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    ELECTRONICALLY STEERABLE ANTENNA ARRAY
    1.
    发明申请
    ELECTRONICALLY STEERABLE ANTENNA ARRAY 审中-公开

    公开(公告)号：WO2021091763A1

    公开(公告)日：2021-05-14

    申请号：PCT/US2020/057947

    申请日：2020-10-29

    Applicant: CISCO TECHNOLOGY, INC.

    Inventor： ANDERSON, Fred J. ,  BANE, Danielle N. ,  BLOSCO, John M. ,  STAGER, Paul J. ,  JOHNSON, Daniel N. ,  FRANK, Timothy A. ,  SWARTZ, John M.

    IPC: H04B7/0491 ,  H01Q3/34 ,  H01Q25/00 ,  H04B7/06 ,  H01Q1/24

    Abstract: An electronically a steerable and switchable antenna array is provided that can produce a first beam with a first coverage range and a second beam with a second coverage range by selecting one of a first and a second beamwidth for both the first and second beams; in response to selecting the first beamwidth: switching signal inputs to narrow-beam antenna arrays; steering the first beam to one of a first positive, negative, or zero offset position; independently steering the second beam to one of a second positive, negative offset, or zero offset position; and transmitting signals received from the signal inputs via the first beam and the second beam; and in response to selecting the second beamwidth: switching signal inputs to wide-beam antenna arrays; and transmitting signals received from the signal inputs via the first beam and the second beam.

    GROUND AND HEAT TRANSFER INTERFACE ON A PRINTED CIRCUIT BOARD
    2.
    发明申请
    GROUND AND HEAT TRANSFER INTERFACE ON A PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板上的接地和热传递接口

    公开(公告)号：WO2014159368A1

    公开(公告)日：2014-10-02

    申请号：PCT/US2014/023239

    申请日：2014-03-11

    Applicant: CISCO TECHNOLOGY, INC.

    Inventor： MASS, James A. ,  ARTMAN, David Lynn ,  FRANK, Timothy A.

    IPC: H05K1/02 ,  H05K3/00

    CPC classification number: H05K1/0204 ,  B23K1/0016 ,  B23K2201/36 ,  H05K1/0243 ,  H05K3/0061 ,  H05K2201/0959 ,  H05K2201/10416 ,  Y10T29/49128 ,  Y10T29/49165

    Abstract: In one embodiment, a printed circuit board (PCB) assembly (522) includes a PCB (504), the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement (562) and a surface mount component (524). The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion (566) and a second portion (570, 574). At least a part of the first portion is positioned in the through-hole, and the second portion is coupled (578, 530) to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion (526b).

    Abstract translation: 在一个实施例中，印刷电路板（PCB）组件（522）包括PCB（504），PCB布置成在其中限定通孔，通孔具有表面，其中PCB包括顶表面和 底面。 PCB组件还包括块状结构（562）和表面安装部件（524）。 芯块布置由导电和导热材料形成，并且至少包括第一部分（566）和第二部分（570,574）。 第一部分的至少一部分位于通孔中，并且第二部分（578,530）连接到底表面。 表面安装部件定位在通孔和顶表面上方，并且具有被配置为接触第一部分（526b）的第一表面。

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