公开(公告)号：WO2014159368A1

公开(公告)日：2014-10-02

申请号：PCT/US2014/023239

申请日：2014-03-11

Applicant: CISCO TECHNOLOGY, INC.

Inventor： MASS, James A. ,  ARTMAN, David Lynn ,  FRANK, Timothy A.

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0204 ,  B23K1/0016 ,  B23K2201/36 ,  H05K1/0243 ,  H05K3/0061 ,  H05K2201/0959 ,  H05K2201/10416 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: In one embodiment, a printed circuit board (PCB) assembly (522) includes a PCB (504), the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement (562) and a surface mount component (524). The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion (566) and a second portion (570, 574). At least a part of the first portion is positioned in the through-hole, and the second portion is coupled (578, 530) to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion (526b).

Abstract translation: 在一个实施例中，印刷电路板（PCB）组件（522）包括PCB（504），PCB布置成在其中限定通孔，通孔具有表面，其中PCB包括顶表面和 底面。 PCB组件还包括块状结构（562）和表面安装部件（524）。 芯块布置由导电和导热材料形成，并且至少包括第一部分（566）和第二部分（570,574）。 第一部分的至少一部分位于通孔中，并且第二部分（578,530）连接到底表面。 表面安装部件定位在通孔和顶表面上方，并且具有被配置为接触第一部分（526b）的第一表面。

公开(公告)号：EP2974563B1

公开(公告)日：2019-11-13

申请号：EP14719133.2

申请日：2014-03-11

Applicant: Cisco Technology, Inc.

Inventor： MASS, James A. ,  ARTMAN, David Lynn ,  FRANK, Timothy A.

IPC: H05K1/02 ,  H05K3/00