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公开(公告)号：DE69616621D1
公开(公告)日：2001-12-13
申请号：DE69616621
申请日：1996-03-21
Applicant: CANON KK
Inventor： SHIMADA TETSUYA , KUREMATSU KATSUMI , TAKABAYASHI HIROSHI , YABU SHIGEKI , UEHARA MAKOTO , ITAZAWA TOSHIAKI , MAEDA YASUSHI , TAKAHASHI MASANORI , ONITSUKA YOSHIHIRO , TAKAI KUMIHARU , YUKI OSAMU
IPC: G02F1/13 , G02F1/133 , G02F1/13357 , G09G3/34 , G09G3/36 , H05B41/295 , H05B41/36
Abstract: A display apparatus includes: a display unit for displaying images, a backlight unit disposed behind the display unit for illuminating the display unit, an inverter unit for electrically controlling the backlight unit, a controller unit for controlling the inverter unit and the display unit, and a power supply unit having an exothermic heat distribution for supplying electricity to the inverter unit and the controller unit. The inverter unit and controller unit are disposed behind the backlight unit. The power supply unit is disposed on a side of the display unit, backlight unit, inverter unit and controller unit. The display unit, backlight unit, inverter unit, controller unit and power supply unit are disposed in a common housing. The inverter unit and said controller unit are arranged behind the backlight unit. An insulating member is further disposed between the power supply unit and the display unit at a position corresponding to a region of relatively large exothermic heat of the power supply unit so that the insulating member is disposed at a diagonal position with respect to the inverter unit. The display apparatus may be supported by a support structure including vertically tilting and laterally turning mechanisms.
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公开(公告)号：DE69614732D1
公开(公告)日：2001-10-04
申请号：DE69614732
申请日：1996-02-29
Applicant: CANON KK
Inventor： TAKAHASHI MASANORI , SAITO RIICHI , OUCHI TOSHIMICHI
Abstract: A circuit board connection structure is formed by a first substrate having a first electrode pattern, a second substrate having a second electrode pattern, and a film circuit member electrically connecting the first and second electrode patterns. The film circuit member includes lead electrodes having an exposed portion partly connected to the first electrode pattern at a part of the exposed portion closer to an edge of the film circuit member. The film circuit member may further includes lead electrodes having an exposed portion partly connected to the second electrode pattern at a part of the exposed portion closer to an edge of the film circuit member. The circuit board connection structure may be incorporated in various electronic devices, including a liquid crystal display device.
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公开(公告)号：AT193617T
公开(公告)日：2000-06-15
申请号：AT92117180
申请日：1992-10-08
Applicant: CANON KK
Inventor： TAKAHASHI MASANORI
IPC: G02F1/1345 , G02F1/13 , H01L23/14 , H01L23/538 , H01L25/065 , G02F1/136
Abstract: An electrical packaging structure has a plurality of semiconductor chips arranged on a substrate and input wirings to the semiconductor chips connected thereto. The input wirings are distributed through a wiring board arranged on the substrate.
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公开(公告)号：DE69026992T2
公开(公告)日：1996-10-24
申请号：DE69026992
申请日：1990-08-16
Applicant: CANON KK
Inventor： TAKABAYASHI HIROSHI , TAKAHASHI MASANORI
Abstract: Electrode terminals formed on a pair of a circuit substrate and another circuit substrate or electrical element are mutually connected electrically by the medium of electroconductive particles. Prior to the connection, the electroconductive particles (4) may be charged and dispersed onto a circuit substrate (11) to be selectively attached to the electrode terminals (8) thereon. The selective attachment may be enhanced by masking a part other than the connecting part of the electrode terminals (8) of the circuit substrate with an insulating member or film (10) so as to guide the charged electroconductive particles (7) along electric lines of force directed to the exposed parts of the electrode terminals. The attached electroconductive particles (9) are sandwiched between the pair of circuit substrates, which may be secured to each other by means of an insulating adhesive or an electroconductive resin.
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公开(公告)号：DE69717331D1
公开(公告)日：2003-01-09
申请号：DE69717331
申请日：1997-03-14
Applicant: CANON KK
Inventor： TAKAHASHI MASANORI , SAITO RIICHI , OUCHI TOSHIMICHI
IPC: G02F1/13 , H01L21/60 , H01L23/498
Abstract: A circuit connection structure is formed by a first substrate (1b) having electrode terminals (12) formed thereon, a semiconductor device (5) having first electrodes (13) and second electrodes (15) with the first electrodes (13) connected to the electrode terminals (12) of the first substrate (16), a flexible wiring member (4a) having thereon a pattern of conductors (17) each extending from a first end to a second end on the flexible wiring member (4a) with the first ends of the conductors (17) connected to the second electrodes (15) of the semiconductor device (5), and a circuit board (3) having thereon electrode terminals (19) connected to the second ends of the conductors (17) on the flexible wiring member (4a). The circuit connection structure may suitably be incorporated in a display apparatus including a display panel having the first substrate (1b) for carrying pixel electrodes and allows a small pitch desired for a high definition display by the panel while ensuring a low-impedance power and signal supply to the semiconductor device.
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Patent Agency Ranking
公开(公告)号：DE69231117D1
公开(公告)日：2000-07-06
申请号：DE69231117
申请日：1992-10-08
Applicant: CANON KK
Inventor： TAKAHASHI MASANORI
IPC: G02F1/1345 , G02F1/13 , H01L23/14 , H01L23/538 , H01L25/065 , G02F1/136
Abstract: An electrical packaging structure has a plurality of semiconductor chips arranged on a substrate and input wirings to the semiconductor chips connected thereto. The input wirings are distributed through a wiring board arranged on the substrate.
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公开(公告)号：DE69118624T2
公开(公告)日：1996-09-19
申请号：DE69118624
申请日：1991-09-12
Applicant: CANON KK
Inventor： TAKABAYASHI HIROSHI , TAKAHASHI MASANORI , MORI HIDEO
IPC: G02F1/1345 , H05K3/24 , H05K1/00
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公开(公告)号：DE69628472D1
公开(公告)日：2003-07-03
申请号：DE69628472
申请日：1996-04-16
Applicant: CANON KK
Inventor： MORI HIDEO , YOKOMIZO HIROYUKI , TAKAHASHI MASANORI , NIIBORI KENJI , OHSAWA SEIJI
Abstract: A display apparatus and an assembly of a driving circuit for the display apparatus having a display device, a film carrier with a lead to transfer a signal for driving the display device, and a bus board to supply a signal to the lead. A dummy lead is provided along the outside of each of an input side outer lead and an output side outer lead of the film carrier. A predetermined voltage is applied to the dummy leads. The predetermined voltage value is set to a value so as not to stationarily cause a DC bias for the voltage of the outer lead on the outside.
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公开(公告)号：DE69331873T2
公开(公告)日：2002-11-14
申请号：DE69331873
申请日：1993-12-22
Applicant: CANON KK
Inventor： MORI HIDEO , TAJIMA HISAO , TAKABAYASHI HIROSHI , ITAZAWA TOSHIAKI , TAKAHASHI MASANORI , NIIBORI KENJI
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公开(公告)号：DE69623843D1
公开(公告)日：2002-10-31
申请号：DE69623843
申请日：1996-03-21
Applicant: CANON KK
Inventor： OUCHI TOSHIMICHI , TAKAHASHI MASANORI , MORI HIDEO , NIIBORI KENJI
IPC: G02F1/1333 , G02F1/13 , G02F1/133 , G02F1/1345 , H05K1/00 , H05K1/02 , H05K3/36
Abstract: A printed circuit board (16) comprises a plurality of board layers (61,62,63) and a plurality of wiring layers (65,66,67) both of which are laminated. When a wiring pattern (67) is disposed at one side against the center line, a dummy wiring pattern (70) is formed at the place substantially symmetrical to the position where the wiring pattern (67) is disposed to suppress a warp of the printed circuit board (16) caused by temperature changes and to ease connection work between the printed circuit board and units, such as TABs (5) for driving liquid crystal.
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