公开(公告)号：US20230187378A1

公开(公告)日：2023-06-15

申请号：US17988846

申请日：2022-11-17

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Shrane-Ning Jenq ,  Chen-Yu Wang ,  Chin-Tang Hsieh ,  Shu-Yeh Chang ,  Lung-Hua Ho

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/49811 ,  H01L21/561

Abstract: In a method of manufacturing a semiconductor package, at least one conductive wire is formed on a substrate in a wire bonding process, a ball end of the conductive wire is located above the substrate, a molding material is provided to cover the conductive wire except the ball end, and an EMI shielding layer is formed on the molding material to connect to the ball end. Owing to the ball end is exposed on the molding material, connection area of the EMI shielding layer to the conductive wire is increased to improve connection strength and reliability between the EMI shielding layer and the conductive wire.