-
公开(公告)号:US20150322298A1
公开(公告)日:2015-11-12
申请号:US14652050
申请日:2013-12-13
Applicant: CONPART AS
Inventor: Helge Kristiansen , Keith Redford , Tore Helland , Jakob Gakkestad , Ottar Opland
CPC classification number: C09J9/02 , B29D7/01 , B29K2063/00 , B29K2105/0097 , B29K2105/16 , B29K2501/00 , B29K2505/14 , B29K2995/0005 , C08K7/16 , C08K9/12 , C09J7/401 , C09J11/00 , C23C18/1635 , C23C18/285 , C23C18/30 , C23C18/44 , H01B1/22 , H05K3/321 , H05K3/323 , H05K2201/0221 , H05K2203/013 , Y10T428/1405
Abstract: A method of applying a conductive adhesive comprising: using a conductive adhesive 18 made up of conductive beads 12 in an adhesive matrix 8, the conductive beads comprising a polymer core and a conductive coating and having a maximum dimension of 100 μm or less; and depositing droplets of the adhesive 18 on a substrate via a nozzle 20.
Abstract translation: 一种施加导电粘合剂的方法,包括:使用由粘合剂基体8中的导电珠12构成的导电粘合剂18,所述导电珠包含聚合物芯和导电涂层,并且具有100μm或更小的最大尺寸; 以及经由喷嘴20将粘合剂18的液滴沉积在基底上。
-
公开(公告)号:US09758702B2
公开(公告)日:2017-09-12
申请号:US13904244
申请日:2013-05-29
Applicant: Conpart AS
Inventor: Helge Kristiansen , Keith Redford , Tore Helland
CPC classification number: C09J9/02 , C08K9/10 , H01B1/22 , H01R4/04 , Y10T428/249921 , Y10T428/254
Abstract: An isotropic conductive adhesive having silver coated polymer beads within an adhesive matrix and a method of forming an isotropic conductive adhesive are disclosed. The mean average diameter of the polymer cores of the beads is less than 30 μm, and the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads.
-
公开(公告)号:US20130323501A1
公开(公告)日:2013-12-05
申请号:US13904244
申请日:2013-05-29
Applicant: Conpart AS
Inventor: Helge Kristiansen , Keith Redford , Tore Helland
IPC: C09J9/02
CPC classification number: C09J9/02 , C08K9/10 , H01B1/22 , H01R4/04 , Y10T428/249921 , Y10T428/254
Abstract: An isotropic conductive adhesive having silver coated polymer beads within an adhesive matrix and a method of forming an isotropic conductive adhesive are disclosed. The mean average diameter of the polymer cores of the beads is less than 30 μm, and the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads.
Abstract translation: 公开了一种在粘合剂基质内具有银涂覆的聚合物珠粒的各向同性导电粘合剂和形成各向同性导电粘合剂的方法。 珠的聚合物芯的平均直径小于30μm,并且银涂层包含从分散的成核位点生长的互连银沉积物,分散在珠的表面上。
-
-