公开(公告)号：WO2004044949A3

公开(公告)日：2004-10-14

申请号：PCT/US0333842

申请日：2003-10-24

Applicant: CASCADE MICROTECH INC ,  LESHER TIMOTHY ,  MILLER BRAD ,  COWAN CLARENCE E ,  SIMMONS MICHAEL ,  GRAY FRANK ,  MCDONALD CYNTHIA L

Inventor： LESHER TIMOTHY ,  MILLER BRAD ,  COWAN CLARENCE E ,  SIMMONS MICHAEL ,  GRAY FRANK ,  MCDONALD CYNTHIA L

IPC: G01R1/18 ,  G01R31/28 ,  H01B7/18

CPC classification number: G01R1/18 ,  G01R19/0053 ,  G01R31/2886 ,  G01R31/2889 ,  H01B11/206

Abstract: A cable (30) includes an inner conductor (50), an inner dielectric (52), and a guard conductor (56), where the inner dielectric (52) is between the inner conductor (50) and the guard conductor (56). The cable also includes an outer dielectric (58), and a shield conductor (62), where the outer dielectric (58) is between the guard conductor (56) and the shield conductor (62). The cable further includes an additional layer of material between the outer dielectric and the shield conductor (30) of suitable composition for reducing triboelectric current generation between the outer dielectric (58) and the shield conductor (62) to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.

Abstract translation: 电缆（30）包括内部导体（50），内部电介质（52）和保护导体（56），其中内部电介质（52）在内部导体（50）和保护导体（56）之间， 。 电缆还包括外部电介质（58）和屏蔽导体（62），其中外部电介质（58）在保护导体（56）和屏蔽导体（62）之间。 电缆还包括在外部电介质和屏蔽导体（30）之间的适当组合物的附加材料层，用于减少外部电介质（58）和屏蔽导体（62）之间产生的摩擦电流，小于将发生的摩擦电流 外部电介质和屏蔽导体彼此直接相连。

公开(公告)号：AU5224499A

公开(公告)日：2001-02-13

申请号：AU5224499

申请日：1999-07-21

Applicant: CASCADE MICROTECH INC

Inventor： REED GLEASON K ,  SMITH KENNETH A ,  BAYNE MICHAEL A ,  LESHER TIMOTHY ,  KOXXY MARTIN

IPC: H01L21/66 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  B24B29/00

Abstract: A substrate (200), preferably constructed of a ductile material and a tool (210) having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression (216) can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

公开(公告)号：AU2003291650A8

公开(公告)日：2004-06-03

申请号：AU2003291650

申请日：2003-10-24

Applicant: CASCADE MICROTECH INC

Inventor： MILLER BRAD ,  MCDONALD CYNTHIA L ,  COWAN CLARENCE E ,  GRAY FRANK ,  LESHER TIMOTHY ,  SIMMONS MICHAEL

IPC: G01R1/18 ,  G01R31/28 ,  H01B7/18

Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.

公开(公告)号：AU2003291650A1

公开(公告)日：2004-06-03

申请号：AU2003291650

申请日：2003-10-24

Applicant: CASCADE MICROTECH INC

Inventor： SIMMONS MICHAEL ,  GRAY FRANK ,  MCDONALD CYNTHIA L ,  LESHER TIMOTHY ,  MILLER BRAD ,  COWAN CLARENCE E

IPC: G01R1/18 ,  G01R31/28

Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.

公开(公告)号：EP1559116A4

公开(公告)日：2007-05-02

申请号：EP03768538

申请日：2003-10-24

Applicant: CASCADE MICROTECH INC

Inventor： LESHER TIMOTHY ,  MILLER BRAD ,  COWAN CLARENCE E ,  SIMMONS MICHAEL ,  GRAY FRANK ,  MCDONALD CYNTHIA L

IPC: H01B7/18 ,  G01R1/18 ,  G01R31/28 ,  G01R31/316

CPC classification number: G01R1/18 ,  G01R19/0053 ,  G01R31/2886 ,  G01R31/2889 ,  H01B11/206

Abstract: A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.

公开(公告)号：EP1210208A4

公开(公告)日：2005-07-06

申请号：EP99937404

申请日：1999-07-21

Applicant: CASCADE MICROTECH INC

Inventor： REED GLEASON K ,  SMITH KENNETH A ,  BAYNE MICHAEL A ,  LESHER TIMOTHY ,  KOXXY MARTIN

IPC: H01L21/66 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  B24B29/00

CPC classification number: G01R1/06744 ,  G01R1/0735 ,  G01R3/00

Abstract: A substrate (200), preferably constructed of a ductile material and a tool (210) having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression (216) can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.