Abstract:
Provided are a coplanar structure thin film transistor that allows a threshold voltage to change only a little under electric stress, and a method of manufacturing the same. The thin film transistor includes on a substrate at least: a gate electrode; a gate insulating layer; an oxide semiconductor layer including a source electrode, a drain electrode, and a channel region; a channel protection layer; and an interlayer insulating layer. The channel protection layer includes one or more layers, the layer in contact with the oxide semiconductor layer among the one or more layers being made of an insulating material containing oxygen, ends of the channel protection layer are thinner than a central part of the channel protection layer, the interlayer insulating layer contains hydrogen, and regions of the oxide semiconductor layer that are in direct contact with the interlayer insulating layer form the source electrode and the drain electrode.
Abstract:
Provided is a piezoelectric material having high Curie temperature, high insulation property, and high piezoelectric performance, the piezoelectric material including a perovskite-type metal oxide represented by the general formula (1): xBaTiO3-yBiFeO3-zBi(M0.5Ti0.5)O3, where M represents at least one kind of element selected from the group consisting of Mg, Ni, and Zn, x represents a value satisfying 0.25
Abstract translation:提供具有高居里温度,高绝缘性和高压电性能的压电材料,压电材料包括由通式(1)表示的钙钛矿型金属氧化物:xBaTiO3-yBiFeO3-zBi(M0.5Ti0.5) O 3,其中M表示选自Mg,Ni和Zn中的至少一种元素,x表示满足0.25 <= x <= 0.75的值,y表示满足0.15 <= y <0.73的值, 并且z表示满足0.02 <= z <= 0.60的值,条件是其中钙钛矿型金属氧化物含有V的x + y + z = 1,V的含量为0.0005摩尔以上且0.0050摩尔, 相对于1摩尔钙钛矿型金属氧化物较小。 此外,提供了使用压电材料的压电元件,排液头,超声波马达和除尘装置。
Abstract:
A method for manufacturing a field-effect transistor is provided. The field-effect transistor includes on a substrate a source electrode, a drain electrode, an oxide semiconductor layer, an insulating layer and a gate electrode. The method includes, after forming the insulating layer on the oxide semiconductor layer, an annealing step of increasing the electrical conductivity of the oxide semiconductor layers by annealing in an atmosphere containing moisture. The steam pressure at the annealing step is higher than the saturated vapor pressure in the atmosphere at the annealing temperature.
Abstract:
Provided is an oxide semiconductor device including an oxide semiconductor layer and an insulating layer coming into contact with the oxide semiconductor layer in which the insulating layer includes: a first insulating layer coming into contact with an oxide semiconductor, having a thickness of 50 nm or more, and including an oxide containing Si and O; a second insulating layer coming into contact with the first insulating layer, having a thickness of 50 nm or more, and including a nitride containing Si and N; and a third insulating layer coming into contact with the second insulating layer, the first insulating layer and the second insulating layer having hydrogen contents of 4×1021 atoms/cm3 or less, and the third insulating layer having a hydrogen content of more than 4×1021 atoms/cm3.
Abstract:
Método de fabricación de un transistor de película fina de tipo puerta inferior que utiliza un semiconductor de óxido amorfo InxGayZnz como capa de canal, en el que el semiconductor de óxido amorfo contiene In, Ga y Zn en una proporción atómica de InxGayZnz, la densidad de masa M [g/cm3] del semiconductor de óxido amorfo satisface la expresión (1) siguiente: M ³ 0,94 x (7,121x + 5,941y + 5,675z)/(x+y+z) (1) en la que 0