ISOTROPIC CONDUCTIVE ADHESIVE
    3.
    发明申请
    ISOTROPIC CONDUCTIVE ADHESIVE 有权
    等电导体粘合剂

    公开(公告)号:US20130323501A1

    公开(公告)日:2013-12-05

    申请号:US13904244

    申请日:2013-05-29

    Applicant: Conpart AS

    Abstract: An isotropic conductive adhesive having silver coated polymer beads within an adhesive matrix and a method of forming an isotropic conductive adhesive are disclosed. The mean average diameter of the polymer cores of the beads is less than 30 μm, and the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads.

    Abstract translation: 公开了一种在粘合剂基质内具有银涂覆的聚合物珠粒的各向同性导电粘合剂和形成各向同性导电粘合剂的方法。 珠的聚合物芯的平均直径小于30μm,并且银涂层包含从分散的成核位点生长的互连银沉积物,分散在珠的表面上。

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