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公开(公告)号：AT506686T
公开(公告)日：2011-05-15
申请号：AT06838444
申请日：2006-11-27
Applicant: CORNING INC
Inventor： BECKEN KEITH J , LOGUNOV STEPHAN L , ZHANG AIYU , BAYNE JOHN
Abstract: A method for manufacturing a hermetically sealed package is provided, using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates.
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