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公开(公告)号：US20150322298A1
公开(公告)日：2015-11-12
申请号：US14652050
申请日：2013-12-13
Applicant: CONPART AS
Inventor： Helge Kristiansen , Keith Redford , Tore Helland , Jakob Gakkestad , Ottar Opland
CPC classification number: C09J9/02 , B29D7/01 , B29K2063/00 , B29K2105/0097 , B29K2105/16 , B29K2501/00 , B29K2505/14 , B29K2995/0005 , C08K7/16 , C08K9/12 , C09J7/401 , C09J11/00 , C23C18/1635 , C23C18/285 , C23C18/30 , C23C18/44 , H01B1/22 , H05K3/321 , H05K3/323 , H05K2201/0221 , H05K2203/013 , Y10T428/1405
Abstract: A method of applying a conductive adhesive comprising: using a conductive adhesive 18 made up of conductive beads 12 in an adhesive matrix 8, the conductive beads comprising a polymer core and a conductive coating and having a maximum dimension of 100 μm or less; and depositing droplets of the adhesive 18 on a substrate via a nozzle 20.
Abstract translation: 一种施加导电粘合剂的方法，包括：使用由粘合剂基体8中的导电珠12构成的导电粘合剂18，所述导电珠包含聚合物芯和导电涂层，并且具有100μm或更小的最大尺寸; 以及经由喷嘴20将粘合剂18的液滴沉积在基底上。
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Patent Agency Ranking
公开(公告)号：US10344189B2
公开(公告)日：2019-07-09
申请号：US14414145
申请日：2013-07-12
Applicant: CONPART AS
Inventor： Keith Redford , Helge Kristiansen
Abstract: A conductive adhesive, such as an anisotropic conductive adhesive, comprising a population of conductive particles and a population of signal particles in an adhesive; wherein both the conductive particle population and the signal particle population have an average particle diameter of
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公开(公告)号：US09758702B2
公开(公告)日：2017-09-12
申请号：US13904244
申请日：2013-05-29
Applicant: Conpart AS
Inventor： Helge Kristiansen , Keith Redford , Tore Helland
CPC classification number: C09J9/02 , C08K9/10 , H01B1/22 , H01R4/04 , Y10T428/249921 , Y10T428/254
Abstract: An isotropic conductive adhesive having silver coated polymer beads within an adhesive matrix and a method of forming an isotropic conductive adhesive are disclosed. The mean average diameter of the polymer cores of the beads is less than 30 μm, and the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads.
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4.发明申请BRIDGING ARRANGEMENT, MICROELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING A BRIDGING ARRANGEMENT 审中-公开桥梁布置，微电子组件和制造桥梁布置方法公开(公告)号：US20160126202A1
公开(公告)日：2016-05-05
申请号：US14880648
申请日：2015-10-12
Applicant: International Business Machines Corporation , Conpart AS , Intrinsiq Materials Ltd. , Jerzy Haber Institute of Catalysis and Surface Chemistry
Inventor： Thomas J. Brunschwiler , Brian Burg , Richard Dixon , Helge Kristiansen , Piotr Warszynski , Jonas Zuercher
IPC: H01L23/00
CPC classification number: H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/11524 , H01L2224/73204 , H01L2224/81002 , H01L2224/818 , H01L2224/92125 , H01L2924/00012
Abstract: A bridging arrangement includes a first and a second surface defining a gap therebetween. At least one surface of the first and second surface has an anisotropic energy landscape. A plurality of particles defines a path between the first and second surface bridging the gap.
Abstract translation: 桥接装置包括限定其间的间隙的第一表面和第二表面。 第一和第二表面的至少一个表面具有各向异性能量景观。 多个颗粒限定桥接间隙的第一和第二表面之间的路径。
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公开(公告)号：US20150175851A1
公开(公告)日：2015-06-25
申请号：US14414145
申请日：2013-07-12
Applicant: CONPART AS
Inventor： Keith Redford , Helge Kristiansen
CPC classification number: C09J9/02 , B32B41/00 , B32B2307/202 , H01R4/04 , Y10T428/25
Abstract: A conductive adhesive, such as an anisotropic conductive adhesive, comprising a population of conductive particles and a population of signal particles in an adhesive; wherein both the conductive particle population and the signal particle population have an average particle diameter of
Abstract translation: 导电粘合剂，例如各向异性导电粘合剂，其包含一组导电颗粒和一组粘合剂中的信号颗粒; 其中导电粒子群和信号粒子群均具有<200μm的平均粒径，方差系数<10％; 其中所述信号颗粒被布置成当它们变形到预定高度时提供指示; 并且其中所述导电颗粒被布置成使得它们不会失效，例如， 当变形到高于或等于设置信号颗粒以提供指示的预定高度的高度时的裂纹或断裂。
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公开(公告)号：US20130323501A1
公开(公告)日：2013-12-05
申请号：US13904244
申请日：2013-05-29
Applicant: Conpart AS
Inventor： Helge Kristiansen , Keith Redford , Tore Helland
IPC: C09J9/02
CPC classification number: C09J9/02 , C08K9/10 , H01B1/22 , H01R4/04 , Y10T428/249921 , Y10T428/254
Abstract: An isotropic conductive adhesive having silver coated polymer beads within an adhesive matrix and a method of forming an isotropic conductive adhesive are disclosed. The mean average diameter of the polymer cores of the beads is less than 30 μm, and the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads.
Abstract translation: 公开了一种在粘合剂基质内具有银涂覆的聚合物珠粒的各向同性导电粘合剂和形成各向同性导电粘合剂的方法。 珠的聚合物芯的平均直径小于30μm，并且银涂层包含从分散的成核位点生长的互连银沉积物，分散在珠的表面上。
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