing a second semiconductor layer on the first semiconductor layer in liquid phase at a higher temperature; a solar cell produced by a method comprising a step of anodizing the surface of the first and second layer side of the semiconductor substrate produced by the liquid-phase growth method; a liquid-phase growth apparatus comprising means for storing a melt, means for changing the temperature of the stored melt, and means for bringing an oxygen-containing substrate into contact with the melt, wherein a substrate is brought into contact with the melt at a temperature so as to suppress the stacking faults contained in the semiconductor layer grown on the surface of the substrate.

    AMORPHOUS OXIDE AND FIELD EFFECT TRANSISTOR

    公开(公告)号:CA2585190A1

    公开(公告)日:2006-05-18

    申请号:CA2585190

    申请日:2005-11-09

    Abstract: A novel amorphous oxide film applicable, for example, to an active layer of a TFT is provided. The amorphous oxide film has an electron carrier concentration of less than 10 18 /cm 3 at a temperature of 25° C, wherein the amorphous oxide is any one selected from the group consisting of an oxide containing In, Zn, and Sn; an oxide containing In and Zn; an oxide containing In and Sn; and an oxide containing In, Zn, and Ga. The oxide comprises one type of element or a plurality of elements selected from the group consisting of Li, Na, Mn, Ni, Pd, Cu, Cd, C, N, and P; or at least one element selected from the group consisting of Ti, Ru, and F.

    7.
    发明专利
    未知

    公开(公告)号:DE69825517D1

    公开(公告)日:2004-09-16

    申请号:DE69825517

    申请日:1998-03-26

    Applicant: CANON KK

    Abstract: A process for producing a semiconductor substrate is provided which comprises a first step of anodizing a surface of a first substrate to form a porous layer on the surface, a second step of simultaneously forming a semiconductor layer on the surface of the porous layer and a semiconductor layer on a surface of the first substrate on its side opposite to the porous layer side, a third step of bonding the surface of the semiconductor layer formed on the surface of the porous layer, to a surface of a second substrate, and a fourth step of separating the first substrate and the second substrate at the part of the porous layer to transfer to the second substrate the semiconductor layer formed on the surface of the porous layer, thereby providing the semiconductor layer on the surface of the second substrate. This makes it possible to produce semiconductor substrates at a low cost while making good use of expensive substrate materials.

    Liquid-phase growth method, liquid-phase growth apparatus, and solar cell

    公开(公告)号:AU6126200A

    公开(公告)日:2001-03-29

    申请号:AU6126200

    申请日:2000-09-22

    Applicant: CANON KK

    Abstract: The present invention provides a method for producing a semiconductor substrate which comprises the steps of growing a first semiconductor layer on a substrate in liquid phase at a properly controlled temperature for eliminating defects and growing a second semiconductor layer on the first semiconductor layer in liquid phase at a higher temperature; a solar cell produced by a method comprising a step of anodizing the surface of the first and second layer side of the semiconductor substrate produced by the liquid-phase growth method; a liquid-phase growth apparatus comprising means for storing a melt, means for changing the temperature of the stored melt, and means for bringing an oxygen-containing substrate into contact with the melt, wherein a substrate is brought into contact with the melt at a temperature so as to suppress the stacking faults contained in the semiconductor layer grown on the surface of the substrate.

Patent Agency Ranking