公开(公告)号：AU5224499A

公开(公告)日：2001-02-13

申请号：AU5224499

申请日：1999-07-21

Applicant: CASCADE MICROTECH INC

Inventor： REED GLEASON K ,  SMITH KENNETH A ,  BAYNE MICHAEL A ,  LESHER TIMOTHY ,  KOXXY MARTIN

IPC: H01L21/66 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  B24B29/00

Abstract: A substrate (200), preferably constructed of a ductile material and a tool (210) having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression (216) can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

公开(公告)号：EP1210208A4

公开(公告)日：2005-07-06

申请号：EP99937404

申请日：1999-07-21

Applicant: CASCADE MICROTECH INC

Inventor： REED GLEASON K ,  SMITH KENNETH A ,  BAYNE MICHAEL A ,  LESHER TIMOTHY ,  KOXXY MARTIN

IPC: H01L21/66 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  B24B29/00

CPC classification number: G01R1/06744 ,  G01R1/0735 ,  G01R3/00

Abstract: A substrate (200), preferably constructed of a ductile material and a tool (210) having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression (216) can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.